Overview
The TMS320C6454BCTZA is a high-performance fixed-point digital signal processor (DSP) from Texas Instruments, part of the TMS320C6000 DSP platform. It is based on the third-generation advanced VelociTI™ very-long-instruction-word (VLIW) architecture, making it an excellent choice for demanding applications such as video and telecom infrastructure, imaging/medical, and wireless infrastructure. The C6454 device offers a lower cost, pin-compatible migration path for C6455 customers who do not require the full multiply throughput of the C6455. It is upward code-compatible with previous devices in the C6000 DSP platform, ensuring seamless integration and development.
Key Specifications
Specification | Details |
---|---|
Clock Rate | 720 MHz, 850 MHz, and 1 GHz |
Instruction Cycle Time | 1.39 ns, 1.17 ns, and 1 ns |
Total Addressable External Memory Space | 512 M-Byte |
Instructions per Cycle | Eight 32-Bit Instructions/Cycle |
MIPS/MMACS | 8000 MIPS/MMACS (16-Bits) |
Host-Port Interface (HPI) | 32-/16-Bit HPI16/HPI32 |
Peripheral Component Interconnect (PCI) | 32-Bit, 33-/66-MHz, 3.3-V PCI Master/Slave Interface |
Temperature Range | Commercial: 0°C to 90°C, Extended: -40°C to 105°C |
Memory Configuration | 256K-Bit (32K-Byte) L1P Program Cache, 256K-Bit (32K-Byte) L1D Data Cache, 8M-Bit (1048K-Byte) L2 Unified Mapped RAM/Cache |
Package Type | 697-Pin Ball Grid Array (BGA) Package (CTZ, GTZ, or ZTZ Suffix) |
Process Technology | 0.09-μm/7-Level Cu Metal Process (CMOS) |
I/O Voltage | 3.3-V, 1.8-V, 1.5-V, 1.25-V, 1.2-V |
Key Features
- High-Performance DSP Core: Based on the TMS320C64x+™ DSP core, capable of executing eight 32-bit instructions per cycle and performing up to 8000 16-bit MMACs per second at 1 GHz clock rate.
- Memory System: Two-level memory system with 32KB L1 program and data memories, and 1048KB L2 unified mapped RAM/cache.
- External Memory Interfaces: Supports DDR2-533 SDRAM, 64-bit EMIFA for synchronous and asynchronous peripherals, and glueless interface to SRAM, Flash, and EEPROM.
- Peripheral Interfaces: Includes I2C bus, two McBSPs, 10/100/1000 Mb/s Ethernet MAC (EMAC), and PCI Master/Slave Interface.
- Timers and Counters: Two 64-bit general-purpose timers, configurable as four 32-bit timers.
- Development Tools: Complete set of development tools including a new C compiler, assembly optimizer, and Windows® debugger interface.
- Power and Temperature: Operates in commercial and extended temperature ranges with various I/O voltage options.
Applications
- Video and Telecom Infrastructure: Ideal for high-performance video processing and telecom applications.
- Imaging/Medical: Suitable for medical imaging and other high-resolution imaging applications.
- Wireless Infrastructure: Used in wireless infrastructure due to its high processing capabilities and efficient memory management.
- General Embedded Systems: Can be used in various embedded systems requiring high-performance DSP capabilities.
Q & A
- What is the clock rate of the TMS320C6454BCTZA?
The clock rate of the TMS320C6454BCTZA can be 720 MHz, 850 MHz, or 1 GHz.
- How many instructions can the TMS320C6454BCTZA execute per cycle?
The TMS320C6454BCTZA can execute eight 32-bit instructions per cycle.
- What is the total addressable external memory space of the TMS320C6454BCTZA?
The total addressable external memory space is 512 M-Byte.
- What are the key features of the memory system in the TMS320C6454BCTZA?
The memory system includes 32KB L1 program and data memories, and 1048KB L2 unified mapped RAM/cache.
- Does the TMS320C6454BCTZA support Ethernet connectivity?
Yes, it includes a 10/100/1000 Mb/s Ethernet MAC (EMAC) for efficient network interface.
- What peripheral interfaces are available on the TMS320C6454BCTZA?
The device includes I2C bus, two McBSPs, PCI Master/Slave Interface, and other interfaces.
- What development tools are available for the TMS320C6454BCTZA?
The device comes with a new C compiler, assembly optimizer, and Windows® debugger interface.
- What are the temperature ranges for the TMS320C6454BCTZA?
The device operates in commercial (0°C to 90°C) and extended (-40°C to 105°C) temperature ranges.
- What is the package type of the TMS320C6454BCTZA?
The device is packaged in a 697-Pin Ball Grid Array (BGA) Package (CTZ, GTZ, or ZTZ Suffix).
- What process technology is used in the TMS320C6454BCTZA?
The device is fabricated using 0.09-μm/7-Level Cu Metal Process (CMOS) technology.