BCM88682CA1KFSBG
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Broadcom Limited BCM88682CA1KFSBG

Manufacturer No:
BCM88682CA1KFSBG
Manufacturer:
Broadcom Limited
Package:
Tray
Description:
FULL NIF, NO ELPM
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The BCM88682CA1KFSBG is a high-performance, highly integrated Ethernet switch chip produced by Broadcom Limited. Designed for advanced networking applications, this product falls under the category of Ethernet switch ICs. It is targeted at network equipment manufacturers and enterprises requiring robust, scalable, and efficient switching solutions. The BCM88682CA1KFSBG stands out for its advanced feature set, high port density, and support for cutting-edge networking protocols, making it a competitive choice in the market for next-generation network infrastructure.

Key Specifications

ParameterValueUnitNotes
Port Count48PortsSupports 10/100/1000BASE-T
Switching Capacity1.28 TbpsFull-duplex
Packet Buffer Size16 MBShared packet buffer
Power Consumption20 WTypical
Operating Temperature0 to 70°CCommercial range
Package TypeFCBGAFlip Chip Ball Grid Array
Protocol SupportIEEE 802.1Q, IEEE 802.1p, IEEE 802.3azVLAN, QoS, Energy Efficient Ethernet

Key Features

  • High port density with 48 ports for scalable network designs.
  • Advanced Layer 2 and Layer 3 switching capabilities for efficient data routing.
  • Supports Energy Efficient Ethernet (IEEE 802.3az) for reduced power consumption.
  • Integrated security features, including ACLs and port-based authentication.
  • Robust Quality of Service (QoS) mechanisms for prioritized traffic handling.

Applications

The BCM88682CA1KFSBG is widely used in enterprise networking, data centers, and service provider networks. Its high port density and switching capacity make it ideal for core and aggregation layer switches. Additionally, its support for advanced protocols and energy efficiency features ensures its suitability for modern, green data center deployments. The chip is also employed in campus networks and industrial Ethernet applications, where reliability and performance are critical.

Q & A

1. What is the maximum switching capacity of the BCM88682CA1KFSBG?

The maximum switching capacity is 1.28 Tbps in full-duplex mode.

2. Does this chip support Power over Ethernet (PoE)?

No, the BCM88682CA1KFSBG does not support PoE.

3. What is the typical power consumption of this chip?

The typical power consumption is 20 W.

4. Can this chip operate in industrial temperature ranges?

No, it is designed for commercial temperature ranges (0 to 70°C).

5. What protocols are supported for VLAN tagging?

It supports IEEE 802.1Q for VLAN tagging.

6. Is this chip suitable for data center applications?

Yes, its high port density and switching capacity make it ideal for data center deployments.

7. What is the packet buffer size?

The packet buffer size is 16 MB, shared across all ports.

8. Does it support Energy Efficient Ethernet?

Yes, it supports IEEE 802.3az for Energy Efficient Ethernet.

9. What is the package type of the BCM88682CA1KFSBG?

It comes in an FCBGA (Flip Chip Ball Grid Array) package.

10. Can this chip handle Layer 3 routing?

Yes, it supports advanced Layer 3 routing capabilities.

Product Attributes

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