Overview
The TMS320DM6467CCUT6, produced by Texas Instruments, is a high-performance Digital Media System-on-Chip (DMSoC) that leverages TI’s DaVinci™ technology. This dual-core processor integrates a TMS320C64x+™ DSP core and an ARM926EJ-S™ core, providing a robust solution for networked media encode and decode, as well as other digital media processing needs. The DM6467 enables original equipment manufacturers (OEMs) and original design manufacturers (ODMs) to quickly develop devices with robust operating system support, rich user interfaces, high processing performance, and long battery life.
Key Specifications
| Parameter | Specification |
|---|---|
| C64x+ Clock Rate | 594 MHz, 729 MHz |
| ARM926EJ-S Clock Rate | 297 MHz, 364.5 MHz |
| L1P Program RAM/Cache | 32 KB (Direct Mapped) |
| L1D Data RAM/Cache | 32 KB (2-Way Set-Associative) |
| L2 Unified Mapped RAM/Cache | 128 KB (Flexible RAM/Cache Allocation) |
| C64x+ MIPS | Up to 5832 MIPS |
| DDR2 Memory Controller | 297 MHz (-594), 310.5 MHz (-729) |
| On-Chip Memory (ARM) | 16 KB I-cache, 8 KB D-cache, 32 KB RAM, 8 KB ROM |
| Peripheral Interfaces | USB 2.0, SPI, I2C, McASP, Ethernet MAC, UART, PWM, ATA/ATAPI-6, PCI |
| Package Type | 529-pin FCBGA |
Key Features
- High-performance TMS320C64x+™ DSP core with up to 5832 MIPS and eight highly independent functional units.
- ARM926EJ-S™ core supporting 32-bit and 16-bit instruction sets and ARM® Jazelle® technology.
- Advanced Very-Long-Instruction-Word (VLIW) architecture and DSP instruction extensions.
- On-chip memory including L1 and L2 caches, and unified mapped RAM/cache.
- Rich peripheral set including configurable video port, Ethernet MAC, multichannel audio serial ports, UART, SPI, I2C, and USB 2.0.
- High-Definition Video/Imaging Co-processor (HDVICP) and Video Data Conversion Engine (VDCE) for offloading video and imaging tasks.
- Support for various interfaces such as PCI, HPI, VLYNQ, and ATA/ATAPI-6.
- Embedded Trace Buffer™ (ETB11™) for ARM9 debug and EmbeddedICE-RT™ logic for real-time debug.
Applications
- Video encode, decode, transcode, and transrate.
- Digital media processing.
- Networked media encode and decode.
- Video imaging and infrastructure.
- Video conferencing.
- High-definition video and imaging applications.
Q & A
- What is the TMS320DM6467CCUT6?
The TMS320DM6467CCUT6 is a Digital Media System-on-Chip (DMSoC) produced by Texas Instruments, featuring a dual-core architecture with a TMS320C64x+™ DSP core and an ARM926EJ-S™ core.
- What are the clock rates of the C64x+ and ARM926EJ-S cores?
The C64x+ core operates at 594 MHz or 729 MHz, while the ARM926EJ-S core operates at 297 MHz or 364.5 MHz.
- What is the memory architecture of the DM6467?
The DM6467 features 32 KB L1P program RAM/cache, 32 KB L1D data RAM/cache, and 128 KB L2 unified mapped RAM/cache.
- What peripherals are included in the DM6467?
The DM6467 includes peripherals such as USB 2.0, SPI, I2C, multichannel audio serial ports, Ethernet MAC, UART, PWM, ATA/ATAPI-6, and PCI.
- What is the purpose of the HDVICP and VDCE in the DM6467?
The High-Definition Video/Imaging Co-processor (HDVICP) and Video Data Conversion Engine (VDCE) are used to offload video and imaging processing tasks from the DSP core.
- What are the typical applications of the DM6467?
The DM6467 is typically used in video encode/decode, digital media processing, networked media encode/decode, video imaging, and video conferencing applications.
- What is the package type of the TMS320DM6467CCUT6?
The TMS320DM6467CCUT6 is packaged in a 529-pin FCBGA.
- Does the DM6467 support real-time debugging?
Yes, the DM6467 includes EmbeddedICE-RT™ logic for real-time debugging and an Embedded Trace Buffer™ (ETB11™) for ARM9 debug.
- What development tools are available for the DM6467?
The DM6467 has a complete set of development tools including C compilers, a DSP assembly optimizer, and a Windows™ debugger interface.
- What is the significance of the DaVinci™ technology in the DM6467?
The DaVinci™ technology in the DM6467 enables robust operating system support, rich user interfaces, high processing performance, and long battery life, making it suitable for next-generation embedded devices.
