TMS320DM365ZCED30
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Texas Instruments TMS320DM365ZCED30

Manufacturer No:
TMS320DM365ZCED30
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DGTL MEDIA SOC 338NFBGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The TMS320DM365ZCED30 is a Digital Media System-on-Chip (DMSoC) produced by Texas Instruments. This device is part of the TMS320DM365 series and is based on DaVinci technology. It features an ARM926EJ-S core, which operates at speeds up to 300 MHz, and is designed to deliver high-performance digital media processing. The DM365 supports a wide range of video codecs, including H.264, MPEG-4, MPEG-2, MJPEG, and VC1/WMV9, making it versatile for various video applications. The chip also includes a suite of peripherals that help reduce system costs and enhance functionality.

Key Specifications

Parameter Description
Processor Core ARM926EJ-S
Maximum Clock Rate Up to 300 MHz
Memory 16 KB Instruction Cache, 8 KB Data Cache, 32 KB RAM, 16 KB ROM
Video Processing Two Video Image Co-processors (HDVICP, MJCP), HW Face Detect Engine, Resize Engine, Hardware IPIPE for Real-Time Image Processing
Interfaces DDR2/NAND, USB 2.0 OTG, 5 SPIs, 2 UARTs, 2 MMC/SD/SDIO, I2C, 10/100 Mb/s Ethernet MAC
Package 338-Pin Ball Grid Array (BGA), 13 x 13 mm, 65nm Process Technology
Voltage 1.2 V or 1.35 V Core, 3.3 V and 1.8 V I/O
Operating Temperature -40°C to 85°C

Key Features

  • High-Performance Digital Media Processing: Supports up to 720p H.264 video at 30fps.
  • Multi-Format Video Support: Includes H.264, MPEG-4, MPEG-2, MJPEG, and VC1/WMV9 codecs.
  • Video Processing Subsystem: Features two video image co-processors (HDVICP, MJCP), HW Face Detect Engine, and Resize Engine.
  • Peripheral Suite: Includes USB 2.0 OTG, SPI, UART, MMC/SD/SDIO, I2C, and 10/100 Mb/s Ethernet MAC.
  • Power Management: Designed for minimal power consumption with active and leakage power reduction strategies.
  • Debug and Development Tools: Supports IEEE-1149.1 (JTAG), ETB (Embedded Trace Buffer), and real-time debug capabilities.

Applications

  • Digital Video Devices: Suitable for digital video recorders, set-top boxes, and other consumer electronics requiring high-quality video processing.
  • Security and Surveillance: Used in IP cameras and other security devices due to its advanced video processing and face detection capabilities.
  • Industrial Automation: Can be applied in industrial automation systems that require robust video and image processing.
  • Medical Imaging: Applicable in medical devices that need high-resolution image and video processing.

Q & A

  1. What is the maximum clock rate of the TMS320DM365ZCED30?

    The maximum clock rate of the TMS320DM365ZCED30 is up to 300 MHz.

  2. What video codecs are supported by the TMS320DM365ZCED30?

    The device supports H.264, MPEG-4, MPEG-2, MJPEG, and VC1/WMV9 codecs.

  3. What are the key components of the video processing subsystem?

    The video processing subsystem includes two video image co-processors (HDVICP, MJCP), a HW Face Detect Engine, and a Resize Engine.

  4. What types of memory does the TMS320DM365ZCED30 have?

    The device features 16 KB Instruction Cache, 8 KB Data Cache, 32 KB RAM, and 16 KB ROM.

  5. What are the available interfaces on the TMS320DM365ZCED30?

    The device includes DDR2/NAND, USB 2.0 OTG, SPI, UART, MMC/SD/SDIO, I2C, and 10/100 Mb/s Ethernet MAC interfaces.

  6. What is the package type and size of the TMS320DM365ZCED30?

    The device is packaged in a 338-Pin Ball Grid Array (BGA) with a size of 13 x 13 mm.

  7. What is the operating temperature range of the TMS320DM365ZCED30?

    The operating temperature range is -40°C to 85°C.

  8. How does the TMS320DM365ZCED30 manage power consumption?

    The device is designed for minimal power consumption with strategies to reduce both active and leakage power.

  9. What debug and development tools are supported by the TMS320DM365ZCED30?

    The device supports IEEE-1149.1 (JTAG), ETB (Embedded Trace Buffer), and real-time debug capabilities.

  10. In what types of applications is the TMS320DM365ZCED30 commonly used?

    The device is commonly used in digital video devices, security and surveillance systems, industrial automation, and medical imaging applications.

Product Attributes

Type:Digital Media System-on-Chip (DMSoC)
Interface:EBI/EMI, Ethernet, I²C, McBSP, SPI, UART, USB
Clock Rate:300MHz
Non-Volatile Memory:ROM (16kB)
On-Chip RAM:56kB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:1.35V
Operating Temperature:-40°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:338-LFBGA
Supplier Device Package:338-BGA (13x13)
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Similar Products

Part Number TMS320DM365ZCED30 TMS320DM365ZCE30
Manufacturer Texas Instruments Texas Instruments
Product Status Active Active
Type Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC)
Interface EBI/EMI, Ethernet, I²C, McBSP, SPI, UART, USB EBI/EMI, Ethernet, I²C, McBSP, SPI, UART, USB
Clock Rate 300MHz 300MHz
Non-Volatile Memory ROM (16kB) ROM (16kB)
On-Chip RAM 56kB 56kB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.35V 1.35V
Operating Temperature -40°C ~ 85°C (TC) 0°C ~ 85°C (TC)
Mounting Type Surface Mount Surface Mount
Package / Case 338-LFBGA 338-LFBGA
Supplier Device Package 338-BGA (13x13) 338-BGA (13x13)

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