Overview
The TMS320DM6467TCUTL1, developed by Texas Instruments, is a high-performance Digital Media System-on-Chip (DMSoC) that leverages TI's DaVinci™ technology. This dual-core processor integrates a TMS320C64x+™ DSP core and an ARM926EJ-S core, providing the benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies. The DM6467T is designed to meet the networked media encode and decode processing needs of next-generation embedded devices, enabling OEMs and ODMs to quickly bring to market devices with robust operating systems support, rich user interfaces, high processing performance, and long battery life.
Key Specifications
Specification | Details |
---|---|
Processor Cores | TMS320C64x+™ DSP core, ARM926EJ-S core |
Clock Rates | 1-GHz C64x+™, 500-MHz ARM926EJ-S™ |
Instructions per Cycle | Eight 32-Bit C64x+ Instructions/Cycle |
MIPS | 8000 C64x+ MIPS |
Cache and Memory | 128K-Byte L2 Unified Mapped RAM/Cache, 16K-Byte Instruction Cache, 8K-Byte Data Cache |
ALUs and Multipliers | Six ALUs (32-/40-Bit), Two Multipliers supporting four 16 x 16-Bit multiplies or eight 8 x 8-Bit multiplies per clock cycle |
General-Purpose Registers | 64 32-Bit General-Purpose Registers |
Video Interfaces | 150-MHz Video Port Interface (VPIF), Two 8-Bit SD (BT.656), Single 16-Bit HD (BT.1120), or Single Raw (8-/10-/12-Bit) Video Capture/Display Channels |
Peripheral Interfaces | 32-Bit, 66-MHz, 3.3 V PCI Master/Slave Interface, Two 64-Bit General-Purpose Timers, One 64-Bit Watch Dog Timer, Three Configurable UART/IrDA/CIR Modules |
Package | 529-Pin Pb-Free BGA Package (CUT Suffix), 0.8-mm Ball Pitch |
Process Technology | 0.09-μm/7-Level Cu Metal Process (CMOS) |
Operating Voltage | 3.3-V and 1.8-V I/O, 1.3-V Internal |
Key Features
- High-performance digital media processing with dual-core architecture combining TMS320C64x+™ DSP and ARM926EJ-S cores.
- Support for a range of encode, decode, and transcode operations including H.264, MPEG2, VC1, and MPEG4 SP/ASP.
- Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP core with eight highly independent functional units.
- High-Definition Video/Imaging Co-processor (HDVICP) and Video Data Conversion Engine (VDCE) for offloading video and imaging tasks.
- Multiple peripheral interfaces including PCI, HPI, I2C, SPI, USB2.0, and VLYNQ.
- Industrial temperature devices available.
- EmbeddedICE-RT™ logic for real-time debug and Embedded Trace Buffer™ (ETB11™) for ARM9 debug.
- Flexible PLL clock generators and individual power-saving modes for ARM/DSP.
Applications
- Video Encode/Decode/Transcode/Transrate
- Networked Media Encode/Decode
- Video Imaging
- Video Infrastructure
- Video Conferencing
- Digital Media Devices requiring high processing performance and rich user interfaces.
Q & A
- What are the core components of the TMS320DM6467T?
The TMS320DM6467T features a TMS320C64x+™ DSP core and an ARM926EJ-S core.
- What are the clock rates of the processor cores?
The C64x+™ core operates at 1 GHz, and the ARM926EJ-S core operates at 500 MHz.
- What is the MIPS rating of the C64x+™ core?
The C64x+™ core achieves 8000 MIPS.
- What type of cache and memory does the DM6467T have?
The DM6467T has 128K-Byte L2 Unified Mapped RAM/Cache, 16K-Byte Instruction Cache, and 8K-Byte Data Cache.
- What video interfaces are supported by the DM6467T?
The DM6467T supports a 150-MHz Video Port Interface (VPIF), BT.656, BT.1120, and raw video capture/display channels.
- What peripheral interfaces are available on the DM6467T?
The DM6467T includes PCI, HPI, I2C, SPI, USB2.0, and VLYNQ interfaces.
- What is the package type and pin count of the DM6467TCUTL1?
The DM6467TCUTL1 is packaged in a 529-Pin Pb-Free BGA Package (CUT Suffix) with 0.8-mm ball pitch.
- What process technology is used in the DM6467T?
The DM6467T is fabricated using 0.09-μm/7-Level Cu Metal Process (CMOS) technology.
- What are the operating voltages for the DM6467T?
The DM6467T operates with 3.3-V and 1.8-V I/O and 1.3-V internal voltage.
- What are some of the key applications for the DM6467T?
The DM6467T is suitable for video encode/decode, networked media, video imaging, video infrastructure, and video conferencing applications.