X66AK2G02ZBB60
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Texas Instruments X66AK2G02ZBB60

Manufacturer No:
X66AK2G02ZBB60
Manufacturer:
Texas Instruments
Package:
Tray
Description:
GALILEO
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The Texas Instruments X66AK2G02ZBB60 is a sophisticated Digital Signal Processor (DSP) and System-on-Chip (SoC) designed within the KeyStone II architecture. This GALILEO-based DSP+ARM processor integrates multiple cores, combining the processing power of DSPs with the flexibility of ARM cores. Although this product is no longer in manufacture, it remains a significant component in various high-performance applications due to its advanced features and capabilities.

Key Specifications

Specification Value
Type Multicore DSP+ARM KeyStone II System-on-Chip (SoC)
Package Type 625-NFBGA
Operating Temperature Range 0 to 90°C
Core Architecture DSP + ARM
Manufacturer Texas Instruments

Key Features

  • Multicore Architecture: Combines DSP and ARM cores for high-performance processing and flexibility.
  • High-Performance Processing: Designed for demanding applications requiring intensive signal processing and general-purpose computing.
  • GALILEO-Based: Part of the GALILEO family, known for its high-performance and low-power consumption.
  • Advanced System-on-Chip (SoC): Integrates various system components into a single chip, enhancing system efficiency and reducing complexity.

Applications

  • Telecommunications: Ideal for baseband processing, radio network controllers, and other telecom infrastructure.
  • Industrial Automation: Used in high-performance control systems, data acquisition, and real-time processing applications.
  • Medical Imaging: Suitable for medical imaging devices that require high-speed signal processing.
  • Defense and Aerospace: Employed in various defense and aerospace applications requiring robust and reliable signal processing.

Q & A

  1. What is the X66AK2G02ZBB60?

    The X66AK2G02ZBB60 is a Multicore DSP+ARM KeyStone II System-on-Chip (SoC) from Texas Instruments.

  2. What type of package does the X66AK2G02ZBB60 use?

    The X66AK2G02ZBB60 uses a 625-NFBGA package.

  3. What is the operating temperature range of the X66AK2G02ZBB60?

    The operating temperature range is from 0 to 90°C.

  4. Is the X66AK2G02ZBB60 still in production?

    No, the X66AK2G02ZBB60 is no longer in production.

  5. What are the key features of the X66AK2G02ZBB60?

    Key features include a multicore DSP+ARM architecture, high-performance processing, and a GALILEO-based design.

  6. What are some common applications of the X66AK2G02ZBB60?

    Common applications include telecommunications, industrial automation, medical imaging, and defense and aerospace.

  7. What is the significance of the KeyStone II architecture in the X66AK2G02ZBB60?

    The KeyStone II architecture integrates multiple cores for high-performance processing and flexibility.

  8. How does the X66AK2G02ZBB60 enhance system efficiency?

    The X66AK2G02ZBB60 enhances system efficiency by integrating various system components into a single chip, reducing complexity and improving performance.

  9. Where can I find detailed specifications for the X66AK2G02ZBB60?

    Detailed specifications can be found in the datasheet available from Texas Instruments or through distributors like Digi-Key, Mouser, and others.

  10. What is the GALILEO family known for?

    The GALILEO family is known for its high-performance and low-power consumption.

Product Attributes

Type:DSP+ARM®
Interface:CAN, DMA, EBI/EMI, Ethernet, I²C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
Clock Rate:600MHz
Non-Volatile Memory:External
On-Chip RAM:1MB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:0.9V
Operating Temperature:0°C ~ 90°C (TJ)
Mounting Type:Surface Mount
Package / Case:625-LFBGA
Supplier Device Package:625-NFBGA (21x21)
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Similar Products

Part Number X66AK2G02ZBB60 X66AK2G01ZBB60
Manufacturer Texas Instruments Texas Instruments
Product Status Obsolete Obsolete
Type DSP+ARM® DSP+ARM®
Interface CAN, DMA, EBI/EMI, Ethernet, I²C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB CAN, DMA, EBI/EMI, Ethernet, I²C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
Clock Rate 600MHz 600MHz
Non-Volatile Memory External External
On-Chip RAM 1MB 1MB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 0.9V 0.9V
Operating Temperature 0°C ~ 90°C (TJ) 0°C ~ 90°C (TJ)
Mounting Type Surface Mount Surface Mount
Package / Case 625-LFBGA 625-LFBGA
Supplier Device Package 625-NFBGA (21x21) 625-NFBGA (21x21)

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