MC9S12DG256VPVE
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NXP USA Inc. MC9S12DG256VPVE

Manufacturer No:
MC9S12DG256VPVE
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MCU 16BIT 256KB FLASH 112LQFP
Delivery:
Payment:
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Product Introduction

Overview

The MC9S12DG256VPVE is a 16-bit microcontroller (MCU) from NXP USA Inc., part of the HCS12 family. This MCU is built on the HCS12 CPU core, which is opcode compatible with the 68HC11 and 68HC12 architectures, providing a seamless migration path for applications requiring larger memory, more peripherals, and higher performance. The device operates at a bus speed of 25 MHz, offering a minimum instruction cycle time of 40 ns at 5V. It features a C-optimized architecture that produces extremely compact code, making it highly efficient for various applications.

Key Specifications

Specification Value
Controller Family/Series S12D
CPU Speed 25 MHz
Program Memory Size 256 KB Flash
RAM Memory Size 12 KB
EEPROM Memory Size 4 KB
No. of Pins 112 Pins
MCU Case Style LQFP
No. of I/O's 91 I/O's
Embedded Interface Type I2C, SCI, SPI
Supply Voltage Min 2.35 V
Supply Voltage Max 2.75 V
Operating Temperature Range -40°C to +85°C
No. of ADC Inputs 16 (2 x 8-channel 10-bit ADCs)
No. of PWM Channels 8 (8-bit or 16-bit)
No. of Timers 1 (Enhanced Capture Timer)
Peripherals ADC, PWM, Timer, CAN 2.0 modules, Inter-IC Bus

Key Features

  • High-Performance 16-bit HCS12 CPU Core: Operates at 25 MHz with a minimum instruction cycle time of 40 ns at 5V, and is opcode compatible with the 68HC11 and 68HC12 architectures.
  • On-Chip Debug Interface: Dedicated serial debug interface with on-chip breakpoints and real-time in-circuit emulation and debug capabilities.
  • Analog-to-Digital Converters (ADCs): Two 8-channel 10-bit ADCs with 7 µs single conversion time and scan mode available.
  • Clock Generation Module with Phase-Lock Loop (PLL): Programmable clock frequency with 1024 options, clock monitor, and self-clock mode.
  • Enhanced Capture Timer: 8-channel, 16-bit timer with input capture, output compare, and pulse accumulator functions.
  • Pulse-Wide Modulation (PWM): 8-channel, 8-bit or 4-channel, 16-bit PWM with center-aligned operation.
  • Serial Communications Interfaces: Two asynchronous serial communications interfaces (SCI) and three high-speed Serial Peripheral Interfaces (SPI).
  • CAN 2.0 Modules and Inter-IC Bus (I2C): Multiple network modules supporting efficient communications between different network buses).

Applications

  • Automotive Applications: Suitable for various automotive control units due to its support for CAN 2.0 modules and other automotive-specific features).
  • Industrial Control: Used in industrial control systems that require high performance, multiple peripherals, and robust communication capabilities).

Q & A

  1. What is the CPU speed of the MC9S12DG256VPVE?

    The CPU speed is 25 MHz).

  2. How much program memory does the MC9S12DG256VPVE have?

    The device has 256 KB of Flash memory).

  3. What is the operating temperature range of the MC9S12DG256VPVE?

    The operating temperature range is -40°C to +85°C).

  4. Does the MC9S12DG256VPVE support CAN 2.0 modules?

    Yes, it supports multiple CAN 2.0 modules).

  5. What types of serial communication interfaces are available on the MC9S12DG256VPVE?

    The device features two asynchronous serial communications interfaces (SCI) and three high-speed Serial Peripheral Interfaces (SPI)).

  6. How many ADC channels does the MC9S12DG256VPVE have?

    The device has two 8-channel 10-bit ADCs, totaling 16 ADC inputs).

  7. What is the package type of the MC9S12DG256VPVE?

    The package type is LQFP with 112 pins).

  8. Does the MC9S12DG256VPVE have an on-chip debug interface?

    Yes, it has a dedicated serial debug interface with on-chip breakpoints and real-time in-circuit emulation and debug capabilities).

  9. What are the key applications of the MC9S12DG256VPVE?

    The key applications include automotive and industrial control systems).

  10. How much RAM and EEPROM does the MC9S12DG256VPVE have?

    The device has 12 KB of RAM and 4 KB of EEPROM).

Product Attributes

Core Processor:HCS12
Core Size:16-Bit
Speed:25MHz
Connectivity:CANbus, I²C, SCI, SPI
Peripherals:PWM, WDT
Number of I/O:91
Program Memory Size:256KB (256K x 8)
Program Memory Type:Flash
EEPROM Size:4K x 8
RAM Size:12K x 8
Voltage - Supply (Vcc/Vdd):2.35V ~ 5.25V
Data Converters:A/D 16x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:112-LQFP
Supplier Device Package:112-LQFP (20x20)
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Similar Products

Part Number MC9S12DG256VPVE MC9S12DT256VPVE MC9S12DJ256VPVE MC9S12DG256CPVE MC9S12DG256MPVE
Manufacturer NXP USA Inc. Freescale Semiconductor NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Obsolete Active Active
Core Processor HCS12 HCS12 HCS12 HCS12 HCS12
Core Size 16-Bit 16-Bit 16-Bit 16-Bit 16-Bit
Speed 25MHz 25MHz 25MHz 25MHz 25MHz
Connectivity CANbus, I²C, SCI, SPI CANbus, I²C, SCI, SPI CANbus, I²C, SCI, SPI CANbus, I²C, SCI, SPI CANbus, I²C, SCI, SPI
Peripherals PWM, WDT PWM, WDT PWM, WDT PWM, WDT PWM, WDT
Number of I/O 91 91 91 91 91
Program Memory Size 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type Flash Flash Flash Flash Flash
EEPROM Size 4K x 8 4K x 8 4K x 8 4K x 8 4K x 8
RAM Size 12K x 8 12K x 8 12K x 8 12K x 8 12K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.25V 2.35V ~ 5.25V 2.35V ~ 5.25V 2.35V ~ 5.25V 2.35V ~ 5.25V
Data Converters A/D 16x10b A/D 8x10b A/D 16x10b A/D 16x10b A/D 16x10b
Oscillator Type Internal Internal Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 112-LQFP 112-LQFP 112-LQFP 112-LQFP 112-LQFP
Supplier Device Package 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20)

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