TMS320DM8168ACYG2
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Texas Instruments TMS320DM8168ACYG2

Manufacturer No:
TMS320DM8168ACYG2
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DGTL MEDIA PROCESSR 1031FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TMS320DM8168ACYG2 is a high-performance Digital Media System-on-Chip (DMSoC) developed by Texas Instruments. This device is part of the DaVinci family and is designed to meet the demanding requirements of various multimedia applications. It integrates a powerful ARM Cortex-A8 RISC processor and a C674x VLIW DSP, along with multiple high-definition video and imaging coprocessors (HDVICP2). This multi-core architecture enables robust processing for video encode, decode, transcode, and other multimedia tasks. The device also features a comprehensive set of peripherals and interfaces, making it suitable for a wide range of applications including video security, video conferencing, media servers, and digital signage.

Key Specifications

Parameter Specification
Processor Cores ARM Cortex-A8 RISC Processor, C674x VLIW DSP
Processor Speed Up to 1.2 GHz (ARM), Up to 1 GHz (DSP)
On-Chip Memory 1.5 MB (including 256 KB L2 Cache and 512 KB OCMC)
Non-Volatile Memory 48 kB ROM
Package Type 1031-BFBGA, FCBGA (25x25 mm)
Voltage - Core 1.0 V
Voltage - I/O 1.5 V, 1.8 V, 3.3 V
Operating Temperature 0°C ~ 95°C (TJ)
Interfaces EBI/EMI, Ethernet, I²C, McASP, McBSP, PCI, SATA, SD/SDIO, SPI, UART, USB

Key Features

  • Multi-core architecture with ARM Cortex-A8 and C674x VLIW DSP cores.
  • Up to three high-definition video and imaging coprocessors (HDVICP2) for advanced video processing.
  • Support for high-definition video encode, decode, transcode, and transrate operations.
  • Integrated SGX530 3D graphics engine (available on TMS320DM8168) for sophisticated GUIs.
  • Comprehensive peripheral set including Ethernet, SATA, USB, and various serial interfaces.
  • Efficient power management and energy-efficient operation.
  • Surface mount package with Via Channel technology for reduced PCB costs.

Applications

  • Video security and surveillance systems.
  • Video conferencing and infrastructure.
  • Media servers and digital signage.
  • Digital video recorders and other multimedia devices.
  • Robust industrial applications requiring high-performance multimedia processing.

Q & A

  1. What is the TMS320DM8168ACYG2?

    The TMS320DM8168ACYG2 is a high-performance Digital Media System-on-Chip (DMSoC) developed by Texas Instruments.

  2. What processor cores does it include?

    It includes an ARM Cortex-A8 RISC processor and a C674x VLIW DSP core.

  3. What are the key video processing capabilities of this device?

    The device supports high-definition video encode, decode, transcode, and transrate operations, and it includes up to three HDVICP2 coprocessors.

  4. What is the maximum processing speed of the ARM and DSP cores?

    The ARM Cortex-A8 core can operate up to 1.2 GHz, and the C674x DSP core can operate up to 1 GHz.

  5. What type of package does the TMS320DM8168ACYG2 use?

    The device is packaged in a 1031-BFBGA or FCBGA (25x25 mm) package.

  6. What are the supported interfaces on this device?

    The device supports EBI/EMI, Ethernet, I²C, McASP, McBSP, PCI, SATA, SD/SDIO, SPI, UART, and USB interfaces.

  7. What is the operating temperature range of the TMS320DM8168ACYG2?

    The operating temperature range is 0°C ~ 95°C (TJ).

  8. What are some typical applications for this device?

    Typical applications include video security, video conferencing, media servers, digital signage, and digital video recorders.

  9. Does the device support 3D graphics?

    Yes, the TMS320DM8168 device includes an SGX530 3D graphics engine for sophisticated GUIs.

  10. What is the benefit of the Via Channel technology in the package design?

    The Via Channel technology reduces PCB costs by allowing the use of 0.8-mm pitch PCB feature sizes and enabling PCB routing in only two signal layers.

Product Attributes

Type:Digital Media System-on-Chip (DMSoC)
Interface:EBI/EMI, Ethernet, I²C, McASP, McBSP, PCI, Serial ATA, SD/SDIO, SPI, UART, USB
Clock Rate:1GHz DSP, 1.2GHz ARM®
Non-Volatile Memory:ROM (48kB)
On-Chip RAM:1.5MB
Voltage - I/O:1.5V, 1.8V, 3.3V
Voltage - Core:1.00V
Operating Temperature:0°C ~ 95°C (TJ)
Mounting Type:Surface Mount
Package / Case:1031-BFBGA, FCBGA
Supplier Device Package:1031-FCBGA (25x25)
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Similar Products

Part Number TMS320DM8168ACYG2 TMS320DM8168CCYG2 TMS320DM8168SCYG2 TMS320DM8168BCYG2
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Obsolete Active Active Obsolete
Type Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC)
Interface EBI/EMI, Ethernet, I²C, McASP, McBSP, PCI, Serial ATA, SD/SDIO, SPI, UART, USB EBI/EMI, Ethernet, I²C, McASP, McBSP, PCI, Serial ATA, SD/SDIO, SPI, UART, USB EBI/EMI, Ethernet, I²C, McASP, McBSP, PCI, Serial ATA, SD/SDIO, SPI, UART, USB EBI/EMI, Ethernet, I²C, McASP, McBSP, PCI, Serial ATA, SD/SDIO, SPI, UART, USB
Clock Rate 1GHz DSP, 1.2GHz ARM® 1GHz DSP, 1.2GHz ARM® 1GHz DSP, 1.2GHz ARM® 1GHz DSP, 1.2GHz ARM®
Non-Volatile Memory ROM (48kB) ROM (48kB) ROM (48kB) ROM (48kB)
On-Chip RAM 1.5MB 1.5MB 1.5MB 1.5MB
Voltage - I/O 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V
Voltage - Core 1.00V 1.00V 1.00V 1.00V
Operating Temperature 0°C ~ 95°C (TJ) -40°C ~ 105°C (TJ) 0°C ~ 95°C (TJ) 0°C ~ 95°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 1031-BFBGA, FCBGA 1031-BFBGA, FCBGA 1031-BFBGA, FCBGA 1031-BFBGA, FCBGA
Supplier Device Package 1031-FCBGA (25x25) 1031-FCBGA (25x25) 1031-FCBGA (25x25) 1031-FCBGA (25x25)

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