Since 2015, ROHM and UAES have been collaborating and conducting technical exchanges on automotive applications utilizing SiC power devices.… [Read more]

Announced today, NXP calls the Trimension SR250 the industry’s first single-chip solution that combines ultra-wideband radar sensing, secure UWB ranging, and on-chip processing.… [Read more]

Bluetooth SIG promises centimeter-level accuracy when measuring the distance between connected Bluetooth devices.… [Read more]

The M2003 series, with an Arm Cortex-M23 core, now offers 32-bit capabilities to improve system performance in a compact 20-pin package.… [Read more]

The signing of agreements between the prime ministers of India and Singapore this week to collaborate on growing and supporting India’s semiconductor ecosystem is a sign of the rapidly growing momentum in India.… [Read more]

Intel has revealed the details of the long-awaited Lunar Lake architecture, bringing advanced AI compute to personal computing.… [Read more]