TMS320DM335DZCEA13
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Texas Instruments TMS320DM335DZCEA13

Manufacturer No:
TMS320DM335DZCEA13
Manufacturer:
Texas Instruments
Package:
Tube
Description:
IC DGTL MEDIA SOC 337NFBGA
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Product Introduction

Overview

The TMS320DM335DZCEA13 from Texas Instruments is a Digital Media System-on-Chip (DMSoC) designed for a wide range of multimedia applications. This chip integrates an ARM926EJ-S processor core, a video processing subsystem, and a rich set of peripherals, making it ideal for high-performance digital media processing. The DM335 is part of the DaVinci™ series and is known for its advanced power management, programmable video processing capabilities, and low power consumption, ensuring energy efficiency without compromising on performance.

Key Specifications

SpecificationDetails
Processor CoreARM926EJ-S RISC CPU
Clock RateUp to 216 MHz
Cache Memory16K-Byte Instruction Cache, 8K-Byte Data Cache
On-Chip RAM32K-Byte RAM
On-Chip ROM8K-Byte ROM
Package Type337-Pin Ball Grid Array (BGA)
Package Size13 x 13 mm
Process Technology90 nm
VoltageCore: 1.3 V, I/O: 3.3 V, 1.8 V
Operating Temperature0°C to 85°C
Memory InterfacesDDR2/mDDR, Asynchronous EMIF (AEMIF), NAND, OneNAND
PeripheralsMMC/SD, SmartMedia, USB 2.0, SPI, UART, I2C, PWM, RTO, Audio Serial Port (ASP)
Video ProcessingVideo Processing Front-End (VPFE), Video Processing Back-End (VPBE), Hardware IPIPE for Real-Time Image Processing

Key Features

  • High-Performance ARM926EJ-S RISC CPU: Up to 216 MHz clock rate.
  • Video Processing Subsystem (VPSS): Includes VPFE and VPBE for real-time image processing, histogram module, and resize capabilities.
  • Memory and Storage: Supports DDR2/mDDR, asynchronous EMIF, NAND, and OneNAND.
  • Rich Peripherals: Includes MMC/SD, SmartMedia, USB 2.0, SPI, UART, I2C, PWM, RTO, and ASP.
  • Advanced Power Management: Configurable power-saving modes and low power consumption.
  • Debug and Development Tools: EmbeddedICE-RT™ logic, JTAG, and ETB™ (Embedded Trace Buffer™).
  • Audio and Video Interfaces: Supports I2S, TDM I2S, AC97 Audio Codec, and S/PDIF via software.

Applications

The TMS320DM335DZCEA13 is suitable for a variety of multimedia and digital media applications, including:

  • Digital Cameras and Camcorders: Leveraging its video processing capabilities and interfaces for CCD/CMOS imager modules.
  • Set-Top Boxes and Digital TVs: Utilizing its support for digital HDTV output and composite NTSC/PAL.
  • Portable Media Players: Benefiting from its low power consumption and rich set of peripherals.
  • Security and Surveillance Systems: Taking advantage of its real-time image processing and video encoding capabilities.
  • Industrial Automation and Control Systems: Using its robust set of peripherals and advanced power management.

Q & A

  1. What is the primary processor core used in the TMS320DM335DZCEA13?

    The primary processor core is the ARM926EJ-S RISC CPU.

  2. What is the maximum clock rate of the ARM926EJ-S CPU in the TMS320DM335DZCEA13?

    The maximum clock rate is up to 216 MHz.

  3. What types of memory interfaces does the TMS320DM335DZCEA13 support?

    The chip supports DDR2/mDDR, asynchronous EMIF (AEMIF), NAND, and OneNAND.

  4. What video processing capabilities does the TMS320DM335DZCEA13 offer?

    The chip includes a Video Processing Subsystem (VPSS) with VPFE and VPBE, hardware IPIPE for real-time image processing, and histogram module.

  5. What are the key peripherals available on the TMS320DM335DZCEA13?

    The key peripherals include MMC/SD, SmartMedia, USB 2.0, SPI, UART, I2C, PWM, RTO, and ASP.

  6. How does the TMS320DM335DZCEA13 manage power consumption?

    The chip features configurable power-saving modes and low power consumption to ensure energy efficiency.

  7. What debug and development tools are supported by the TMS320DM335DZCEA13?

    The chip supports EmbeddedICE-RT™ logic, JTAG, and ETB™ (Embedded Trace Buffer™).

  8. What audio interfaces are supported by the TMS320DM335DZCEA13?

    The chip supports I2S, TDM I2S, AC97 Audio Codec, and S/PDIF via software.

  9. What is the package type and size of the TMS320DM335DZCEA13?

    The package type is a 337-Pin Ball Grid Array (BGA) with a size of 13 x 13 mm.

  10. What is the operating temperature range of the TMS320DM335DZCEA13?

    The operating temperature range is from 0°C to 85°C.

Product Attributes

Type:Digital Media System-on-Chip (DMSoC)
Interface:ASP, EBI/EMI, I²C, SPI, UART, USB
Clock Rate:135MHz
Non-Volatile Memory:ROM (8kB)
On-Chip RAM:56kB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:1.30V
Operating Temperature:0°C ~ 85°C (TC)
Mounting Type:Surface Mount
Package / Case:337-LFBGA
Supplier Device Package:337-BGA (13x13)
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Similar Products

Part Number TMS320DM335DZCEA13 TMS320DM355DZCEA13
Manufacturer Texas Instruments Texas Instruments
Product Status Discontinued at Digi-Key Discontinued at Digi-Key
Type Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC)
Interface ASP, EBI/EMI, I²C, SPI, UART, USB ASP, I²C, SPI, UART, USB
Clock Rate 135MHz 135MHz
Non-Volatile Memory ROM (8kB) ROM (8kB)
On-Chip RAM 56kB 56kB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.30V 1.30V
Operating Temperature 0°C ~ 85°C (TC) -40°C ~ 100°C (TC)
Mounting Type Surface Mount Surface Mount
Package / Case 337-LFBGA 337-LFBGA
Supplier Device Package 337-BGA (13x13) 337-BGA (13x13)

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