LPC812M101JDH16J
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NXP USA Inc. LPC812M101JDH16J

Manufacturer No:
LPC812M101JDH16J
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MCU 32BIT 16KB FLASH 16TSSOP
Delivery:
Payment:
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Product Introduction

Overview

The LPC812M101JDH16J is a 32-bit microcontroller from NXP USA Inc., part of the LPC81xM series. It is based on the ARM Cortex-M0+ core, offering a balance of performance and power efficiency. This microcontroller is particularly suited for applications requiring low power consumption and high functionality, making it ideal for various consumer, industrial, and automotive uses.

Key Specifications

Parameter Specification
Processor Core ARM Cortex-M0+
Flash Memory Up to 16 kB
SRAM Up to 4 kB
Package Type TSSOP16
GPIO Pins Up to 18 General-Purpose I/O (GPIO) pins
Peripheral Interfaces I2C, USART, SPI, Multi-rate Timer (MRT), State Configurable Timer/PWM (SCTimer/PWM)
Power Modes Sleep, Deep-sleep, Power-down, Deep power-down
Operating Temperature Range -40 °C to 105 °C
Power Supply Single power supply

Key Features

  • ARM Cortex-M0+ processor core for efficient processing
  • Integrated Power Management Unit (PMU) to minimize power consumption
  • Multiple power modes: Sleep, Deep-sleep, Power-down, and Deep power-down
  • High-speed GPIO interface with configurable pull-up/pull-down resistors and programmable open-drain mode
  • Serial Wire Debug (SWD) and JTAG boundary scan modes supported
  • Micro Trace Buffer (MTB) supported
  • CRC engine and Windowed Watchdog timer (WWDT)
  • Flash In-Application Programming (IAP) and In-System Programming (ISP)
  • Unique device serial number for identification

Applications

  • 8/16-bit applications
  • Lighting control
  • Consumer electronics
  • Motor control
  • Climate control
  • Fire and security applications

Q & A

  1. What is the processor core of the LPC812M101JDH16J microcontroller?

    The LPC812M101JDH16J microcontroller is based on the ARM Cortex-M0+ core.

  2. How much flash memory does the LPC812M101JDH16J have?

    The LPC812M101JDH16J has up to 16 kB of on-chip flash programming memory.

  3. What types of peripheral interfaces are available on the LPC812M101JDH16J?

    The LPC812M101JDH16J includes I2C, USART, SPI, Multi-rate Timer (MRT), and State Configurable Timer/PWM (SCTimer/PWM) interfaces.

  4. What are the power modes supported by the LPC812M101JDH16J?

    The LPC812M101JDH16J supports Sleep, Deep-sleep, Power-down, and Deep power-down modes.

  5. What is the operating temperature range of the LPC812M101JDH16J?

    The operating temperature range is -40 °C to 105 °C, except for the DIP8 package which is -40 °C to 85 °C.

  6. Does the LPC812M101JDH16J support in-application programming?
  7. What is the package type of the LPC812M101JDH16J?

    The LPC812M101JDH16J is available in a TSSOP16 package.

  8. How many GPIO pins does the LPC812M101JDH16J have?

    The LPC812M101JDH16J has up to 18 General-Purpose I/O (GPIO) pins.

  9. Does the LPC812M101JDH16J have a built-in CRC engine?
  10. What is the purpose of the Power Management Unit (PMU) in the LPC812M101JDH16J?

    The PMU is integrated to minimize power consumption.

Product Attributes

Core Processor:ARM® Cortex®-M0+
Core Size:32-Bit Single-Core
Speed:30MHz
Connectivity:I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:14
Program Memory Size:16KB (16K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:4K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:- 
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package:16-TSSOP
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