TMS320C6747DZKB3
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Texas Instruments TMS320C6747DZKB3

Manufacturer No:
TMS320C6747DZKB3
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DSP FIX/FLOAT POINT 256BGA
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The TMS320C6747DZKB3 is a low-power digital signal processor (DSP) from Texas Instruments, based on the TMS320C674x DSP core. This device is designed to offer high processing performance while consuming significantly lower power compared to other members of the TMS320C6000 platform. It is particularly suited for original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices requiring advanced signal processing capabilities.

Key Specifications

Attribute Value
Part Number TMS320C6747DZKB3
Manufacturer Texas Instruments
Package / Case 256-BGA
Number of Pins 256
Bit Size 32
Type Fixed/Floating Point
Operating Temperature 0°C ~ 90°C TJ
Supply Voltage 1.2V (Core), 3.3V (I/O)
Max Supply Voltage 1.32V
Min Supply Voltage 1.14V
Clock Rate 375 MHz
On Chip Data RAM 448 kB
Cache Memory 32KB L1P, 32KB L1D, 256KB L2
External Memory Interfaces EMIFA, EMIFB
Interfaces EBI/EMI, Ethernet MAC, Host Interface, I2C, McASP, SPI, UART, USB

Key Features

  • DSP Core: TMS320C674x VLIW DSP core with up to 3648 MIPS and 2736 MFLOPS, supporting 32-bit integer, single precision (SP), and double precision (DP) floating-point operations.
  • Cache Architecture: Two-level cache with 32KB L1P and L1D caches, and a 256KB L2 unified cache.
  • Memory: 128KB of shared RAM (TMS320C6747 only), and flexible RAM/cache partitioning.
  • Peripherals: Includes 10/100 Mbps Ethernet MAC (EMAC), two I2C interfaces, three multichannel audio serial ports (McASPs), two SPIs, three UARTs, and USB 2.0 OTG and host interfaces.
  • Programmable Real-Time Unit Subsystem (PRUSS): Two independent PRU cores with 32-bit load and store RISC architecture.
  • Pulse Width Modulators and Capture Modules: Three enhanced high-resolution pulse width modulators (eHRPWMs) and three enhanced capture (eCAP) modules.
  • Power Management: Standard power-management mechanisms including clock gating and low power modes.

Applications

  • Audio and Video Processing: Suitable for applications requiring advanced audio and video signal processing, such as audio codecs, video encoding/decoding, and multimedia devices.
  • Industrial Automation: Used in industrial control systems, motor control, and other automation applications due to its robust peripheral set and real-time processing capabilities.
  • Medical Devices: Applicable in medical imaging, patient monitoring systems, and other medical devices that require high-performance signal processing.
  • Communication Systems: Utilized in communication equipment such as routers, switches, and other network devices due to its integrated Ethernet MAC and other communication interfaces.

Q & A

  1. What is the core frequency of the TMS320C6747DZKB3?

    The core frequency of the TMS320C6747DZKB3 is up to 375 MHz.

  2. What type of cache architecture does the TMS320C6747DZKB3 use?

    The TMS320C6747DZKB3 uses a two-level cache architecture with 32KB L1P and L1D caches, and a 256KB L2 unified cache.

  3. Does the TMS320C6747DZKB3 support floating-point operations?

    Yes, the TMS320C6747DZKB3 supports both single precision (SP) and double precision (DP) floating-point operations.

  4. What are the key peripherals included in the TMS320C6747DZKB3?

    The key peripherals include 10/100 Mbps Ethernet MAC, two I2C interfaces, three McASPs, two SPIs, three UARTs, and USB 2.0 OTG and host interfaces.

  5. Is the TMS320C6747DZKB3 RoHS compliant?

    Yes, the TMS320C6747DZKB3 is RoHS compliant.

  6. What is the operating temperature range of the TMS320C6747DZKB3?

    The operating temperature range is 0°C to 90°C TJ.

  7. Does the TMS320C6747DZKB3 have integrated power management features?

    Yes, it includes standard power-management mechanisms such as clock gating and low power modes.

  8. What is the package type of the TMS320C6747DZKB3?

    The package type is a 256-ball Pb-Free Plastic Ball Grid Array (PBGA).

  9. Does the TMS320C6747DZKB3 support real-time processing?

    Yes, it includes a Programmable Real-Time Unit Subsystem (PRUSS) with two independent PRU cores.

  10. What is the maximum supply voltage for the TMS320C6747DZKB3?

    The maximum supply voltage is 1.32V.

Product Attributes

Type:Fixed/Floating Point
Interface:EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB
Clock Rate:375MHz
Non-Volatile Memory:External
On-Chip RAM:448kB
Voltage - I/O:3.30V
Voltage - Core:1.20V
Operating Temperature:0°C ~ 90°C (TJ)
Mounting Type:Surface Mount
Package / Case:256-BGA
Supplier Device Package:256-BGA (17x17)
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Similar Products

Part Number TMS320C6747DZKB3 TMS320C6747DZKBT3 TMS320C6747DZKB4 TMS320C6747DZKBA3 TMS320C6747AZKB3 TMS320C6747BZKB3 TMS320C6747CZKB3
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Obsolete Obsolete Obsolete
Type Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point Fixed/Floating Point
Interface EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB EBI/EMI, Ethernet MAC, Host Interface, I²C, McASP, SPI, UART, USB
Clock Rate 375MHz 375MHz 456MHz 375MHz 300MHz 375MHz 375MHz
Non-Volatile Memory External External External External External External External
On-Chip RAM 448kB 448kB 448kB 448kB 448kB 448kB 448kB
Voltage - I/O 3.30V 3.30V 3.30V 3.30V 3.30V 3.30V 3.30V
Voltage - Core 1.20V 1.20V 1.20V 1.20V 1.20V 1.20V 1.20V
Operating Temperature 0°C ~ 90°C (TJ) -40°C ~ 125°C (TJ) 0°C ~ 90°C (TJ) -40°C ~ 105°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 256-BGA 256-BGA 256-BGA 256-BGA 256-BGA 256-BGA 256-BGA
Supplier Device Package 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17)

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