TMS320DM6431ZDUQ3
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Texas Instruments TMS320DM6431ZDUQ3

Manufacturer No:
TMS320DM6431ZDUQ3
Manufacturer:
Texas Instruments
Package:
Tube
Description:
IC DGTL MEDIA PROCESSOR 376-BGA
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Product Introduction

Overview

The TMS320DM6431ZDUQ3 is a high-performance digital media processor from Texas Instruments, part of the TMS320C6000 DSP platform. This device is based on the third-generation C64x+ DSP core, which features an advanced VelociTI very-long-instruction-word (VLIW) architecture. The DM6431 is designed for demanding digital media applications, including video imaging, networked media, and encode/decode processes. It offers a robust set of peripherals and memory configurations, making it an ideal choice for applications requiring high computational power and flexibility.

Key Specifications

ParameterSpecification
Processor CoreC64x+ DSP Core
Clock Rate300 MHz
Instruction Cycle Time3.33 ns
L1 Program Memory/Cache256K-Bit (32K-Byte), configurable as mapped memory or direct mapped cache
L1 Data Memory/Cache512K-Bit (64K-Byte), configurable as mapped memory or 2-way set-associative cache
L2 Unified Memory/Cache512K-Bit (64K-Byte), shared between program and data space, configurable as mapped memory, cache, or a combination of both
Supply Voltage1.14 V to 3.63 V
Package Type376-Pin Plastic BGA Package (ZDU Suffix), 1.0-mm Ball Pitch
InterfacesEthernet MAC (EMAC), I2C, McASP, UART, CAN
General-Purpose I/O (GPIO) PinsUp to 111

Key Features

  • High-performance C64x+ DSP core with eight highly independent functional units, including two multipliers and six arithmetic logic units (ALUs).
  • Support for up to 2400 MIPS and 1200 million MACs per second (MMACS).
  • Flexible memory architecture with L1 and L2 caches configurable as mapped memory or cache.
  • Integrated peripherals such as 10/100 Mb/s Ethernet MAC (EMAC) with MDIO module, high-end CAN controller, and three PWM outputs.
  • On-chip ROM bootloader and individual power-saving modes.
  • Boundary-scan-compatible with IEEE-1149.1 (JTAG) interface.

Applications

The TMS320DM6431ZDUQ3 is suited for a variety of demanding digital media applications, including:

  • Video imaging and processing
  • Networked media encode and decode
  • Digital media processing
  • Embedded systems requiring high computational power

Q & A

  1. What is the clock rate of the TMS320DM6431ZDUQ3? The clock rate is 300 MHz.
  2. What is the instruction cycle time of the DM6431? The instruction cycle time is 3.33 ns.
  3. What type of memory architecture does the DM6431 have? The DM6431 features a two-level cache-based architecture with L1 and L2 memory/cache configurations.
  4. What are the key peripherals included in the DM6431? Key peripherals include a 10/100 Mb/s Ethernet MAC (EMAC), I2C, McASP, UART, and a high-end CAN controller.
  5. What is the package type of the TMS320DM6431ZDUQ3? The package type is a 376-Pin Plastic BGA Package (ZDU Suffix) with a 1.0-mm ball pitch.
  6. Does the DM6431 support boundary scan? Yes, it is boundary-scan-compatible with IEEE-1149.1 (JTAG) interface.
  7. What are the supply voltage ranges for the DM6431? The supply voltage ranges from 1.14 V to 3.63 V.
  8. How many general-purpose I/O (GPIO) pins does the DM6431 have? The DM6431 has up to 111 GPIO pins.
  9. What are some typical applications of the TMS320DM6431ZDUQ3? Typical applications include video imaging, networked media, and other digital media processing tasks.
  10. Does the DM6431 have power-saving modes? Yes, the DM6431 has individual power-saving modes.

Product Attributes

Type:Fixed Point
Interface:I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
Clock Rate:300MHz
Non-Volatile Memory:ROM (64kB)
On-Chip RAM:128KB
Voltage - I/O:1.8V, 3.3V
Voltage - Core:1.20V
Operating Temperature:-40°C ~ 125°C (TJ)
Mounting Type:Surface Mount
Package / Case:376-BBGA Exposed Pad
Supplier Device Package:376-BGA (23x23)
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Similar Products

Part Number TMS320DM6431ZDUQ3 TMS320DM6431ZDU3
Manufacturer Texas Instruments Texas Instruments
Product Status Active Not For New Designs
Type Fixed Point Fixed Point
Interface I²C, McASP, McBSP, UART, 10/100 Ethernet MAC I²C, McASP, McBSP, UART, 10/100 Ethernet MAC
Clock Rate 300MHz 300MHz
Non-Volatile Memory ROM (64kB) ROM (64kB)
On-Chip RAM 128KB 128KB
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V
Voltage - Core 1.20V 1.20V
Operating Temperature -40°C ~ 125°C (TJ) 0°C ~ 90°C (TJ)
Mounting Type Surface Mount Surface Mount
Package / Case 376-BBGA Exposed Pad 376-BBGA Exposed Pad
Supplier Device Package 376-BGA (23x23) 376-BGA (23x23)

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