S9S12ZVLS3F0MFM
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NXP USA Inc. S9S12ZVLS3F0MFM

Manufacturer No:
S9S12ZVLS3F0MFM
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MCU 16BIT 32KB FLASH 32QFN
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The S9S12ZVLS3F0MFM is a 16-bit mixed-signal microcontroller (MCU) from NXP Semiconductors, part of the S12ZVL family. This MCU is designed to provide a highly integrated and cost-effective solution for space-constrained automotive and industrial Local Interconnect Network (LIN) nodes. It features the S12Z core, which operates at a speed of up to 32 MHz and includes a range of peripherals and interfaces to support various applications.

Key Specifications

Parameter Specification
Core S12Z
Flash Memory 32 KB
EEPROM 2 KB
RAM 8 KB
Operating Speed Up to 32 MHz
Voltage Regulator 12 V to 5 V, 70 mA or up to 170 mA with external ballast
LIN Physical Layer Transceiver Integrated LIN Phy
ADC 10 channels, 12-bit resolution
Communication Interfaces SCI (2), SPI (1), I2C (1), MSCAN (1)
Timers 6 channels + 2 channels (16-bit)
PWM 8 channels (8-bit or 4 channels 16-bit)
GPIO 35 pins
Package 32-QFN
Operating Temperature Up to 150°C

Key Features

  • High Integration: Includes a 12 V to 5 V voltage regulator, LIN physical layer transceiver, and various analog and digital peripherals, making it ideal for space-constrained applications.
  • Functional Safety: Compliant with ISO 26262 through NXP's SafeAssure program, ensuring high reliability and safety in automotive and industrial applications.
  • Low System Cost: Direct connection with the battery and integrated LIN Phy, EVDD, and NGPIOs reduce system, qualification, and manufacturing costs.
  • High Reliability: High immunity to EMI and ESD stresses, with LIN 2.x compliance and +/- 8kV ESD capability.
  • Fast ADC: 10-channel, 12-bit ADC for fast and accurate analog-to-digital conversions.
  • Comprehensive Enablement Tools: Supported by evaluation boards, hardware, and software tools, which reduce development costs and time to market.

Applications

  • LIN Nodes: Ideal for automotive and industrial LIN nodes due to its integrated LIN Phy and low system cost.
  • LIN Switch Panels/User Interfaces: Suitable for switch panels, user interfaces, and other human-machine interface applications.
  • LIN Actuators and Sensors: Used in various actuator and sensor applications, such as ambient lighting, HVAC, and ultrasonic sensors.
  • Seat Positioning and Lighting Controls: Can be used in seat positioning systems and lighting control applications.

Q & A

  1. What is the core architecture of the S9S12ZVLS3F0MFM MCU?

    The S9S12ZVLS3F0MFM MCU features the S12Z core.

  2. What is the maximum operating speed of the S9S12ZVLS3F0MFM?

    The maximum operating speed is up to 32 MHz.

  3. What type of voltage regulator does the S9S12ZVLS3F0MFM have?

    The MCU includes a 12 V to 5 V voltage regulator, capable of delivering up to 70 mA or up to 170 mA with an external ballast.

  4. Does the S9S12ZVLS3F0MFM have integrated LIN capabilities?
  5. What is the resolution of the ADC in the S9S12ZVLS3F0MFM?

    The ADC has a 12-bit resolution with 10 channels.

  6. What communication interfaces are available on the S9S12ZVLS3F0MFM?

    The MCU supports SCI (2), SPI (1), I2C (1), and MSCAN (1) interfaces.

  7. What is the operating temperature range of the S9S12ZVLS3F0MFM?

    The operating temperature range is up to 150°C.

  8. Is the S9S12ZVLS3F0MFM compliant with any functional safety standards?
  9. What package options are available for the S9S12ZVLS3F0MFM?

    The MCU is available in a 32-QFN package.

  10. What are some typical applications of the S9S12ZVLS3F0MFM?

    Typical applications include LIN nodes, switch panels, actuators, sensors, HVAC, lighting controls, and seat positioning systems.

Product Attributes

Core Processor:S12Z
Core Size:16-Bit
Speed:32MHz
Connectivity:I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:LVD, POR, PWM, WDT
Number of I/O:19
Program Memory Size:32KB (32K x 8)
Program Memory Type:Flash
EEPROM Size:128 x 8
RAM Size:1K x 8
Voltage - Supply (Vcc/Vdd):5.5V ~ 18V
Data Converters:A/D 6x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount, Wettable Flank
Package / Case:32-VFQFN Exposed Pad
Supplier Device Package:32-HVQFN (5x5)
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Similar Products

Part Number S9S12ZVLS3F0MFM S9S12ZVLS3F0MFMR S9S12ZVLS3F0VFM S9S12ZVLS1F0MFM S9S12ZVLS3F0CFM
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active
Core Processor S12Z S12Z S12Z S12Z S12Z
Core Size 16-Bit 16-Bit 16-Bit 16-Bit 16-Bit
Speed 32MHz 32MHz 32MHz 32MHz 32MHz
Connectivity I²C, IrDA, LINbus, SCI, SPI, UART/USART I²C, IrDA, LINbus, SCI, SPI, UART/USART I²C, IrDA, LINbus, SCI, SPI, UART/USART I²C, IrDA, LINbus, SCI, SPI, UART/USART I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 19 19 19 19 19
Program Memory Size 32KB (32K x 8) 32KB (32K x 8) 32KB (32K x 8) 16KB (16K x 8) 32KB (32K x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size 128 x 8 128 x 8 128 x 8 128 x 8 128 x 8
RAM Size 1K x 8 1K x 8 1K x 8 1K x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 5.5V ~ 18V 5.5V ~ 18V 5.5V ~ 18V 5.5V ~ 18V 5.5V ~ 18V
Data Converters A/D 6x10b A/D 6x10b A/D 6x10b A/D 6x10b A/D 6x10b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank
Package / Case 32-VFQFN Exposed Pad 32-VFQFN Exposed Pad 32-VFQFN Exposed Pad 32-VFQFN Exposed Pad 32-VFQFN Exposed Pad
Supplier Device Package 32-HVQFN (5x5) 32-HVQFN (5x5) 32-HVQFN (5x5) 32-QFN-EP (5x5) 32-HVQFN (5x5)

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