LPC1111FHN33/102K
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NXP USA Inc. LPC1111FHN33/102K

Manufacturer No:
LPC1111FHN33/102K
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 8KB FLASH 32HVQFN
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC1111FHN33/102K is a 32-bit microcontroller from NXP USA Inc., part of the LPC11xx MCU Family. This microcontroller is based on the Arm Cortex-M0 architecture and is designed for low-cost, high-performance applications. It operates at CPU frequencies of up to 50 MHz, making it suitable for a variety of embedded systems.

Key Specifications

Parameter Specification
Microcontroller Type 32-bit Arm Cortex-M0
Flash Memory 8 kB
SRAM Up to 4 kB
Package Type 32-pin HVQFN (Exposed Pad)
Operating Voltage 1.8 V to 3.6 V
Maximum CPU Frequency Up to 50 MHz
Analog Peripherals 10-bit ADC with input multiplexing among 5, 6, or 8 pins
Serial Interfaces UART, SPI, I2C-bus interface supporting full I2C-bus specification and Fast-mode Plus
Timers and Counters Four general purpose counter/timers with up to eight capture inputs and up to 13 match outputs
Power Modes Sleep, Deep-sleep, and Deep power-down modes

Key Features

  • High-Performance CPU: Based on the Arm Cortex-M0 architecture, operating at up to 50 MHz.
  • Memory and Storage: 8 kB of flash memory and up to 4 kB of SRAM.
  • Analog and Digital Peripherals: Includes a 10-bit ADC, UART, two SPI controllers with SSP features, and an I2C-bus interface.
  • Timers and Counters: Four general purpose counter/timers with multiple capture and match outputs.
  • Power Management: Integrated Power Management Unit (PMU) with Sleep, Deep-sleep, and Deep power-down modes to minimize power consumption.
  • Programming Capabilities: In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software.
  • Package Options: Available in 32-pin HVQFN (Exposed Pad) package.

Applications

  • General Purpose Embedded Systems: Suitable for a wide range of applications requiring low power and high performance.
  • Industrial Automation: Can be used in industrial control systems, sensors, and actuators.
  • Internet of Things (IoT): Ideal for IoT devices due to its low power consumption and high integration.
  • Automotive Systems: Can be used in various automotive applications such as sensors, control units, and infotainment systems.
  • Consumer Electronics: Suitable for use in consumer electronics like smart home devices, wearables, and other portable electronics.

Q & A

  1. What is the CPU architecture of the LPC1111FHN33/102K?

    The LPC1111FHN33/102K is based on the Arm Cortex-M0 architecture.

  2. What is the maximum CPU frequency of the LPC1111FHN33/102K?

    The maximum CPU frequency is up to 50 MHz.

  3. How much flash memory does the LPC1111FHN33/102K have?

    The LPC1111FHN33/102K has 8 kB of flash memory.

  4. What types of serial interfaces are available on the LPC1111FHN33/102K?

    The microcontroller includes UART, SPI, and I2C-bus interfaces.

  5. Does the LPC1111FHN33/102K support power-saving modes?
  6. What is the operating voltage range of the LPC1111FHN33/102K?

    The operating voltage range is from 1.8 V to 3.6 V.

  7. What package type is the LPC1111FHN33/102K available in?

    The microcontroller is available in a 32-pin HVQFN (Exposed Pad) package.

  8. Does the LPC1111FHN33/102K support In-System Programming (ISP) and In-Application Programming (IAP)?
  9. What are the key analog peripherals of the LPC1111FHN33/102K?

    The microcontroller includes a 10-bit ADC with input multiplexing among 5, 6, or 8 pins.

  10. Can the LPC1111FHN33/102K be used in automotive applications?

Product Attributes

Core Processor:ARM® Cortex®-M0
Core Size:32-Bit Single-Core
Speed:50MHz
Connectivity:I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, POR, WDT
Number of I/O:28
Program Memory Size:8KB (8K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:2K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 8x10b SAR
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:32-VQFN Exposed Pad
Supplier Device Package:32-HVQFN (7x7)
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Similar Products

Part Number LPC1111FHN33/102K LPC1112FHN33/102K LPC1111FHN33/103K
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 50MHz 50MHz 50MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, POR, WDT
Number of I/O 28 28 28
Program Memory Size 8KB (8K x 8) 16KB (16K x 8) 8KB (8K x 8)
Program Memory Type Flash Flash Flash
EEPROM Size - - -
RAM Size 2K x 8 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 8x10b SAR A/D 8x10b SAR A/D 8x10b SAR
Oscillator Type Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 32-VQFN Exposed Pad 32-VQFN Exposed Pad 32-VQFN Exposed Pad
Supplier Device Package 32-HVQFN (7x7) 32-HVQFN (7x7) 32-HVQFN (7x7)

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