TMS5703137CGWTQEP
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Texas Instruments TMS5703137CGWTQEP

Manufacturer No:
TMS5703137CGWTQEP
Manufacturer:
Texas Instruments
Package:
Tube
Description:
IC MCU 16/32B 3MB FLASH 337NFBGA
Delivery:
Payment:
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Product Introduction

Overview

The TMS570LS3137-EP, produced by Texas Instruments, is a high-performance 16- and 32-bit RISC flash microcontroller designed for safety-critical applications. This microcontroller features the ARM Cortex-R4F 32-bit RISC CPU, which provides efficient processing with up to 1.66 DMIPS/MHz and a maximum system clock frequency of 180 MHz. The device is part of the Hercules family and is known for its robust safety architecture, including dual CPUs in lockstep, CPU and memory built-in self-test (BIST) logic, and ECC on both flash and data SRAM. It is widely used in automotive, aerospace, medical, and industrial applications where reliability and real-time control are paramount.

Key Specifications

Parameter Description
Core Processor ARM Cortex-R4F 32-bit RISC CPU
System Clock Frequency Up to 180 MHz
Program Flash 3MB with ECC
RAM 256KB with ECC
Temperature Range –40°C to 125°C (TMS5703137CGWTQEP), –55°C to 125°C (TMS5703137CGWTMEP)
Package 337-Ball Grid Array (NFBGA)
Communication Interfaces 10/100 Mbps Ethernet MAC (EMAC), FlexRay, CAN, LIN, I2C, SPI, SCI
Analog-to-Digital Converters (ADCs) Two 12-bit ADCs with up to 24 and 16 channels respectively
Timer Modules Two Next Generation High-End Timer (N2HET) modules
Interrupt Module 96-Channel Vectored Interrupt Module (VIM)
DMA Controller 16 channels, 32 control packets with parity protection

Key Features

  • Embedded Trace Macrocell (ETM-R4) and RAM Trace Port (RTP)
  • Data Modification Module (DMM) and Parameter Overlay Module (POM)
  • Dual CPUs running in lockstep for enhanced safety
  • ECC on flash and RAM interfaces, and parity protection for peripheral memories
  • IEEE 802.3 compliant 10/100 Mbps Ethernet MAC (EMAC)
  • FlexRay controller with two channels
  • Three CAN controllers (DCANs) compliant to CAN Protocol Version 2.0B
  • Local Interconnect Network (LIN) interface controller
  • Two high-end timer modules (N2HETs) with programmable channels
  • Real-Time Interrupt Timer (RTI) and OS Timer
  • Direct Memory Access (DMA) controller with 16 channels and 32 control packets
  • Integrated safety features including CPU and memory BIST logic

Applications

  • Braking Systems (Antilock Brake Systems and Electronic Stability Control)
  • Electric Power Steering
  • HEV and EV Inverter Systems
  • Battery Management Systems
  • Active Driver Assistance Systems
  • Aerospace and Avionics
  • Railway Communications
  • Off-road Vehicles

Q & A

  1. What is the core processor of the TMS570LS3137-EP?

    The core processor is the ARM Cortex-R4F 32-bit RISC CPU.

  2. What is the maximum system clock frequency of the TMS570LS3137-EP?

    The maximum system clock frequency is up to 180 MHz.

  3. How much program flash and RAM does the TMS570LS3137-EP have?

    The device has 3MB of program flash and 256KB of RAM, both with ECC.

  4. What are the temperature ranges for the TMS5703137CGWTQEP and TMS5703137CGWTMEP?

    The TMS5703137CGWTQEP operates from –40°C to 125°C, while the TMS5703137CGWTMEP operates from –55°C to 125°C.

  5. What types of communication interfaces does the TMS570LS3137-EP support?

    The device supports 10/100 Mbps Ethernet MAC (EMAC), FlexRay, CAN, LIN, I2C, SPI, and SCI.

  6. How many and what type of ADCs are integrated into the TMS570LS3137-EP?

    The device includes two 12-bit ADCs with up to 24 and 16 channels respectively.

  7. What safety features are integrated into the TMS570LS3137-EP?

    The device features dual CPUs in lockstep, CPU and memory BIST logic, ECC on flash and RAM, and parity protection for peripheral memories.

  8. What is the purpose of the Parameter Overlay Module (POM) in the TMS570LS3137-EP?

    The POM allows parameters and tables to be dynamically calibrated against production code without rebuilding the code or halting the processor.

  9. What are some of the key applications for the TMS570LS3137-EP?

    Key applications include braking systems, electric power steering, HEV and EV inverter systems, battery management systems, and aerospace and avionics.

  10. What is the package type of the TMS5703137CGWTQEP?

    The package type is a 337-Ball Grid Array (NFBGA).

Product Attributes

Core Processor:ARM® Cortex®-R4F
Core Size:16/32-Bit
Speed:180MHz
Connectivity:CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:DMA, POR, PWM, WDT
Number of I/O:120
Program Memory Size:3MB (3M x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:256K x 8
Voltage - Supply (Vcc/Vdd):1.14V ~ 1.32V
Data Converters:A/D 16x12b, 24x12b
Oscillator Type:External
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:337-LFBGA
Supplier Device Package:337-NFBGA (16x16)
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Similar Products

Part Number TMS5703137CGWTQEP TMS5703137CGWTMEP
Manufacturer Texas Instruments Texas Instruments
Product Status Active Active
Core Processor ARM® Cortex®-R4F ARM® Cortex®-R4F
Core Size 16/32-Bit 16/32-Bit
Speed 180MHz 180MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 120 120
Program Memory Size 3MB (3M x 8) 3MB (3M x 8)
Program Memory Type Flash Flash
EEPROM Size - -
RAM Size 256K x 8 256K x 8
Voltage - Supply (Vcc/Vdd) 1.14V ~ 1.32V 1.14V ~ 1.32V
Data Converters A/D 16x12b, 24x12b A/D 16x12b, 24x12b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -55°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 337-LFBGA 337-LFBGA
Supplier Device Package 337-NFBGA (16x16) 337-NFBGA (16x16)

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