LPC2103FHN48,551
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NXP USA Inc. LPC2103FHN48,551

Manufacturer No:
LPC2103FHN48,551
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 16/32B 32KB FLASH 48HVQFN
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The LPC2103FHN48,551 is a 16-bit/32-bit microcontroller from NXP USA Inc., based on the ARM7TDMI-S CPU. This microcontroller is designed for high-performance applications and is particularly suited for environments where miniaturization and low power consumption are critical. It features a blend of serial communications interfaces, on-chip SRAM, and flash program memory, making it ideal for communication gateways, protocol converters, industrial control systems, and medical devices.

Key Specifications

Parameter Value
Manufacturer NXP USA Inc.
Part Number LPC2103FHN48,551
Package 48-HVQFN (6x6)
Core Processor ARM7TDMI-S
Core Size 16-bit/32-bit
Program Memory Type FLASH
Program Memory Size 32KB (32K x 8)
RAM Size 8K x 8
Supply Voltage (Vcc/Vdd) 1.65V ~ 3.6V
Maximum CPU Clock Speed 70 MHz
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 32
Connectivity I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals POR, PWM, WDT

Key Features

  • High-speed 70 MHz operation with a 128-bit wide memory interface and accelerator architecture.
  • Support for both 16-bit and 32-bit instruction sets, with 30% performance increase in 32-bit mode and reduced code size in 16-bit Thumb mode.
  • On-chip flash program memory (32KB) and SRAM (8KB).
  • Multiple serial communications interfaces: UARTs, SPI, SSP, and two I2C-buses.
  • Improved 10-bit ADC and PWM features through output match on all timers.
  • 32 fast GPIO lines with up to nine edge or level sensitive external interrupt pins.
  • Power saving modes including Idle mode, Power-down mode with RTC active, and Deep power-down mode.
  • Individual enable/disable of peripheral functions and peripheral clock scaling for additional power optimization.
  • In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.

Applications

  • Communication gateways and protocol converters.
  • Industrial control systems.
  • Medical systems.
  • Math coprocessors.
  • Miniaturized applications where low power consumption is critical.

Q & A

  1. What is the core processor of the LPC2103FHN48,551?

    The core processor is the ARM7TDMI-S.

  2. What is the maximum CPU clock speed of the LPC2103FHN48,551?

    The maximum CPU clock speed is 70 MHz.

  3. What types of memory does the LPC2103FHN48,551 have?

    The LPC2103FHN48,551 has 32KB of on-chip flash program memory and 8KB of on-chip SRAM.

  4. What are the power saving modes available on the LPC2103FHN48,551?

    The power saving modes include Idle mode, Power-down mode with RTC active, and Deep power-down mode.

  5. What are the primary applications of the LPC2103FHN48,551?

    The primary applications include communication gateways, industrial control systems, medical systems, and math coprocessors.

  6. What is the operating temperature range of the LPC2103FHN48,551?

    The operating temperature range is -40°C to 85°C (TA).

  7. Does the LPC2103FHN48,551 support in-system programming?
  8. What types of serial communication interfaces are available on the LPC2103FHN48,551?

    The available interfaces include UARTs, SPI, SSP, and two I2C-buses.

  9. How many GPIO lines does the LPC2103FHN48,551 have?

    The LPC2103FHN48,551 has 32 fast GPIO lines.

  10. Is the LPC2103FHN48,551 RoHS compliant?

Product Attributes

Core Processor:ARM7®
Core Size:16/32-Bit
Speed:70MHz
Connectivity:I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:POR, PWM, WDT
Number of I/O:32
Program Memory Size:32KB (32K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:8K x 8
Voltage - Supply (Vcc/Vdd):1.65V ~ 3.6V
Data Converters:A/D 8x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:48-VFQFN Exposed Pad
Supplier Device Package:48-HVQFN (7x7)
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Similar Products

Part Number LPC2103FHN48,551 LPC2106FHN48,551 LPC2102FHN48,551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Obsolete Obsolete Obsolete
Core Processor ARM7® ARM7® ARM7®
Core Size 16/32-Bit 16/32-Bit 16/32-Bit
Speed 70MHz 60MHz 70MHz
Connectivity I²C, Microwire, SPI, SSI, SSP, UART/USART I²C, Microwire, SPI, SSI, SSP, UART/USART I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT POR, PWM, WDT
Number of I/O 32 32 32
Program Memory Size 32KB (32K x 8) 128KB (128K x 8) 16KB (16K x 8)
Program Memory Type Flash Flash Flash
EEPROM Size - - -
RAM Size 8K x 8 64K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 1.65V ~ 3.6V 1.65V ~ 3.6V 1.65V ~ 3.6V
Data Converters A/D 8x10b - A/D 8x10b
Oscillator Type Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 48-VFQFN Exposed Pad 48-VFQFN Exposed Pad 48-VFQFN Exposed Pad
Supplier Device Package 48-HVQFN (7x7) 48-HVQFN (7x7) 48-HVQFN (7x7)

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