MC33PF8200D2ESR2
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NXP USA Inc. MC33PF8200D2ESR2

Manufacturer No:
MC33PF8200D2ESR2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
POWER MANAGEMENT IC I.MX8 PRE-PR
Delivery:
Payment:
iso14001
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iso9001
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Product Introduction

Overview

The MC33PF8200D2ESR2 is a high-performance power management integrated circuit (PMIC) designed by NXP USA Inc. for use in advanced processing applications. This PMIC is specifically tailored for i.MX 8 and S32x processor-based systems, making it an ideal choice for demanding environments such as automotive infotainment, high-end consumer electronics, and industrial applications. The device integrates multiple power management channels to efficiently supply power to the processor, memory, and various peripherals, ensuring reliable and efficient system operation.

Key Specifications

Parameter Min Typ Max Unit
Ambient Operating Temperature -40 105 °C
Junction Temperature -40 150 °C
Storage Temperature Range -55 150 °C
Peak Package Reflow Temperature 260 °C
Input Voltage Range 2.7 5.5 V
Package Type 56-HVQFN (8x8)
I2C Communication Frequency 3.4 MHz

Key Features

  • Up to seven high-efficiency buck converters for efficient power supply to the processor and peripherals.
  • Four linear regulators with load switch options for flexible power management.
  • RTC supply and coin cell charger for real-time clock and battery management.
  • Watchdog timer/monitor for system reliability and safety.
  • Monitoring circuit to fit ASIL B safety level, ensuring high safety standards in automotive applications.
  • One-time programmable device configuration to store key startup configurations, reducing the need for external components.
  • High-speed I2C communication interface (3.4 MHz) for adjustable regulator parameters after startup.

Applications

  • Automotive Infotainment: Ideal for advanced automotive systems requiring high-performance power management.
  • High-end Consumer Electronics: Suitable for demanding consumer electronics that need efficient and reliable power supply.
  • Industrial Applications: Used in various industrial environments where robust power management is crucial.
  • Telematics, Clusters, Vehicle Networking, ADAS: Supports a range of automotive and industrial applications requiring advanced power management.

Q & A

  1. What is the MC33PF8200D2ESR2 used for?

    The MC33PF8200D2ESR2 is a power management integrated circuit (PMIC) designed for high-performance applications, particularly for i.MX 8 and S32x processor-based systems.

  2. What are the key features of the MC33PF8200D2ESR2?

    Key features include up to seven high-efficiency buck converters, four linear regulators, RTC supply and coin cell charger, watchdog timer/monitor, and one-time programmable device configuration.

  3. What is the operating temperature range of the MC33PF8200D2ESR2?

    The ambient operating temperature range is -40°C to 105°C, and the junction temperature range is -40°C to 150°C.

  4. What is the input voltage range for the MC33PF8200D2ESR2?

    The input voltage range is 2.7 V to 5.5 V.

  5. What type of package does the MC33PF8200D2ESR2 come in?

    The device comes in a 56-HVQFN (8x8) package.

  6. What safety standards does the MC33PF8200D2ESR2 meet?

    The device meets ASIL B safety level standards, ensuring high safety in automotive applications.

  7. How does the MC33PF8200D2ESR2 support system configuration?

    The device features one-time programmable memory to store key startup configurations, and regulator parameters can be adjusted through a high-speed I2C interface.

  8. What are some common applications of the MC33PF8200D2ESR2?

    Common applications include automotive infotainment, high-end consumer electronics, industrial applications, telematics, clusters, vehicle networking, and ADAS.

  9. What is the peak package reflow temperature for the MC33PF8200D2ESR2?

    The peak package reflow temperature is 260°C.

  10. How does the MC33PF8200D2ESR2 manage power for peripherals?

    The device manages power through seven high-efficiency buck converters and four linear regulators, ensuring efficient and reliable power supply to the processor, memory, and peripherals.

Product Attributes

Applications:High Performance i.MX 8, S32x Processor Based
Current - Supply:- 
Voltage - Supply:2.5V ~ 5.5V
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount, Wettable Flank
Package / Case:56-VFQFN Exposed Pad
Supplier Device Package:56-HVQFN (8x8)
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Similar Products

Part Number MC33PF8200D2ESR2 MC33PF8200DEESR2 MC33PF8200DBESR2 MC33PF8200DNESR2 MC33PF8200DMESR2 MC33PF8200DFESR2 MC33PF8200DHESR2
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active Active Active Active
Applications High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based High Performance i.MX 8, S32x Processor Based
Current - Supply - - - - - - -
Voltage - Supply 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V 2.5V ~ 5.5V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad
Supplier Device Package 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8)

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