OMAPL137DZKBT3
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Texas Instruments OMAPL137DZKBT3

Manufacturer No:
OMAPL137DZKBT3
Manufacturer:
Texas Instruments
Package:
Bulk
Description:
IC MPU OMAP-L1X 375MHZ 256BGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The OMAP-L137 device, produced by Texas Instruments, is a low-power applications processor that integrates a dual-core architecture. It combines an ARM926EJ-S RISC MPU and a TMS320C674x VLIW DSP core, providing the benefits of both DSP and RISC technologies. This processor is designed to consume significantly lower power compared to other members of the TMS320C6000 platform of DSPs. It supports robust operating systems, rich user interfaces, and high processing performance, making it ideal for various applications requiring mixed processor solutions.

Key Specifications

Feature Specification
Processor Cores ARM926EJ-S RISC MPU and TMS320C674x VLIW DSP core
Core Frequencies 375 MHz (1.2V) or 456 MHz (1.3V) for both ARM and DSP cores
Instruction Set 32-bit and 16-bit (Thumb) instructions for ARM; VLIW instructions for DSP
Memory 16KB I-Cache, 16KB D-Cache, 8KB RAM (Vector Table), 64KB ROM for ARM; 32KB L1 Data Cache, 256KB Unified Mapped RAM/Cache (L2) for DSP
Peripherals 10/100 Mbps Ethernet MAC, USB 1.1 and USB 2.0, SPI, I2C, UART, Multichannel Audio Serial Ports (McASPs), Enhanced Pulse Width Modulators (eQEP)
Package 256-Ball Pb-Free Plastic Ball Grid Array (PBGA), 17 mm x 17 mm, 1 mm pitch
Operating Voltage 1.2V / 1.3V core, 3.3V / 1.8V I/O
Temperature Range Commercial, Industrial, Extended, or Automotive temperature ranges

Key Features

  • Dual-core architecture combining ARM926EJ-S RISC MPU and TMS320C674x VLIW DSP core.
  • Supports up to four single-precision additions per clock and two floating-point reciprocal approximation operations per cycle.
  • 10/100 Mbps Ethernet MAC with RMII and MDIO interfaces.
  • Host-Port Interface (HPI) with 16-bit-wide muxed address/data bus.
  • Programmable Real-Time Unit Subsystem (PRUSS) with two independent PRU cores.
  • Three Enhanced Pulse Width Modulators (eQEP) and three Multichannel Audio Serial Ports (McASPs).
  • Support for TDM, I2S, and similar audio formats.
  • Rich set of development tools including C compilers, DSP assembly optimizer, and Windows debugger interface.

Applications

  • A/V Receivers
  • Home Theatre Systems
  • Automotive Amplifiers
  • Professional Audio
  • Soundbars
  • Network Streaming Audio

Q & A

  1. What are the core components of the OMAP-L137 processor?

    The OMAP-L137 processor includes an ARM926EJ-S RISC MPU and a TMS320C674x VLIW DSP core.

  2. What are the operating frequencies of the ARM and DSP cores?

    The cores operate at 375 MHz (1.2V) or 456 MHz (1.3V).

  3. What types of memory does the OMAP-L137 have?

    The ARM core has 16KB I-Cache, 16KB D-Cache, 8KB RAM (Vector Table), and 64KB ROM. The DSP core has 32KB L1 Data Cache and 256KB Unified Mapped RAM/Cache (L2).

  4. What peripherals are supported by the OMAP-L137?

    The processor supports 10/100 Mbps Ethernet MAC, USB 1.1 and USB 2.0, SPI, I2C, UART, Multichannel Audio Serial Ports (McASPs), and Enhanced Pulse Width Modulators (eQEP).

  5. What is the package type and size of the OMAP-L137?

    The OMAP-L137 is packaged in a 256-Ball Pb-Free Plastic Ball Grid Array (PBGA), measuring 17 mm x 17 mm with a 1 mm pitch.

  6. What are the operating voltage and temperature ranges for the OMAP-L137?

    The core operates at 1.2V / 1.3V, with I/O voltages at 3.3V / 1.8V. It supports commercial, industrial, extended, or automotive temperature ranges.

  7. What development tools are available for the OMAP-L137?

    The processor is supported by C compilers, a DSP assembly optimizer, and a Windows debugger interface.

  8. What are some common applications of the OMAP-L137?

    Common applications include A/V Receivers, Home Theatre Systems, Automotive Amplifiers, Professional Audio, Soundbars, and Network Streaming Audio.

  9. How does the Programmable Real-Time Unit Subsystem (PRUSS) function?

    The PRUSS includes two independent PRU cores that can be controlled via software and are used for real-time processing tasks.

  10. What audio formats are supported by the Multichannel Audio Serial Ports (McASPs)?

    The McASPs support TDM, I2S, and similar audio formats.

Product Attributes

Core Processor:ARM926EJ-S
Number of Cores/Bus Width:1 Core, 32-Bit
Speed:375MHz
Co-Processors/DSP:Signal Processing; C674x, System Control; CP15
RAM Controllers:SDRAM
Graphics Acceleration:No
Display & Interface Controllers:LCD
Ethernet:10/100Mbps (1)
SATA:- 
USB:USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O:1.8V, 3.3V
Operating Temperature:-40°C ~ 125°C (TJ)
Security Features:- 
Package / Case:256-BGA
Supplier Device Package:256-BGA (17x17)
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Similar Products

Part Number OMAPL137DZKBT3 OMAPL137BZKBT3 OMAPL137CZKBT3 OMAPL137DZKBA3
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Obsolete Obsolete Active
Core Processor ARM926EJ-S ARM926EJ-S ARM926EJ-S ARM926EJ-S
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit
Speed 375MHz 375MHz 375MHz 375MHz
Co-Processors/DSP Signal Processing; C674x, System Control; CP15 Signal Processing; C674x, System Control; CP15 Signal Processing; C674x, System Control; CP15 Signal Processing; C674x, System Control; CP15
RAM Controllers SDRAM SDRAM SDRAM SDRAM
Graphics Acceleration No No No No
Display & Interface Controllers LCD LCD LCD LCD
Ethernet 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps (1)
SATA - - - -
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1) USB 1.1 + PHY (1), USB 2.0 + PHY (1) USB 1.1 + PHY (1), USB 2.0 + PHY (1) USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V
Operating Temperature -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 105°C (TJ)
Security Features - - - -
Package / Case 256-BGA 256-BGA 256-BGA 256-BGA
Supplier Device Package 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17)

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