TMS320C28342ZFET
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Texas Instruments TMS320C28342ZFET

Manufacturer No:
TMS320C28342ZFET
Manufacturer:
Texas Instruments
Package:
Bulk
Description:
IC DSP FLOATING POINT 256BGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TMS320C28342ZFET is a high-performance microcontroller unit (MCU) from Texas Instruments, part of the Delfino™ MCU generation. It is based on the C28x core and is designed for real-time control applications. This device delivers up to 300 MHz of floating-point performance and features up to 516KB of on-chip RAM, making it an excellent solution for performance-hungry real-time control applications. The C28342 is code-compatible with all C28x microcontrollers, ensuring seamless integration and development.

Key Specifications

Specification Details
Processor Speed Up to 300 MHz (3.33-ns Cycle Time)
Core Voltage 1.1-V/1.2-V Core, 3.3-V I/O, 1.8-V PLL/Oscillator
CPU High-Performance 32-Bit CPU (TMS320C28x)
Floating-Point Unit IEEE 754 Single-Precision Floating-Point Unit (FPU)
MAC Operations 16 × 16 and 32 × 32 MAC Operations, 16 × 16 Dual MAC
Bus Architecture Harvard Bus Architecture
On-Chip Memory Up to 258K × 16 SARAM, 8K × 16 Boot ROM
DMA Controller Six-Channel DMA Controller (for McBSP, XINTF, and SARAM)
External Interface 16-Bit or 32-Bit External Interface (XINTF), More Than 2M × 16 Address Reach
GPIO Pins Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
Package Options 256-Ball Plastic Ball Grid Array (BGA) (ZFE), 179-Ball MicroStar BGA™ (ZHH)
Temperature Options T: –40°C to 105°C (ZFE, ZHH), S: –40°C to 125°C (ZFE), Q: –40°C to 125°C (ZFE) (AEC Q100 Qualification for Automotive Applications)

Key Features

  • High-Performance Static CMOS Technology
  • Fast Interrupt Response and Processing
  • Code-Efficient (in C/C++ and Assembly)
  • Enhanced Control Peripherals:
    • Eighteen Enhanced Pulse Width Modulator (ePWM) Outputs
    • Dedicated 16-Bit Time-Based Counter With Period and Frequency Control
    • Single-Edge, Dual-Edge Symmetric, or Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
    • Up to 9 HRPWM Outputs With 55-ps MEP Resolution
  • Six 32-Bit Enhanced Capture (eCAP) Modules
  • Three 32-Bit Quadrature Encoder Pulse (QEP) Modules
  • Six 32-Bit Timers and Nine 16-Bit Timers
  • Serial Port Peripherals:
    • Up to 2 CAN Modules
    • Up to 3 SCI (UART) Modules
    • Up to 2 McBSP Modules (Configurable as SPI)
    • Up to 2 SPI Modules
    • One Inter-Integrated Circuit (I2C) Bus
  • External ADC Interface
  • Advanced Emulation Features:
    • Analysis and Breakpoint Functions
    • Real-Time Debug Using Hardware

Applications

  • Industrial AC Inverter Drives
  • Industrial Servo Amplifiers and Controllers
  • Computer Numerical Control (CNC) Machining
  • Uninterruptible and Server Power Supplies
  • Telecom Equipment Power
  • Solar Inverters

Q & A

  1. What is the maximum clock speed of the TMS320C28342ZFET?

    The TMS320C28342ZFET operates at up to 300 MHz.

  2. What type of CPU does the TMS320C28342ZFET use?

    The TMS320C28342ZFET uses a high-performance 32-Bit CPU (TMS320C28x).

  3. What is the on-chip memory capacity of the TMS320C28342ZFET?

    The device has up to 258K × 16 SARAM and an 8K × 16 Boot ROM.

  4. What are the key features of the enhanced pulse width modulator (ePWM) in the TMS320C28342ZFET?

    The ePWM features include single-edge, dual-edge symmetric, or dual-edge asymmetric outputs, dead-band generation, PWM chopping by high-frequency carrier, and trip zone input.

  5. What serial port peripherals are available on the TMS320C28342ZFET?

    The device includes up to 2 CAN modules, up to 3 SCI (UART) modules, up to 2 McBSP modules (configurable as SPI), up to 2 SPI modules, and one Inter-Integrated Circuit (I2C) bus.

  6. What are the temperature options for the TMS320C28342ZFET?

    The temperature options include T: –40°C to 105°C, S: –40°C to 125°C, and Q: –40°C to 125°C (AEC Q100 Qualification for Automotive Applications).

  7. What is the package type for the TMS320C28342ZFET?

    The device is available in a 256-Ball Plastic Ball Grid Array (BGA) (ZFE) and a 179-Ball MicroStar BGA™ (ZHH).

  8. What are some common applications of the TMS320C28342ZFET?

    Common applications include industrial AC inverter drives, industrial servo amplifiers and controllers, CNC machining, uninterruptible and server power supplies, telecom equipment power, and solar inverters.

  9. Does the TMS320C28342ZFET support real-time debugging?

    Yes, the device supports real-time debug using hardware and advanced emulation features including analysis and breakpoint functions.

  10. How many GPIO pins does the TMS320C28342ZFET have?

    The device has up to 88 individually programmable, multiplexed GPIO pins with input filtering.

Product Attributes

Type:Floating Point
Interface:CAN, EBI/EMI, I²C, McBSP, SCI, SPI
Clock Rate:300MHz
Non-Volatile Memory:ROM (16kB)
On-Chip RAM:196kB
Voltage - I/O:3.30V
Voltage - Core:1.20V
Operating Temperature:-40°C ~ 105°C (TJ)
Mounting Type:Surface Mount
Package / Case:256-BGA
Supplier Device Package:256-BGA (17x17)
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Similar Products

Part Number TMS320C28342ZFET TMS320C28346ZFET TMS320C28344ZFET TMS320C28345ZFET TMS320C28343ZFET TMS320C28341ZFET TMS320C28342ZFEQ
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Active Obsolete Obsolete Obsolete
Type Floating Point Floating Point Floating Point Floating Point Floating Point Floating Point Floating Point
Interface CAN, EBI/EMI, I²C, McBSP, SCI, SPI CAN, EBI/EMI, I²C, McBSP, SCI, SPI CAN, EBI/EMI, I²C, McBSP, SCI, SPI CAN, EBI/EMI, I²C, McBSP, SCI, SPI CAN, EBI/EMI, I²C, McBSP, SCI, SPI CAN, EBI/EMI, I²C, McBSP, SCI, SPI CAN, EBI/EMI, I²C, McBSP, SCI, SPI
Clock Rate 300MHz 300MHz 300MHz 200MHz 200MHz 200MHz 300MHz
Non-Volatile Memory ROM (16kB) ROM (16kB) ROM (16kB) ROM (16kB) ROM (16kB) ROM (16kB) ROM (16kB)
On-Chip RAM 196kB 516kB 260kB 516kB 260kB 196kB 196kB
Voltage - I/O 3.30V 3.30V 3.30V 3.30V 3.30V 3.30V 3.30V
Voltage - Core 1.20V 1.20V 1.20V 1.10V 1.10V 1.10V 1.20V
Operating Temperature -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 125°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 256-BGA 256-BGA 256-BGA 256-BGA 256-BGA 256-BGA 256-BGA
Supplier Device Package 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17)

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