ADSP-BF706KCPZ-4
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Analog Devices Inc. ADSP-BF706KCPZ-4

Manufacturer No:
ADSP-BF706KCPZ-4
Manufacturer:
Analog Devices Inc.
Package:
Tray
Description:
IC DSP LP 1024KB L2SR 88LFCSP
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The ADSP-BF706KCPZ-4 is a high-performance Blackfin+ processor from Analog Devices Inc., designed for efficient processing of digital signals in embedded applications. This processor features a robust architecture that supports a wide range of interfaces and applications, making it versatile for various industrial and consumer electronics uses.

Key Specifications

Parameter Value
Manufacturer Part Number ADSP-BF706KCPZ-4
Manufacturer Analog Devices Inc.
Clock Rate 400 MHz
Non-Volatile Memory ROM (512 kB)
On-Chip RAM Up to 1 MB
Voltage Core 1.10 V
Voltage I/O 1.8 V, 3.3 V
Operating Temperature -40°C to 85°C
Package Type 88-Lead LFCSP_VQ (QFN), 184-Ball CSP_BGA

Key Features

  • Blackfin+ Core: Features a high-performance Blackfin+ core with up to 400 MHz performance, dual 16-bit or single 32-bit MAC support per cycle, and instruction set enhancements.
  • Memory and Storage: Includes 136 kB L1 SRAM with multi-parity-bit protection, large on-chip L2 SRAM with ECC protection (256 kB, 512 kB, 1 MB variants), and on-chip L2 ROM (512 kB).
  • Interface Support: Extensive interface support including CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, and USB OTG.
  • Security Features: Includes crypto hardware accelerators, fast secure boot for IP protection, and memDMA encryption/decryption for fast run-time security.
  • Low Power Consumption: Low system power with < 100 mW core domain power at 400 MHz, enhancing efficiency.
  • Robust Operating Temperature Range: Ensures reliability in various environments with an operating temperature range of -40°C to 85°C).

Applications

  • Industrial Automation: Suitable for industrial automation due to its robust interface options and high-performance processing capabilities).
  • Automotive Systems: AEC-Q100 qualified for automotive applications, ensuring reliability and compliance with automotive standards).
  • Communication Equipment: Used in communication equipment due to its extensive interface support and high-performance digital signal processing capabilities).
  • Consumer Electronics: Applicable in consumer electronics for its low power consumption and compact packaging).

Q & A

  1. What is the clock rate of the ADSP-BF706KCPZ-4 processor?

    The clock rate of the ADSP-BF706KCPZ-4 processor is 400 MHz).

  2. What type of memory does the ADSP-BF706KCPZ-4 have?

    The ADSP-BF706KCPZ-4 has 136 kB L1 SRAM, large on-chip L2 SRAM (up to 1 MB), and 512 kB on-chip ROM).

  3. What are the supported interfaces of the ADSP-BF706KCPZ-4?

    The ADSP-BF706KCPZ-4 supports various interfaces including CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, and USB OTG).

  4. What is the operating temperature range of the ADSP-BF706KCPZ-4?

    The operating temperature range of the ADSP-BF706KCPZ-4 is -40°C to 85°C).

  5. Is the ADSP-BF706KCPZ-4 suitable for automotive applications?

    Yes, the ADSP-BF706KCPZ-4 is AEC-Q100 qualified for automotive applications).

  6. What are the security features of the ADSP-BF706KCPZ-4?

    The ADSP-BF706KCPZ-4 includes crypto hardware accelerators, fast secure boot for IP protection, and memDMA encryption/decryption for fast run-time security).

  7. What is the power consumption of the ADSP-BF706KCPZ-4?

    The ADSP-BF706KCPZ-4 has low system power with < 100 mW core domain power at 400 MHz).

  8. What are the common applications of the ADSP-BF706KCPZ-4?

    The ADSP-BF706KCPZ-4 is commonly used in industrial automation, automotive systems, communication equipment, and consumer electronics).

  9. What type of packaging does the ADSP-BF706KCPZ-4 use?

    The ADSP-BF706KCPZ-4 uses 88-Lead LFCSP_VQ (QFN) and 184-Ball CSP_BGA packaging).

  10. Is the ADSP-BF706KCPZ-4 RoHS compliant?

    Yes, the ADSP-BF706KCPZ-4 is RoHS compliant).

Product Attributes

Type:Blackfin+
Interface:CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
Clock Rate:400MHz
Non-Volatile Memory:ROM (512kB)
On-Chip RAM:1MB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:1.10V
Operating Temperature:0°C ~ 70°C (TA)
Mounting Type:Surface Mount
Package / Case:88-VFQFN Exposed Pad, CSP
Supplier Device Package:88-LFCSP-VQ (12x12)
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Similar Products

Part Number ADSP-BF706KCPZ-4 ADSP-BF702KCPZ-4 ADSP-BF704KCPZ-4 ADSP-BF706BCPZ-4 ADSP-BF706KCPZ-3
Manufacturer Analog Devices Inc. Analog Devices Inc. Analog Devices Inc. Analog Devices Inc. Analog Devices Inc.
Product Status Active Active Active Active Active
Type Blackfin+ Blackfin+ Blackfin+ Blackfin+ Blackfin+
Interface CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
Clock Rate 400MHz 400MHz 400MHz 400MHz 300MHz
Non-Volatile Memory ROM (512kB) ROM (512kB) ROM (512kB) ROM (512kB) ROM (512kB)
On-Chip RAM 1MB 256KB 512KB 1MB 1MB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.10V 1.10V 1.10V 1.10V 1.10V
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA) 0°C ~ 70°C (TA) -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 88-VFQFN Exposed Pad, CSP 88-VFQFN Exposed Pad, CSP 88-VFQFN Exposed Pad, CSP 88-VFQFN Exposed Pad, CSP 88-VFQFN Exposed Pad, CSP
Supplier Device Package 88-LFCSP-VQ (12x12) 88-LFCSP-VQ (12x12) 88-LFCSP-VQ (12x12) 88-LFCSP-VQ (12x12) 88-LFCSP-VQ (12x12)

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