MC9S12XEP100CVL
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NXP USA Inc. MC9S12XEP100CVL

Manufacturer No:
MC9S12XEP100CVL
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 16BIT 1MB FLASH 208MAPBGA
Delivery:
Payment:
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Product Introduction

Overview

The MC9S12XEP100CVL microcontroller, produced by NXP USA Inc., is a part of the MC9S12XE Family, which builds upon the innovations of the MC9S12XD Family. This microcontroller is designed to deliver enhanced system integrity and greater functionality, making it suitable for automotive multiplexing and generic auto body applications. It combines the advantages of 32-bit performance with the efficiencies of a 16-bit MCU, including low cost, power consumption, and code-size efficiency.

Key Specifications

ParameterSpecification
Flash MemoryUp to 1 MB
Package Options208-pin MAPBGA, 144-pin LQFP, 112-pin LQFP, 80-pin QFP
CPU16-bit CPU12X
Operating Voltage3.3V-5%/+10% to 5.0V+10%
Maximum CPU Bus Frequency50 MHz
Maximum XGATE Bus Frequency100 MHz
Ambient Temperature Range-40°C to 125°C
Memory Protection Unit (MPU)8 address regions definable per active program task
Error Correction Code (ECC)On Flash memory with 1-bit fault correction and 2-bit fault detection
Enhanced EEPROMImproved EEPROM functionality

Key Features

  • Memory Protection Unit (MPU) with 8 address regions definable per active program task and address range granularity as low as 8 bytes.
  • Error Correction Code (ECC) on Flash memory with 1-bit fault correction and 2-bit fault detection.
  • Enhanced EEPROM functionality.
  • Frequency Modulated Phase Locked Loop (IPLL) and faster Analog-to-Digital Converter (ATD).
  • Enhanced SPI allowing 8 or 16 bit data size.
  • Full CAN and LIN master or slave capability when used with integrated modules.
  • Improved EMC performance with separate supply for internal voltage regulator and I/O.

Applications

The MC9S12XEP100CVL microcontroller is primarily targeted at automotive multiplexing and generic auto body applications. Its features make it suitable for systems requiring high system integrity, low power consumption, and efficient code execution.

Q & A

  1. What is the maximum flash memory capacity of the MC9S12XEP100CVL? The maximum flash memory capacity is up to 1 MB.
  2. What are the package options available for the MC9S12XEP100CVL? The package options include 208-pin MAPBGA, 144-pin LQFP, 112-pin LQFP, and 80-pin QFP.
  3. What is the maximum CPU bus frequency of the MC9S12XEP100CVL? The maximum CPU bus frequency is 50 MHz.
  4. Does the MC9S12XEP100CVL support ECC on Flash memory? Yes, it supports ECC with 1-bit fault correction and 2-bit fault detection.
  5. What are the key features of the Memory Protection Unit (MPU) in the MC9S12XEP100CVL? The MPU has 8 address regions definable per active program task with address range granularity as low as 8 bytes.
  6. What are the primary applications of the MC9S12XEP100CVL microcontroller? The primary applications are automotive multiplexing and generic auto body applications.
  7. Does the MC9S12XEP100CVL support CAN and LIN protocols? Yes, it supports full CAN and LIN master or slave capability when used with integrated modules.
  8. What is the ambient temperature range of the MC9S12XEP100CVL? The ambient temperature range is -40°C to 125°C.
  9. What is the purpose of the Frequency Modulated Phase Locked Loop (IPLL) in the MC9S12XEP100CVL? The IPLL is used to provide a stable clock signal, enhancing the overall system performance.
  10. How does the MC9S12XEP100CVL improve EMC performance? It improves EMC performance through separate supplies for the internal voltage regulator and I/O, allowing optimized EMC filtering.

Product Attributes

Core Processor:HCS12X
Core Size:16-Bit
Speed:50MHz
Connectivity:CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals:LVD, POR, PWM, WDT
Number of I/O:152
Program Memory Size:1MB (1M x 8)
Program Memory Type:Flash
EEPROM Size:4K x 8
RAM Size:64K x 8
Voltage - Supply (Vcc/Vdd):1.72V ~ 5.5V
Data Converters:A/D 32x12b
Oscillator Type:External
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:208-BGA
Supplier Device Package:208-BGA (17x17)
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Similar Products

Part Number MC9S12XEP100CVL MC9S12XEP100MVL MC9S12XEP100CAL
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active
Core Processor HCS12X HCS12X HCS12X
Core Size 16-Bit 16-Bit 16-Bit
Speed 50MHz 50MHz 50MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 152 152 91
Program Memory Size 1MB (1M x 8) 1MB (1M x 8) 1MB (1M x 8)
Program Memory Type Flash Flash Flash
EEPROM Size 4K x 8 4K x 8 4K x 8
RAM Size 64K x 8 64K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 1.72V ~ 5.5V 1.72V ~ 5.5V 1.72V ~ 5.5V
Data Converters A/D 32x12b A/D 32x12b A/D 16x12b
Oscillator Type External External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 208-BGA 208-BGA 112-LQFP
Supplier Device Package 208-BGA (17x17) 208-BGA (17x17) 112-LQFP (20x20)

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