SPC5675KFF0MMS2R
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NXP USA Inc. SPC5675KFF0MMS2R

Manufacturer No:
SPC5675KFF0MMS2R
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 2MB FLASH 473MAPBGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The SPC5675KFF0MMS2R is a microcontroller produced by NXP USA Inc., designed for various automotive and industrial applications. This device is part of the SPC5675 family, known for its high performance and reliability in demanding environments. The microcontroller features advanced safety and security mechanisms, making it suitable for critical systems.

Key Specifications

ParameterValue
ManufacturerNXP USA Inc.
Package TypeFBGA-176
Minimum Package Quantity750
Minimum Order Quantity750
Lead Time99 weeks
Budgetary Price (10K units)Available upon request
PackingREEL-Reel 13" Q1/T1 in Drypack

Key Features

  • High-performance e200z7 core with 2MB of flash memory and 256KB of SRAM
  • Advanced safety and security features, including multiple watchdogs and a hardware security module
  • Support for various communication protocols such as CAN, LIN, and Ethernet
  • Integrated peripherals including ADC, DAC, and timers
  • Operating temperature range suitable for automotive and industrial applications

Applications

The SPC5675KFF0MMS2R microcontroller is designed for use in various applications, including:

  • Automotive systems such as engine control units, transmission control units, and safety systems
  • Industrial control systems, including motor control and automation
  • Other embedded systems requiring high performance and reliability

Q & A

  1. What is the SPC5675KFF0MMS2R microcontroller used for? The SPC5675KFF0MMS2R is used in automotive and industrial applications requiring high performance and reliability.
  2. Who is the manufacturer of the SPC5675KFF0MMS2R? The manufacturer is NXP USA Inc.
  3. What is the package type of the SPC5675KFF0MMS2R? The package type is FBGA-176.
  4. What is the minimum order quantity for the SPC5675KFF0MMS2R? The minimum order quantity is 750 units.
  5. What are the key features of the SPC5675KFF0MMS2R? Key features include a high-performance e200z7 core, advanced safety and security features, and support for various communication protocols.
  6. What is the lead time for the SPC5675KFF0MMS2R? The lead time is 99 weeks.
  7. How is the SPC5675KFF0MMS2R packed? It is packed in REEL-Reel 13" Q1/T1 in Drypack.
  8. What are some common applications of the SPC5675KFF0MMS2R? Common applications include automotive systems, industrial control systems, and other embedded systems.
  9. What is the operating temperature range of the SPC5675KFF0MMS2R? The operating temperature range is suitable for automotive and industrial applications, though specific details can be found in the datasheet.
  10. Where can I find more detailed specifications for the SPC5675KFF0MMS2R? Detailed specifications can be found in the datasheet available on NXP's official website or through authorized distributors.

Product Attributes

Core Processor:e200z7d
Core Size:32-Bit Dual-Core
Speed:180MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals:DMA, POR, PWM, WDT
Number of I/O:- 
Program Memory Size:2MB (2M x 8)
Program Memory Type:Flash
EEPROM Size:64K x 8
RAM Size:512K x 8
Voltage - Supply (Vcc/Vdd):1.14V ~ 5.5V
Data Converters:A/D 34x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:473-LFBGA
Supplier Device Package:473-MAPBGA (19x19)
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Similar Products

Part Number SPC5675KFF0MMS2R SPC5675KFF0VMS2R SPC5674KFF0MMS2R SPC5675KFF0MMM2R SPC5675KFF0MMS2
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Obsolete Active Obsolete Obsolete Active
Core Processor e200z7d e200z7d e200z7d e200z7d e200z7d
Core Size 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core
Speed 180MHz 180MHz 180MHz 180MHz 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O - - - - -
Program Memory Size 2MB (2M x 8) 2MB (2M x 8) 1.5MB (1.5M x 8) 2MB (2M x 8) 2MB (2M x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size 64K x 8 64K x 8 64K x 8 64K x 8 64K x 8
RAM Size 512K x 8 512K x 8 384K x 8 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 1.14V ~ 5.5V 1.14V ~ 5.5V 1.14V ~ 5.5V 1.14V ~ 5.5V 1.14V ~ 5.5V
Data Converters A/D 34x12b A/D 34x12b A/D 34x12b A/D 22x12b A/D 34x12b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 473-LFBGA 473-LFBGA 473-LFBGA 257-LFBGA 473-LFBGA
Supplier Device Package 473-MAPBGA (19x19) 473-MAPBGA (19x19) 473-MAPBGA (19x19) 257-LFBGA (14x14) 473-MAPBGA (19x19)

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