Overview
The P1014NSN5HFB557 is a microprocessor from Freescale Semiconductor, now part of NXP Semiconductors. This component is part of the QorIQ family of 32-bit Power Architecture System-on-Chip (SoC) processors. It is designed to provide high performance and low power consumption, making it suitable for a variety of applications in the embedded systems market.
Key Specifications
| Specification | Details |
|---|---|
| Manufacturer | NXP Semiconductors (Freescale Semiconductor) |
| Part Number | P1014NSN5HFB557 |
| Package Type | FBGA425 - Fine-pitch Ball Grid Array |
| Package Dimensions | 19 mm x 19 mm x 1.7 mm |
| Bump Pitch | 0.8 mm |
| Number of Bumps | 425 |
| Moisture Sensitivity Level | 3 (168 hours) |
| Core Frequency | 800 MHz |
| Architecture | 32-bit Power Architecture |
Key Features
- High-performance 32-bit Power Architecture core
- Low power consumption
- Integrated peripherals and interfaces for comprehensive system support
- Advanced security features for secure data processing
- High-speed memory interfaces and bus architectures
Applications
The P1014NSN5HFB557 is versatile and can be used in various applications, including:
- Networking and communications equipment
- Industrial control systems
- Aerospace and defense systems
- Automotive systems
- Medical devices and healthcare systems
Q & A
- What is the core frequency of the P1014NSN5HFB557? The core frequency is 800 MHz.
- What is the package type of the P1014NSN5HFB557? The package type is FBGA425 - Fine-pitch Ball Grid Array.
- What is the moisture sensitivity level of the P1014NSN5HFB557? The moisture sensitivity level is 3 (168 hours).
- What architecture does the P1014NSN5HFB557 use? It uses the 32-bit Power Architecture.
- What are some typical applications of the P1014NSN5HFB557? Typical applications include networking and communications equipment, industrial control systems, aerospace and defense systems, automotive systems, and medical devices.
- Who is the manufacturer of the P1014NSN5HFB557? The manufacturer is NXP Semiconductors (formerly Freescale Semiconductor).
- What is the part number of this microprocessor? The part number is P1014NSN5HFB557.
- What is the package size of the P1014NSN5HFB557? The package dimensions are 19 mm x 19 mm x 1.7 mm.
- How many bumps does the FBGA425 package have? The FBGA425 package has 425 bumps.
- What is the bump pitch of the FBGA425 package? The bump pitch is 0.8 mm.
