TMS320C5532NZHH10
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Texas Instruments TMS320C5532NZHH10

Manufacturer No:
TMS320C5532NZHH10
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DSP FIXED POINT BGA
Delivery:
Payment:
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Product Introduction

Overview

The TMS320C5532NZHH10 is a fixed-point digital signal processor (DSP) from Texas Instruments, part of the C5000™ DSP product family. This device is designed for low-power applications and features a high-performance, low-power architecture. It is particularly suited for wireless audio devices, voice applications, industrial controls, and other demanding signal processing tasks.

Key Specifications

Parameter Value
Core Voltage 1.05 V - 1.3 V
Core Frequency 50 MHz - 100 MHz
Instruction Cycle Time 20 ns (1.05 V), 10 ns (1.3 V)
I/O Voltage 1.8 V, 2.5 V, 2.75 V, 3.3 V
On-Chip RAM 64 KB (DARAM), 64 KB (SARAM)
On-Chip ROM 128 KB
Package Type 144-Terminal Pb-Free Plastic BGA (Ball Grid Array)
Interfaces I2C, I2S, SPI, UART, MMC/SD, USB 2.0
Power Consumption Active: 0.15 mW/MHz @ 1.05 V, 50 MHz; Standby: 0.26 mW @ 1.05 V

Key Features

  • High-performance, low-power fixed-point DSP with up to 100 MHz clock rate
  • Dual Multiply-and-Accumulate Units (up to 200 million multiply-accumulates per second)
  • USB 2.0 full- and high-speed device with integrated PHY
  • LCD bridge with asynchronous interface
  • 10-bit 4-input Successive Approximation (SAR) ADC
  • Serial Port Interface (SPI) with four chip selects
  • Inter-Integrated Circuit (I2C) interface
  • Four Inter-IC Sound (I2S) buses for data transport
  • On-chip ROM bootloader (RBL) to boot from SPI EEPROM, SPI serial flash, or I2C EEPROM
  • General-Purpose Input/Output Port (GPIO) with up to 20 pins

Applications

  • Wireless audio devices (headsets, microphones, speakerphones)
  • Voice applications
  • Industrial controls
  • Echo cancellation headphones
  • Other signal processing applications requiring low power and high performance

Q & A

  1. What is the TMS320C5532NZHH10?

    The TMS320C5532NZHH10 is a fixed-point digital signal processor (DSP) from Texas Instruments.

  2. What are the core voltage and frequency options for the TMS320C5532NZHH10?

    The core voltage options are 1.05 V and 1.3 V, with corresponding frequencies of 50 MHz and 100 MHz.

  3. What types of interfaces does the TMS320C5532NZHH10 support?

    The device supports I2C, I2S, SPI, UART, MMC/SD, and USB 2.0 interfaces.

  4. How much on-chip memory does the TMS320C5532NZHH10 have?

    The device has 64 KB of dual-access RAM (DARAM), 64 KB of single-access RAM (SARAM), and 128 KB of single-access ROM (SAROM).

  5. What is the package type of the TMS320C5532NZHH10?

    The device is packaged in a 144-terminal Pb-Free Plastic BGA (Ball Grid Array).

  6. What are some typical applications for the TMS320C5532NZHH10?

    Typical applications include wireless audio devices, voice applications, industrial controls, and echo cancellation headphones.

  7. How does the TMS320C5532NZHH10 manage power consumption?

    The device has low power consumption, with active power at 0.15 mW/MHz @ 1.05 V, 50 MHz, and standby power at 0.26 mW @ 1.05 V.

  8. Does the TMS320C5532NZHH10 support USB?

    Yes, it supports USB 2.0 full- and high-speed with an integrated PHY.

  9. What is the role of the on-chip ROM bootloader (RBL) in the TMS320C5532NZHH10?

    The on-chip ROM bootloader allows the device to boot from SPI EEPROM, SPI serial flash, or I2C EEPROM.

  10. How many GPIO pins does the TMS320C5532NZHH10 have?

    The device has up to 20 GPIO pins.

Product Attributes

Type:Fixed Point
Interface:I²C, I²S, MMC/SD, SPI, UART
Clock Rate:100MHz
Non-Volatile Memory:ROM (128kB)
On-Chip RAM:64KB
Voltage - I/O:1.8V, 2.5V, 2.75V, 3.3V
Voltage - Core:1.30V
Operating Temperature:-10°C ~ 70°C (TC)
Mounting Type:Surface Mount
Package / Case:144-LFBGA
Supplier Device Package:144-BGA MICROSTAR (12x12)
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Similar Products

Part Number TMS320C5532NZHH10 TMS320C5534NZHH10 TMS320C5532AZHH10
Manufacturer Texas Instruments Texas Instruments Texas Instruments
Product Status Obsolete Obsolete Obsolete
Type Fixed Point Fixed Point Fixed Point
Interface I²C, I²S, MMC/SD, SPI, UART I²C, I²S, MMC/SD, SPI, UART, USB I²C, I²S, MMC/SD, SPI, UART
Clock Rate 100MHz 100MHz 100MHz
Non-Volatile Memory ROM (128kB) ROM (128kB) ROM (128kB)
On-Chip RAM 64KB 256KB 64KB
Voltage - I/O 1.8V, 2.5V, 2.75V, 3.3V 1.8V, 2.5V, 2.75V, 3.3V 1.8V, 2.5V, 2.75V, 3.3V
Voltage - Core 1.30V 1.30V 1.05V, 1.30V
Operating Temperature -10°C ~ 70°C (TC) -10°C ~ 70°C (TC) -10°C ~ 70°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 144-LFBGA 144-LFBGA 144-LFBGA
Supplier Device Package 144-BGA MICROSTAR (12x12) 144-BGA MICROSTAR (12x12) 144-BGA MICROSTAR (12x12)

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