OMAPL137DZKBA3
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Texas Instruments OMAPL137DZKBA3

Manufacturer No:
OMAPL137DZKBA3
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC MPU OMAP-L1X 375MHZ 256BGA
Delivery:
Payment:
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Product Introduction

Overview

The OMAP-L137DZKBA3 is a low-power applications processor developed by Texas Instruments. This device is part of the OMAP-L137 series and features a dual-core architecture, combining an ARM926EJ-S RISC processor core with a TMS320C674x DSP core. This integration provides the benefits of both DSP and RISC technologies, enabling robust operating systems support, rich user interfaces, and high processing performance. The OMAP-L137 is designed to consume significantly lower power compared to other members of the TMS320C6000 platform of DSPs, making it suitable for a variety of applications requiring high performance and low power consumption.

Key Specifications

Feature Specification
Processor Cores ARM926EJ-S RISC MPU, TMS320C674x VLIW DSP
Core Frequencies ARM: 375 MHz (1.2V), 456 MHz (1.3V); DSP: 375 MHz (1.2V), 456 MHz (1.3V)
Memory ARM: 16KB I-Cache, 16KB D-Cache, 8KB RAM (Vector Table), 64KB ROM; DSP: 32KB L1 Data Cache, 256KB Unified Mapped RAM/Cache (L2)
External Memory Interfaces EMIFA: 16/32-bit, up to 256MB SDRAM; EMIFB: 16-bit, up to 128MB SDRAM, NOR, NAND, Flash
Peripherals 10/100 Mbps Ethernet MAC, 2x I2C, 2x SPI, 3x UART, 3x McASP, USB 1.1/2.0, HPI, PRUSS
Package 256-Ball Pb-Free Plastic Ball Grid Array (PBGA), 17 mm x 17 mm, 1 mm pitch
Operating Temperature Commercial, Industrial, Extended, or Automotive
Max Junction Temperature 105 °C

Key Features

  • Dual-core architecture with ARM926EJ-S RISC MPU and TMS320C674x VLIW DSP
  • Supports up to four single-precision additions per clock and two floating-point reciprocal approximation operations per cycle
  • 10/100 Mbps Ethernet MAC (EMAC) with RMII and MDIO interfaces
  • Programmable Real-Time Unit Subsystem (PRUSS) with two independent PRU cores
  • Three multichannel audio serial ports (McASPs) supporting TDM, I2S, and similar formats
  • 32-bit load and store RISC architecture with DSP instruction extensions
  • On-chip memory includes 16KB instruction and data caches for ARM, and 32KB L1 data cache for DSP
  • Support for MMC, SD, and SDIO cards
  • Real-time clock with 32-kHz oscillator and separate power rail

Applications

  • A/V Receivers
  • Home Theatre Systems
  • Automotive Amplifiers
  • Professional Audio
  • Soundbars
  • Network Streaming Audio

Q & A

  1. What are the core frequencies of the OMAP-L137DZKBA3?

    The core frequencies are 375 MHz at 1.2V and 456 MHz at 1.3V for both the ARM926EJ-S and TMS320C674x DSP cores.

  2. What types of memory interfaces does the OMAP-L137DZKBA3 support?

    The device supports EMIFA for up to 256MB SDRAM and EMIFB for up to 128MB SDRAM, NOR, NAND, and Flash.

  3. What peripherals are available on the OMAP-L137DZKBA3?

    The device includes 10/100 Mbps Ethernet MAC, I2C, SPI, UART, McASP, USB 1.1/2.0, HPI, and PRUSS.

  4. What is the package type and size of the OMAP-L137DZKBA3?

    The package is a 256-Ball Pb-Free Plastic Ball Grid Array (PBGA) with a size of 17 mm x 17 mm and a 1 mm pitch.

  5. What are the operating temperature ranges for the OMAP-L137DZKBA3?

    The device operates in commercial, industrial, extended, or automotive temperature ranges.

  6. What is the maximum junction temperature for the OMAP-L137DZKBA3?

    The maximum junction temperature is 105 °C.

  7. Does the OMAP-L137DZKBA3 support audio interfaces?

    Yes, it supports three multichannel audio serial ports (McASPs) with TDM, I2S, and similar formats.

  8. What development tools are available for the OMAP-L137DZKBA3?

    The device has a complete set of development tools including C compilers, DSP assembly optimizer, and a Windows debugger interface.

  9. Can the OMAP-L137DZKBA3 be used in safety-critical applications?

    Texas Instruments recommends that these devices not be used in safety-critical applications.

  10. What is the purpose of the PRUSS in the OMAP-L137DZKBA3?

    The PRUSS (Programmable Real-Time Unit Subsystem) includes two independent PRU cores for real-time processing tasks.

Product Attributes

Core Processor:ARM926EJ-S
Number of Cores/Bus Width:1 Core, 32-Bit
Speed:375MHz
Co-Processors/DSP:Signal Processing; C674x, System Control; CP15
RAM Controllers:SDRAM
Graphics Acceleration:No
Display & Interface Controllers:LCD
Ethernet:10/100Mbps (1)
SATA:- 
USB:USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O:1.8V, 3.3V
Operating Temperature:-40°C ~ 105°C (TJ)
Security Features:- 
Package / Case:256-BGA
Supplier Device Package:256-BGA (17x17)
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Similar Products

Part Number OMAPL137DZKBA3 OMAPL137DZKBT3 OMAPL137BZKBA3 OMAPL137CZKBA3
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Obsolete Obsolete
Core Processor ARM926EJ-S ARM926EJ-S ARM926EJ-S ARM926EJ-S
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit
Speed 375MHz 375MHz 375MHz 375MHz
Co-Processors/DSP Signal Processing; C674x, System Control; CP15 Signal Processing; C674x, System Control; CP15 Signal Processing; C674x, System Control; CP15 Signal Processing; C674x, System Control; CP15
RAM Controllers SDRAM SDRAM SDRAM SDRAM
Graphics Acceleration No No No No
Display & Interface Controllers LCD LCD LCD LCD
Ethernet 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps (1)
SATA - - - -
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1) USB 1.1 + PHY (1), USB 2.0 + PHY (1) USB 1.1 + PHY (1), USB 2.0 + PHY (1) USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V
Operating Temperature -40°C ~ 105°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 105°C (TJ) -40°C ~ 105°C (TJ)
Security Features - - - -
Package / Case 256-BGA 256-BGA 256-BGA 256-BGA
Supplier Device Package 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17) 256-BGA (17x17)

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