LPC3131FET180,551
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NXP USA Inc. LPC3131FET180,551

Manufacturer No:
LPC3131FET180,551
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 16/32BIT ROMLESS 180TFBGA
Delivery:
Payment:
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Product Introduction

Overview

The NXP LPC3131FET180,551 is a highly integrated microcontroller from the LPC3100 series, designed to offer a robust and versatile solution for various applications. This microcontroller combines an 180 MHz ARM926EJ-S CPU core with a range of peripherals and interfaces, making it suitable for consumer, industrial, medical, and communication markets. The device is known for its low power consumption and high performance, featuring multiple power domains and a flexible Clock Generation Unit (CGU) for dynamic clock gating and scaling.

Key Specifications

Parameter Specification
CPU Core 180 MHz, 32-bit ARM926EJ-S
Cache Memory 16 kB D-cache and 16 kB I-cache
Internal Memory 192 kB embedded SRAM
External Memory Interface NAND flash controller with 8-bit ECC, 8/16-bit Multi-Port Memory Controller (MPMC): SDRAM and SRAM
Communication and Connectivity High-speed USB 2.0 (OTG, Host, Device) with on-chip PHY, Two I2S-bus interfaces, Integrated master/slave SPI, Two master/slave I2C-bus interfaces, Fast UART, Memory Card Interface (MCI): MMC/SD/SDIO/CE-ATA
ADC Channels Four-channel 10-bit ADC
Display Interface Integrated 4/8/16-bit 6800/8080 compatible LCD interface
System Functions Dynamic clock gating and scaling, Multiple power domains, Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB, DMA controller
Operating Voltage Core voltage: 1.2 V, I/O voltage: 1.8 V, 3.3 V
Operating Temperature -40°C to +85°C
Package TFBGA180, 12 x 12 mm², 0.8 mm pitch

Key Features

  • CPU Platform: 180 MHz, 32-bit ARM926EJ-S CPU core with 16 kB D-cache and 16 kB I-cache, and a Memory Management Unit (MMU)
  • Internal Memory: 192 kB embedded SRAM
  • External Memory Interface: NAND flash controller with 8-bit ECC, and 8/16-bit Multi-Port Memory Controller (MPMC) for SDRAM and SRAM
  • Communication and Connectivity: High-speed USB 2.0 (OTG, Host, Device) with on-chip PHY, two I2S-bus interfaces, integrated master/slave SPI, two master/slave I2C-bus interfaces, fast UART, and Memory Card Interface (MCI) for MMC/SD/SDIO/CE-ATA
  • Analog to Digital Conversion: Four-channel 10-bit ADC
  • Display Interface: Integrated 4/8/16-bit 6800/8080 compatible LCD interface
  • System Functions: Dynamic clock gating and scaling, multiple power domains, selectable boot-up options, and DMA controller
  • Timers and Watchdog: Four 32-bit timers and a watchdog timer
  • PWM and RNG: PWM module and Random Number Generator (RNG)
  • GPIO and Interrupts: General Purpose I/O (GPIO) pins and a flexible and versatile interrupt structure
  • Debug Interface: JTAG interface with boundary scan and ARM debug access

Applications

The NXP LPC3131FET180,551 microcontroller is designed for a wide range of applications, including:

  • Consumer Electronics: Devices such as set-top boxes, digital TVs, and other consumer appliances.
  • Industrial Control: Industrial automation, control systems, and IoT devices.
  • Medical Devices: Medical equipment and diagnostic tools that require high reliability and performance.
  • Communication Systems: Wireless and wired communication devices, including modems and routers.

Q & A

  1. What is the CPU core of the LPC3131FET180,551?

    The CPU core is an 180 MHz, 32-bit ARM926EJ-S.

  2. How much internal SRAM does the LPC3131FET180,551 have?

    The LPC3131FET180,551 has 192 kB of embedded SRAM.

  3. What types of external memory interfaces are supported?

    The device supports NAND flash controller with 8-bit ECC and 8/16-bit Multi-Port Memory Controller (MPMC) for SDRAM and SRAM.

  4. What are the communication and connectivity options available?

    The device features high-speed USB 2.0 (OTG, Host, Device) with on-chip PHY, two I2S-bus interfaces, integrated master/slave SPI, two master/slave I2C-bus interfaces, fast UART, and Memory Card Interface (MCI) for MMC/SD/SDIO/CE-ATA.

  5. What is the operating voltage range of the LPC3131FET180,551?

    The core voltage is 1.2 V, and the I/O voltage can be 1.8 V or 3.3 V.

  6. What is the operating temperature range of the LPC3131FET180,551?

    The operating temperature range is -40°C to +85°C.

  7. What package type is used for the LPC3131FET180,551?

    The device is packaged in a TFBGA180, with a body size of 12 x 12 mm² and a 0.8 mm pitch.

  8. Does the LPC3131FET180,551 support dynamic clock gating and scaling?

    Yes, it supports dynamic clock gating and scaling through its Clock Generation Unit (CGU).

  9. What are the boot-up options available for the LPC3131FET180,551?

    The device supports selectable boot-up from SPI flash, NAND flash, SD/MMC cards, UART, or USB.

  10. Does the LPC3131FET180,551 have a DMA controller?

    Yes, it includes a DMA controller.

Product Attributes

Core Processor:ARM926EJ-S
Core Size:16/32-Bit
Speed:180MHz
Connectivity:EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG
Peripherals:DMA, I²S, LCD, PWM, WDT
Number of I/O:- 
Program Memory Size:- 
Program Memory Type:ROMless
EEPROM Size:- 
RAM Size:192K x 8
Voltage - Supply (Vcc/Vdd):1.1V ~ 3.6V
Data Converters:A/D 4x10b
Oscillator Type:External
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:180-TFBGA
Supplier Device Package:180-TFBGA (12x12)
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Same Series
LPC3130FET180,551
LPC3130FET180,551
IC MCU 16/32BIT ROMLESS 180TFBGA

Similar Products

Part Number LPC3131FET180,551 LPC3141FET180,551 LPC3130FET180,551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Not For New Designs Obsolete Not For New Designs
Core Processor ARM926EJ-S ARM926EJ-S ARM926EJ-S
Core Size 16/32-Bit 16/32-Bit 16/32-Bit
Speed 180MHz 270MHz 180MHz
Connectivity EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG
Peripherals DMA, I²S, LCD, PWM, WDT DMA, I²S, LCD, PWM, WDT DMA, I²S, LCD, PWM, WDT
Number of I/O - 20 -
Program Memory Size - - -
Program Memory Type ROMless ROMless ROMless
EEPROM Size - - -
RAM Size 192K x 8 192K x 8 96K x 8
Voltage - Supply (Vcc/Vdd) 1.1V ~ 3.6V 1.1V ~ 3.6V 1.1V ~ 3.6V
Data Converters A/D 4x10b A/D 4x10b A/D 4x10b
Oscillator Type External External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 180-TFBGA 180-TFBGA 180-TFBGA
Supplier Device Package 180-TFBGA (12x12) 180-TFBGA (12x12) 180-TFBGA (12x12)

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