The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices, bringing them closer to cost parity with silicon.… [Read more]
The new sensors leverage tunnel magnetoresistance sensing to sharpen sensitivity and precision.… [Read more]
The new high-current chokes use a novel alloy powder core material with superior saturation properties to push the boundaries of current density.… [Read more]
The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by multiple days on Copilot+ PCs.… [Read more]
The 14-bit scope combines architectural improvements and software support for higher resolution, real-time processing, and enhanced signal analysis.… [Read more]
Teams across Intel ‘turned over every rock’ to build the Intel Core Ultra 200V processor family, meeting laptop buyers’ demands for more endurance, more speed and new capabilities.… [Read more]
