ADSP-BF702BCPZ-3
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Analog Devices Inc. ADSP-BF702BCPZ-3

Manufacturer No:
ADSP-BF702BCPZ-3
Manufacturer:
Analog Devices Inc.
Package:
Tray
Description:
IC DSP LP 256KB L2SR 88LFCSP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The ADSP-BF702BCPZ-3 is a member of the Blackfin+ family of digital signal processors (DSPs) produced by Analog Devices Inc. This processor integrates a Blackfin+ core, which combines the advantages of a clean, orthogonal RISC-like microprocessor instruction set with single-instruction, multiple-data (SIMD) multimedia capabilities and state-of-the-art signal processing. The ADSP-BF702BCPZ-3 is designed to offer high performance, low power consumption, and a rich set of system peripherals, making it an ideal choice for various embedded applications.

Key Specifications

Specification Details
Processor Core Blackfin+ core
Performance Up to 300 MHz
MAC Support Dual 16-bit or single 32-bit MAC per cycle
Instruction Set Compatible with previous Blackfin products
Memory and Peripherals Rich set of industry-leading system peripherals and memory, including SPORTs, SPI, USB 2.0 HS OTG, CAN, UART, Real-Time Clock, and more
Package Type 88-Pin LFCSP
Lifecycle Status Production

Key Features

  • High Performance: The ADSP-BF702BCPZ-3 offers performance up to 300 MHz, making it suitable for demanding signal processing and multimedia applications.
  • Low Power Consumption: Designed with low-power and low-voltage methodology, it provides world-class power management.
  • Instruction Set Enhancements: Includes 32-bit MAC and 16-bit complex MAC support, cache enhancements, branch prediction, and other instruction set improvements.
  • System Peripherals: Integrates a wide range of peripherals such as SPORTs, SPI, USB 2.0 HS OTG, CAN, UART, Real-Time Clock, and more.
  • Security Crypto Engine: Includes a security crypto engine for enhanced security in applications.

Applications

The ADSP-BF702BCPZ-3 is versatile and can be used in a variety of applications across different markets, including:

  • Automotive Systems: For advanced driver-assistance systems (ADAS), infotainment, and other automotive applications.
  • Embedded Industrial: For industrial control, automation, and monitoring systems.
  • Instrumentation: For medical devices, test and measurement equipment, and other instrumentation applications.
  • Video/Image Analysis: For applications requiring real-time video and image processing.

Q & A

  1. What is the core type of the ADSP-BF702BCPZ-3?

    The ADSP-BF702BCPZ-3 features a Blackfin+ core.

  2. What is the maximum performance of the ADSP-BF702BCPZ-3?

    The ADSP-BF702BCPZ-3 offers performance up to 300 MHz.

  3. What type of MAC support does the ADSP-BF702BCPZ-3 provide?

    The ADSP-BF702BCPZ-3 supports dual 16-bit or single 32-bit MAC per cycle.

  4. Is the instruction set of the ADSP-BF702BCPZ-3 compatible with previous Blackfin products?
  5. What kind of package does the ADSP-BF702BCPZ-3 come in?

    The ADSP-BF702BCPZ-3 comes in an 88-Pin LFCSP package.

  6. What are some of the key peripherals integrated into the ADSP-BF702BCPZ-3?

    The ADSP-BF702BCPZ-3 includes peripherals such as SPORTs, SPI, USB 2.0 HS OTG, CAN, UART, Real-Time Clock, and more.

  7. Does the ADSP-BF702BCPZ-3 have any security features?
  8. In which markets can the ADSP-BF702BCPZ-3 be applied?

    The ADSP-BF702BCPZ-3 can be applied in automotive systems, embedded industrial, instrumentation, and video/image analysis, among others.

  9. What is the lifecycle status of the ADSP-BF702BCPZ-3?

    The ADSP-BF702BCPZ-3 is in production.

  10. Where can I find detailed specifications for the ADSP-BF702BCPZ-3?

    Detailed specifications can be found in the datasheet available on Analog Devices' official website and other authorized distributors like Digi-Key and Mouser.

Product Attributes

Type:Blackfin+
Interface:CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
Clock Rate:300MHz
Non-Volatile Memory:ROM (512kB)
On-Chip RAM:256KB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:1.10V
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:88-VFQFN Exposed Pad, CSP
Supplier Device Package:88-LFCSP-VQ (12x12)
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Similar Products

Part Number ADSP-BF702BCPZ-3 ADSP-BF702BCPZ-4 ADSP-BF706BCPZ-3 ADSP-BF702KCPZ-3 ADSP-BF704BCPZ-3
Manufacturer Analog Devices Inc. Analog Devices Inc. Analog Devices Inc. Analog Devices Inc. Analog Devices Inc.
Product Status Active Active Active Active Active
Type Blackfin+ Blackfin+ Blackfin+ Blackfin+ Blackfin+
Interface CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
Clock Rate 300MHz 400MHz 300MHz 300MHz 300MHz
Non-Volatile Memory ROM (512kB) ROM (512kB) ROM (512kB) ROM (512kB) ROM (512kB)
On-Chip RAM 256KB 256KB 1MB 256KB 512KB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.10V 1.10V 1.10V 1.10V 1.10V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 88-VFQFN Exposed Pad, CSP 88-VFQFN Exposed Pad, CSP 88-VFQFN Exposed Pad, CSP 88-VFQFN Exposed Pad, CSP 88-VFQFN Exposed Pad, CSP
Supplier Device Package 88-LFCSP-VQ (12x12) 88-LFCSP-VQ (12x12) 88-LFCSP-VQ (12x12) 88-LFCSP-VQ (12x12) 88-LFCSP-VQ (12x12)

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