Overview
The TMS320C6472EZTZ is a high-performance fixed-point digital signal processor (DSP) developed by Texas Instruments. This device is part of the TMS320C6000 DSP platform and is designed to meet the demands of high-end industrial, mission-critical, image and video processing, communication, media gateways, and remote access servers. The TMS320C6472 features six optimized TMS320C64x+ megamodules, each combining high performance with low power dissipation. The device is available in three different speeds: 500 MHz, 625 MHz, and 700 MHz.
The TMS320C6472 is built on the third-generation high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture, making it an excellent choice for applications such as video and telecom infrastructure, imaging/medical, and wireless infrastructure. The device includes extensive on-chip memory, including 768K-Byte of shared RAM and 608K-Byte local L2 RAM per C64x+ megamodule, reducing the need for external memory and optimizing system power and cost.
Key Specifications
| Specification | Details |
|---|---|
| Processor Type | Fixed-Point Digital Signal Processor (DSP) |
| CPU Frequency | 500 MHz, 625 MHz, 700 MHz |
| Cycle Time | 2 ns (500 MHz), 1.6 ns (625 MHz and 700 MHz) |
| Core Voltage | 1.0 V (500 MHz), 1.1 V (625 MHz), 1.2 V (700 MHz) |
| I/O Voltage | 1.2 V (RapidIO), 1.5 V/1.8 V (EMAC RGMII), 1.8 V (DDR2 EMIF I/O), 1.8 V and 3.3 V (I/O Supply Voltage) |
| Package Type | 737-Pin Flip-Chip Plastic BGA (CTZ/ZTZ) |
| Package Size | 24 x 24 mm |
| Process Technology | 0.09 μm, 7-Level Cu Metal Process (CMOS) |
| On-Chip Memory | 768K-Byte shared RAM, 608K-Byte local L2 RAM per C64x+ megamodule |
| Peripheral Interfaces | Two 10/100/1000 Mb/s Ethernet MACs, Three Telecom Serial Interface Ports (TSIPs), UTOPIA Level 2 Slave ATM Controller, Serial RapidIO with two 1x lanes, 32-bit DDR2 SDRAM interface, I2C bus, 16 general-purpose I/O (GPIO) pins |
| Timers | 12 (6 dedicated, 6 shared) 64-bit general-purpose timers |
Key Features
- Six on-chip TMS320C64x+ megamodules with high-performance and low power dissipation.
- IEEE 1149.6 compliant I/Os and support for both little-endian and big-endian byte order.
- UTOPIA Level 2 Slave ATM Controller and 8/16-bit transmit and receive operations up to 50 MHz per direction.
- Two 10/100/1000 Mb/s Ethernet MACs (EMACs) compliant with IEEE 802.3.
- High-speed Serial RapidIO port with two 1x lanes and support for packet forwarding.
- 32-bit DDR2 SDRAM interface and 16 general-purpose I/O (GPIO) pins.
- Inter-integrated circuit (I2C) bus and 12 (6 dedicated, 6 shared) 64-bit general-purpose timers.
- Dedicated SPLOOP instruction and compact 16-bit instructions.
- EDMA controller with 64 independent channels and shared memory architecture.
Applications
- High-end industrial applications.
- Mission-critical systems.
- High-end image and video processing.
- Communication infrastructure, including media gateways and remote access servers.
- Video and telecom infrastructure.
- Imaging and medical applications.
- Wireless infrastructure (WI).
Q & A
- What is the TMS320C6472EZTZ?
The TMS320C6472EZTZ is a high-performance fixed-point digital signal processor (DSP) developed by Texas Instruments.
- What are the available CPU frequencies for the TMS320C6472EZTZ?
The device is available in three different speeds: 500 MHz, 625 MHz, and 700 MHz.
- What type of memory does the TMS320C6472EZTZ have?
The device features 768K-Byte of shared RAM and 608K-Byte local L2 RAM per C64x+ megamodule.
- What peripheral interfaces are supported by the TMS320C6472EZTZ?
The device supports two 10/100/1000 Mb/s Ethernet MACs, three Telecom Serial Interface Ports (TSIPs), UTOPIA Level 2 Slave ATM Controller, Serial RapidIO, 32-bit DDR2 SDRAM interface, I2C bus, and 16 general-purpose I/O (GPIO) pins.
- Is the TMS320C6472EZTZ compatible with previous devices in the C6000 DSP platform?
Yes, the C64x+ devices are upward code-compatible from previous devices in the C6000 DSP platform.
- What is the package type and size of the TMS320C6472EZTZ?
The device is packaged in a 737-Pin Flip-Chip Plastic BGA (CTZ/ZTZ) with a size of 24 x 24 mm.
- What process technology is used in the TMS320C6472EZTZ?
The device is built using 0.09 μm, 7-Level Cu Metal Process (CMOS) technology.
- What are the typical applications of the TMS320C6472EZTZ?
The device is used in high-end industrial, mission-critical, image and video processing, communication infrastructure, video and telecom infrastructure, imaging and medical applications, and wireless infrastructure.
- Does the TMS320C6472EZTZ support both little-endian and big-endian byte order?
Yes, the device supports both little-endian and big-endian byte order.
- What development tools are available for the TMS320C6472EZTZ?
The device has a complete set of development tools including a C compiler, an assembly optimizer, and a Windows debugger interface.
