TMS320DM8147SCYE0
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Texas Instruments TMS320DM8147SCYE0

Manufacturer No:
TMS320DM8147SCYE0
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DGTL MEDIA PROCESSR 684FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TMS320DM8147SCYE0, part of the TMS320DM814x DaVinci video processors family, is a highly integrated and programmable platform developed by Texas Instruments. This device leverages the DaVinci processor technology to meet the processing needs of various high-performance applications. It combines robust operating systems support, rich user interfaces, and high processing performance, making it ideal for Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly bring advanced devices to market.

Key Specifications

Specification Details
Processor Cores Up to 1-GHz ARM® Cortex®-A8 RISC Core, Up to 750-MHz C674x™ VLIW DSP
Performance Up to 6000 MIPS and 4500 MFLOPS
Memory 32KB of Instruction and Data Caches, 512KB of L2 Cache, 64KB of RAM, 48KB of Boot ROM, 256KB of L2 Unified Mapped RAM/Caches with ECC
Memory Interfaces Dual DDR2/DDR3 SDRAM Interfaces, Supports up to DDR2-800 and DDR3-1066, Up to 2GB of Total Address Space
Operating Temperature 0°C ~ 90°C (TJ)
Voltage Core: 1.1V, 1.2V, 1.35V; I/O: 1.5V, 1.8V, 3.3V
Package 684-Pin Pb-Free BGA Package (CYE Suffix), 0.8-mm Ball Pitch
Technology 45-nm CMOS Technology

Key Features

  • High-Performance DaVinci Video Processors with ARM Cortex-A8 and C674x VLIW DSP cores
  • Supports Integer and Floating Point operations, including Neon™ Multimedia Architecture
  • Programmable High-Definition Video Image Coprocessing (HDVICP v2) Engine for encode, decode, and transcode operations
  • SGX530 3D Graphics Engine delivering up to 25 MPoly/sec, with support for Direct3D Mobile, OpenGLES 1.1 and 2.0, OpenVG 1.0, and OpenMax API
  • Dual 165-MHz, 2-channel HD Video Capture and Display Modules, with advanced video processing features
  • Dual USB 2.0 Ports with integrated PHYs, and one PCI Express 2.0 Port with integrated PHY
  • Enhanced Direct Memory Access (EDMA) Controller with 64 independent DMA channels and 8 independent QDMA channels
  • Dual Controller Area Network (DCAN) modules, and multiple serial interfaces including SPI, I2C, and UARTs

Applications

  • HD Video Conferencing - Skype endpoints
  • Video Surveillance DVRs and IP Netcam
  • Digital Signage and Media Players and Adapters
  • Mobile Medical Imaging and Network Projectors
  • Home Audio and Video Equipment

Q & A

  1. What are the main processor cores of the TMS320DM8147SCYE0?

    The device features an up to 1-GHz ARM® Cortex®-A8 RISC Core and an up to 750-MHz C674x™ VLIW DSP core.

  2. What is the performance capability of the TMS320DM8147SCYE0?

    The device can achieve up to 6000 MIPS and 4500 MFLOPS.

  3. What memory configurations are available on the TMS320DM8147SCYE0?

    The device includes 32KB of Instruction and Data Caches, 512KB of L2 Cache, 64KB of RAM, 48KB of Boot ROM, and 256KB of L2 Unified Mapped RAM/Caches with ECC.

  4. What are the operating temperature and voltage ranges for the TMS320DM8147SCYE0?

    The operating temperature range is 0°C ~ 90°C (TJ), and the voltage ranges are Core: 1.1V, 1.2V, 1.35V; I/O: 1.5V, 1.8V, 3.3V.

  5. What package type and technology does the TMS320DM8147SCYE0 use?

    The device is packaged in a 684-Pin Pb-Free BGA Package (CYE Suffix) with 0.8-mm ball pitch, using 45-nm CMOS Technology.

  6. What are some of the key features of the HDVICP v2 Engine in the TMS320DM8147SCYE0?

    The HDVICP v2 Engine supports encode, decode, and transcode operations for various video codecs including H.264, MPEG-2, VC-1, MPEG-4, SP/ASP, and JPEG/MJPEG.

  7. What 3D graphics capabilities does the TMS320DM8147SCYE0 offer?

    The device includes an SGX530 3D Graphics Engine delivering up to 25 MPoly/sec, with support for Direct3D Mobile, OpenGLES 1.1 and 2.0, OpenVG 1.0, and OpenMax API.

  8. What are the main applications for the TMS320DM8147SCYE0?

    The device is suitable for HD Video Conferencing, Video Surveillance, Digital Signage, Mobile Medical Imaging, Network Projectors, and Home Audio and Video Equipment.

  9. Does the TMS320DM8147SCYE0 support industrial Ethernet protocols?

    Yes, it supports IEEE 1588 Time-Stamping and Industrial Ethernet Protocols through its dual port Ethernet interface.

  10. What kind of development tools are available for the TMS320DM8147SCYE0?

    The device comes with a complete set of development tools including C compilers, a DSP assembly optimizer, and a Microsoft® Windows® debugger interface.

Product Attributes

Type:Digital Media System-on-Chip (DMSoC)
Interface:CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB
Clock Rate:600MHz DSP, 720MHz ARM®
Non-Volatile Memory:ROM (48kB)
On-Chip RAM:1.08MB
Voltage - I/O:1.5V, 1.8V, 3.3V
Voltage - Core:1.1V, 1.2V, 1.35V
Operating Temperature:0°C ~ 90°C (TJ)
Mounting Type:Surface Mount
Package / Case:684-BFBGA, FCBGA
Supplier Device Package:684-FCBGA (23x23)
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Similar Products

Part Number TMS320DM8147SCYE0 TMS320DM8147SCYE2 TMS320DM8147SCYE1 TMS320DM8148SCYE0 TMS320DM8127SCYE0 TMS320DM8147BCYE0
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Active Obsolete
Type Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC)
Interface CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB CAN, Ethernet, I²C, McASP, McBSP, MMC/SD, SPI, UART, USB CAN, Ethernet, I²C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB
Clock Rate 600MHz DSP, 720MHz ARM® 700MHz DSP, 1GHz ARM® 700MHz DSP, 1GHz ARM® 600MHz DSP, 720MHz ARM® 500MHz DSP, 600MHz ARM® 600MHz DSP, 720MHz ARM®
Non-Volatile Memory ROM (48kB) ROM (48kB) ROM (48kB) ROM (48kB) ROM (48kB) ROM (48kB)
On-Chip RAM 1.08MB 1.08MB 1.08MB 1.08MB 832kB 1.08MB
Voltage - I/O 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V 1.5V, 1.8V, 3.3V
Voltage - Core 1.1V, 1.2V, 1.35V 1.1V, 1.2V, 1.35V 1.1V, 1.2V, 1.35V 1.1V, 1.2V, 1.35V 1.15V 1.1V, 1.2V, 1.35V
Operating Temperature 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 684-BFBGA, FCBGA 684-BFBGA, FCBGA 684-BFBGA, FCBGA 684-BFBGA, FCBGA 684-BFBGA, FCBGA 684-BFBGA, FCBGA
Supplier Device Package 684-FCBGA (23x23) 684-FCBGA (23x23) 684-FCBGA (23x23) 684-FCBGA (23x23) 684-FCBGA (23x23) 684-FCBGA (23x23)

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