TLP250F(FA1-TP4S,F
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Toshiba Semiconductor and Storage TLP250F(FA1-TP4S,F

Manufacturer No:
TLP250F(FA1-TP4S,F
Manufacturer:
Toshiba Semiconductor and Storage
Package:
Tape & Reel (TR)
Description:
PHOTOCOUPLER
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The TLP250F(FA1-TP4S,F, produced by Toshiba Semiconductor and Storage, is a photocoupler designed for gate driving circuits of IGBTs (Insulated Gate Bipolar Transistors) and power MOSFETs. This component is part of the TLP250 series and features an infrared emitting diode and an integrated photodetector. Although the TLP250 is shortly to be discontinued, it remains relevant for existing designs and applications.

The device is packaged in an 8-lead DIP (Dual In-Line Package) and is RoHS compatible. It is suitable for various industrial applications, including inverters, PV inverters, and induction cooktops.

Key Specifications

Characteristic Symbol Condition Value Unit
Isolation Voltage BV S t = 60 sec 2500 Vrms
Supply Current (Max) I CC - 11 mA
Threshold Input Current (L/H) I FLH - 5 mA
Output Current (Peak) (Max) I OP - ±1.5 A
Propagation Delay Time (H/L) (Max) tpHL - 500 ns
Propagation Delay Time (L/H) (Max) tpLH - 500 ns
Supply Voltage V CC - 10 - 35 V
Packaging - - 8-lead DIP -
Mounting - - Through Hole/Surface Mount -
Dimensions (mm) - - 9.66 × 7.62 × 3.65 -

Key Features

  • High Isolation Voltage: Up to 2500 Vrms, ensuring electrical isolation between the input and output circuits.
  • High Output Current: Capable of driving high current with a peak output current of ±1.5 A.
  • Fast Switching Times: Propagation delay times of 0.5 μs (max) for both high-to-low and low-to-high transitions.
  • Wide Supply Voltage Range: Operates with supply voltages from 10 V to 35 V.
  • RoHS Compliance: Ensures environmental sustainability and compliance with regulatory standards.
  • Safety Standards: Approved by UL 1577, cUL (CSA Component Acceptance Service No. 5A), and EN 60747-5-5 (VDE).

Applications

  • Inverters: Suitable for gate driving circuits in three-phase voltage source inverters.
  • PV Inverters: Used in photovoltaic inverters for solar power systems.
  • Induction Cooktops: Applied in the control circuits of induction cooktops.
  • IGBT and MOSFET Gate Drive: Ideal for driving IGBTs and power MOSFETs in various industrial applications.

Q & A

  1. What is the TLP250F(FA1-TP4S,F used for?

    The TLP250F is used for gate driving circuits of IGBTs and power MOSFETs in various industrial applications.

  2. What is the isolation voltage of the TLP250F?

    The isolation voltage is up to 2500 Vrms.

  3. What is the maximum output current of the TLP250F?

    The maximum output current is ±1.5 A.

  4. What are the propagation delay times for the TLP250F?

    The propagation delay times are 0.5 μs (max) for both high-to-low and low-to-high transitions.

  5. Is the TLP250F RoHS compliant?

    Yes, the TLP250F is RoHS compliant.

  6. What safety standards does the TLP250F meet?

    The TLP250F meets UL 1577, cUL (CSA Component Acceptance Service No. 5A), and EN 60747-5-5 (VDE) safety standards.

  7. What is the package type of the TLP250F?

    The package type is an 8-lead DIP (Dual In-Line Package).

  8. Can the TLP250F be mounted using both through-hole and surface mount techniques?

    Yes, it can be mounted using both through-hole and surface mount techniques.

  9. What are the dimensions of the TLP250F package?

    The dimensions are 9.66 × 7.62 × 3.65 mm.

  10. Is the TLP250F still in production?

    No, the TLP250F is shortly to be discontinued and is no longer in production.

Product Attributes

Technology:- 
Number of Channels:- 
Voltage - Isolation:- 
Common Mode Transient Immunity (Min):- 
Propagation Delay tpLH / tpHL (Max):- 
Pulse Width Distortion (Max):- 
Rise / Fall Time (Typ):- 
Current - Output High, Low:- 
Current - Peak Output:- 
Voltage - Forward (Vf) (Typ):- 
Current - DC Forward (If) (Max):- 
Voltage - Output Supply:- 
Operating Temperature:- 
Mounting Type:- 
Package / Case:- 
Supplier Device Package:- 
Approval Agency:- 
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