TMS320C6474FGUNA
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Texas Instruments TMS320C6474FGUNA

Manufacturer No:
TMS320C6474FGUNA
Manufacturer:
Texas Instruments
Package:
Bulk
Description:
IC DSP FIXED POINT 561FCBGA
Delivery:
Payment:
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Product Introduction

Overview

The TMS320C6474FGUNA is a high-performance multicore digital signal processor (DSP) developed by Texas Instruments. This device is part of the TMS320C6000™ DSP platform and features three TMS320C64x+™ DSP cores, each operating at up to 1.2 GHz. The C6474 is designed to provide significant performance integration, high-performance density, and substantial efficiencies in power, cost, and board space. It is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture and is upward code-compatible from previous devices in the C6000™ DSP platform.

Key Specifications

Feature Description
CPU Cores 3 TMS320C64x+™ DSP Cores
Clock Rate 1 GHz to 1.2 GHz
Instruction Cycle Time 0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device)
L1 Memory 256 K-Bit (32 K-Byte) L1P Program Cache, 256 K-Bit (32 K-Byte) L1D Data Cache [2-Way Set-Associative]
L2 Memory 24 M-Bit (3072 K-Byte) Total L2 Unified Mapped RAM/Cache [Flexible Allocation]
L3 Memory 512 K-Bit (64 K-Byte) L3 ROM
Package Type 561-Pin Ball Grid Array (BGA) Packages (CUN, GUN, or ZUN Suffix), 0.8-mm Ball Pitch
Temperature Range Commercial: 0°C to 100°C; Extended: -40°C to 100°C (1-GHz Device), -40°C to 95°C (1.2-GHz Device)
Peripherals DDR2 Memory Controller, Enhanced DMA 3.0 (EDMA3), 10/100/1000 Ethernet MAC (EMAC), Serial RapidIO® (SRIO), Viterbi Decoder Coprocessor (VCP2), etc.

Key Features

  • High-performance multicore DSP with three TMS320C64x+™ DSP cores, each capable of executing eight 32-bit instructions per cycle.
  • Dedicated SPLOOP instructions and compact instructions (16-bit).
  • High-speed peripherals including 1000 Mbps Ethernet MAC (EMAC), IEEE 802.3 compliant, and two Serial RapidIO® (SRIO) links with link rates of 1.25 Gbps, 2.5 Gbps, or 3.125 Gbps.
  • Large internal memory: 256 K-Bit L1P and L1D caches, 24 M-Bit L2 unified cache, and 512 K-Bit L3 ROM.
  • SmartReflex™ Class 0 enabled for adaptive core voltage (0.9-V to 1.2-V).
  • Six 64-bit general-purpose timers, configurable as twelve 32-bit timers, and 16 general-purpose input/output (GPIO) pins).
  • Antenna interface (AIF) capable of up to 3.072 Gbps operation per link, compliant to OBSAI RP3 and CPRI standards).

Applications

The TMS320C6474FGUNA is versatile and can be applied in various high-performance and demanding fields, including:

  • Communications infrastructure and basestations
  • Medical and high-performance imaging
  • Military, aerospace, and avionics
  • Video and telecom infrastructures

Q & A

  1. What is the TMS320C6474FGUNA?

    The TMS320C6474FGUNA is a high-performance multicore digital signal processor (DSP) developed by Texas Instruments.

  2. How many CPU cores does the TMS320C6474FGUNA have?

    The device features three TMS320C64x+™ DSP cores.

  3. What are the clock rates of the TMS320C6474FGUNA?

    The clock rates range from 1 GHz to 1.2 GHz.

  4. What is the instruction cycle time of the TMS320C6474FGUNA?

    The instruction cycle time is 0.83 ns for the 1.2-GHz device and 1 ns for the 1-GHz device.

  5. What type of memory does the TMS320C6474FGUNA have?

    The device includes 256 K-Bit L1P and L1D caches, 24 M-Bit L2 unified cache, and 512 K-Bit L3 ROM.

  6. What peripherals are included in the TMS320C6474FGUNA?

    The device includes DDR2 Memory Controller, Enhanced DMA 3.0 (EDMA3), 10/100/1000 Ethernet MAC (EMAC), Serial RapidIO® (SRIO), and Viterbi Decoder Coprocessor (VCP2), among others.

  7. What is the package type of the TMS320C6474FGUNA?

    The device is packaged in a 561-Pin Ball Grid Array (BGA) with a 0.8-mm ball pitch.

  8. What are the temperature ranges for the TMS320C6474FGUNA?

    The commercial temperature range is 0°C to 100°C, and the extended temperature range is -40°C to 100°C (1-GHz device) and -40°C to 95°C (1.2-GHz device).

  9. What are some common applications of the TMS320C6474FGUNA?

    Common applications include communications infrastructure, medical and high-performance imaging, military, aerospace, and avionics, and video and telecom infrastructures.

  10. Is the TMS320C6474FGUNA compatible with previous C6000™ DSP devices?

    Yes, the C6474 device is upward code-compatible from previous devices in the C6000™ DSP platform.

Product Attributes

Type:Fixed Point
Interface:Ethernet MAC, I²C, McBSP
Clock Rate:1GHz
Non-Volatile Memory:ROM (64kB)
On-Chip RAM:3.168MB
Voltage - I/O:1.1V, 1.8V
Voltage - Core:1.10V
Operating Temperature:-40°C ~ 100°C (TC)
Mounting Type:Surface Mount
Package / Case:561-BFBGA
Supplier Device Package:561-FCBGA (23x23)
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Similar Products

Part Number TMS320C6474FGUNA TMS320C6474FZUNA TMS320C6474FCUNA TMS320C6474FGUN TMS320C6474FGUN2
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Obsolete Obsolete Active Discontinued at Digi-Key Discontinued at Digi-Key
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP Ethernet MAC, I²C, McBSP
Clock Rate 1GHz 1GHz 1GHz 1GHz 1.2GHz
Non-Volatile Memory ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB) ROM (64kB)
On-Chip RAM 3.168MB 3.168MB 3.168MB 3.168MB 3.168MB
Voltage - I/O 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V 1.1V, 1.8V
Voltage - Core 1.10V 1.10V 1.10V 1.10V 1.10V
Operating Temperature -40°C ~ 100°C (TC) -40°C ~ 100°C (TC) -40°C ~ 100°C (TC) 0°C ~ 100°C (TC) 0°C ~ 95°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 561-BFBGA 561-BFBGA, FCBGA Exposed Pad 561-BFBGA, FCCSPBGA 561-BFBGA 561-BFBGA
Supplier Device Package 561-FCBGA (23x23) 561-FCBGA (23x23) 561-FC/CSP (23x23) 561-FCBGA (23x23) 561-FCBGA (23x23)

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