MCIMX537CVP8C2R2
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NXP USA Inc. MCIMX537CVP8C2R2

Manufacturer No:
MCIMX537CVP8C2R2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MPU 32BIT ARM 529PBGA
Delivery:
Payment:
iso14001
iso45001
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Product Introduction

Overview

The MCIMX537CVP8C2R2 is a high-performance microprocessor IC from NXP USA Inc., part of the i.MX53 family. This device is built around the ARM® Cortex®-A8 core, operating at a frequency of up to 800 MHz. It is designed to balance performance and power efficiency, making it suitable for a wide range of advanced applications.

Key Specifications

ParameterValue
Core TypeARM® Cortex®-A8
Number of Cores1
Bit Width32-Bit
Operating FrequencyUp to 800 MHz
Package Type529-FBGA (19x19)
PackingTape & Reel (TR)

Key Features

  • High-performance ARM® Cortex®-A8 core for efficient processing.
  • Operating frequency up to 800 MHz for demanding applications.
  • 32-bit architecture for robust data handling.
  • 529-FBGA package for compact and reliable integration.
  • Optimized for both performance and power efficiency.

Applications

The MCIMX537CVP8C2R2 is ideal for various high-end and advanced applications, including but not limited to:

  • Industrial automation systems.
  • Medical devices requiring high processing power.
  • Aerospace and defense systems.
  • Automotive infotainment and control systems.
  • Advanced consumer electronics.

Q & A

  1. What is the core type of the MCIMX537CVP8C2R2?
    The core type is ARM® Cortex®-A8.
  2. What is the operating frequency of the MCIMX537CVP8C2R2?
    The operating frequency is up to 800 MHz.
  3. What is the package type of the MCIMX537CVP8C2R2?
    The package type is 529-FBGA (19x19).
  4. What is the bit width of the MCIMX537CVP8C2R2?
    The bit width is 32-bit.
  5. What is the packing method for the MCIMX537CVP8C2R2?
    The packing method is Tape & Reel (TR).
  6. Who is the manufacturer of the MCIMX537CVP8C2R2?
    The manufacturer is NXP USA Inc.
  7. What are some typical applications of the MCIMX537CVP8C2R2?
    Typical applications include industrial automation, medical devices, aerospace and defense systems, automotive systems, and advanced consumer electronics.
  8. What is the significance of the 'R2' in the part number MCIMX537CVP8C2R2?
    The 'R2' typically indicates the specific configuration or revision of the part.
  9. How many cores does the MCIMX537CVP8C2R2 have?
    The MCIMX537CVP8C2R2 has one core.
  10. What are the key benefits of using the MCIMX537CVP8C2R2?
    The key benefits include high performance, power efficiency, and compact packaging.

Product Attributes

Core Processor:ARM® Cortex®-A8
Number of Cores/Bus Width:1 Core, 32-Bit
Speed:800MHz
Co-Processors/DSP:Multimedia; NEON™ SIMD
RAM Controllers:LPDDR2, DDR2, DDR3
Graphics Acceleration:Yes
Display & Interface Controllers:Keypad, LCD, LVDS
Ethernet:10/100Mbps (1)
SATA:SATA 1.5Gbps (1)
USB:USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Voltage - I/O:1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature:-40°C ~ 125°C (TJ)
Security Features:
Package / Case:529-FBGA
Supplier Device Package:529-FBGA (19x19)
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Similar Products

Part Number MCIMX537CVP8C2R2 MCIMX537CVV8C2R2
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Active Obsolete
Core Processor ARM® Cortex®-A8 ARM® Cortex®-A8
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 800MHz 800MHz
Co-Processors/DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, DDR2, DDR3 LPDDR2, DDR2, DDR3
Graphics Acceleration Yes Yes
Display & Interface Controllers Keypad, LCD, LVDS Keypad, LCD
Ethernet 10/100Mbps (1) 10/100Mbps (1)
SATA SATA 1.5Gbps (1) SATA 1.5Gbps (1)
USB USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) USB 2.0 (2), USB 2.0 + PHY (2)
Voltage - I/O 1.3V, 1.8V, 2.775V, 3.3V 1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature -40°C ~ 125°C (TJ) -40°C ~ 85°C (TA)
Security Features
Package / Case 529-FBGA 529-FBGA
Supplier Device Package 529-FBGA (19x19) 529-FBGA (19x19)

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