SPC582B54E3L000X
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STMicroelectronics SPC582B54E3L000X

Manufacturer No:
SPC582B54E3L000X
Manufacturer:
STMicroelectronics
Package:
Tape & Reel (TR)
Description:
IC MCU 32BIT 768KB FLSH 100ETQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The SPC582B54E3L000X microcontroller, produced by STMicroelectronics, is part of the SPC582Bx family, which supersedes the SPC560Bx family. This device is built on the legacy of the SPC5x products and introduces new features to meet future requirements such as ASIL-B classification, a high number of ISO CAN-FD channels, and significant power and performance improvements (MIPS per mW).

This microcontroller is AEC-Q100 qualified, ensuring it meets stringent automotive standards. It features a high-performance e200z2 single-core CPU with a 32-bit Power Architecture technology, operating at a core frequency of up to 80 MHz. The device also supports variable length encoding (VLE) and floating-point operations with end-to-end error correction.

Key Specifications

Feature Description
Core High performance e200z2 single core, 32-bit Power Architecture technology CPU
Core Frequency Up to 80 MHz
Flash Memory 1088 KB (1024 KB code flash + 64 KB data flash)
SRAM 96 KB on-chip general-purpose SRAM
DMA Multi-channel direct memory access controller (eDMA) with 16 channels
Interrupt Controller 1 interrupt controller (INTC)
Safety Features Comprehensive new generation ASIL-B safety concept, FCCU, MEMU, CRC unit, and end-to-end error correction code (e2eECC) logic
ADC 1 enhanced 12-bit SAR analog-to-digital converter with up to 27 channels
Communication Interfaces 6 LINFlexD modules, 4 DSPI modules, 7 MCAN interfaces with ISO CAN FD support
Operating Temperature -40 °C to 150 °C
Package TQFP 100 14x14x1.0 mm

Key Features

  • High Performance CPU: e200z2 single core with 32-bit Power Architecture technology and a core frequency of up to 80 MHz.
  • Advanced Safety Features: Comprehensive ASIL-B safety concept, including FCCU, MEMU, CRC unit, and end-to-end error correction code (e2eECC) logic.
  • Memory and Storage: 1088 KB on-chip flash memory (1024 KB code flash + 64 KB data flash) and 96 KB on-chip general-purpose SRAM.
  • Communication Interfaces: 6 LINFlexD modules, 4 DSPI modules, and 7 MCAN interfaces with ISO CAN FD support.
  • Analog-to-Digital Conversion: 1 enhanced 12-bit SAR analog-to-digital converter with up to 27 channels.
  • Enhanced Modular IO Subsystem (eMIOS): Up to 32 timed I/O channels with 16-bit counter resolution.
  • Power Management: Advanced and flexible supply scheme with an on-chip voltage regulator for 1.2 V core logic supply.
  • Debug and Trace Interface: Nexus Class 3 debug and trace interface.

Applications

The SPC582B54E3L000X microcontroller is designed for automotive general-purpose applications, particularly those requiring high safety standards and advanced communication capabilities. It is suitable for use in various automotive systems such as:

  • Engine control units
  • Transmission control units
  • Body control modules
  • Safety and security systems
  • Advanced driver-assistance systems (ADAS)

Q & A

  1. What is the core architecture of the SPC582B54E3L000X microcontroller?

    The SPC582B54E3L000X features a high-performance e200z2 single core with 32-bit Power Architecture technology.

  2. What is the maximum core frequency of the SPC582B54E3L000X?

    The core frequency can be as high as 80 MHz.

  3. How much on-chip flash and SRAM does the SPC582B54E3L000X have?

    The device has 1088 KB of on-chip flash memory (1024 KB code flash + 64 KB data flash) and 96 KB of on-chip general-purpose SRAM.

  4. What safety features does the SPC582B54E3L000X include?

    The device includes a comprehensive ASIL-B safety concept, FCCU, MEMU, CRC unit, and end-to-end error correction code (e2eECC) logic.

  5. What types of communication interfaces are available on the SPC582B54E3L000X?

    The device features 6 LINFlexD modules, 4 DSPI modules, and 7 MCAN interfaces with ISO CAN FD support.

  6. What is the operating temperature range of the SPC582B54E3L000X?

    The operating temperature range is -40 °C to 150 °C.

  7. What package type is the SPC582B54E3L000X available in?

    The device is available in a TQFP 100 14x14x1.0 mm package.

  8. Is the SPC582B54E3L000X AEC-Q100 qualified?

    Yes, the SPC582B54E3L000X is AEC-Q100 qualified.

  9. What is the purpose of the Body Cross Triggering Unit (BCTU) in the SPC582B54E3L000X?

    The BCTU triggers ADC conversions from any eMIOS channel or up to 2 dedicated PIT_RTIs and allows synchronization with ADC to avoid collision.

  10. Does the SPC582B54E3L000X support factory programming?

    Yes, the device supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART via the Boot Assist Flash (BAF).

Product Attributes

Core Processor:e200z2
Core Size:32-Bit Single-Core
Speed:64MHz
Connectivity:CANbus, I²C, LINbus, SPI
Peripherals:DMA, WDT
Number of I/O:32
Program Memory Size:768KB (768K x 8)
Program Memory Type:Flash
EEPROM Size:64K x 8
RAM Size:96K x 8
Voltage - Supply (Vcc/Vdd):3V ~ 5.5V
Data Converters:A/D 27x12b SAR
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:100-TQFP Exposed Pad
Supplier Device Package:100-eTQFP (14x14)
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