TMS320C6713BGDP300
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Texas Instruments TMS320C6713BGDP300

Manufacturer No:
TMS320C6713BGDP300
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC FLOATING-POINT DSP 272-BGA
Delivery:
Payment:
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Product Introduction

Overview

The TMS320C6713B, specifically the TMS320C6713BGDP300, is a high-performance floating-point Digital Signal Processor (DSP) developed by Texas Instruments. It is part of the TMS320C6000 DSP platform and is based on the advanced very-long-instruction-word (VLIW) architecture. This architecture makes the C6713B an excellent choice for multichannel and multifunction applications, particularly in audio processing and other real-time signal processing tasks.

Operating at clock rates of up to 300 MHz, the C6713B delivers exceptional performance, including up to 2400 million instructions per second (MIPS) and 1800 million floating-point operations per second (MFLOPS). The device is optimized for audio applications and features a rich set of peripherals, including multichannel buffered serial ports, I2C ports, and a high-speed TDM interface.

Key Specifications

Specification Details
Clock Rates 300 MHz, 225 MHz, 200 MHz, 167 MHz
Instruction Execution Eight 32-bit instructions per cycle
Data Word 32-bit and 64-bit data word
Performance Metrics Up to 2400 MIPS, 1800 MFLOPS, 600 MMACS
Functional Units Eight independent functional units: 2 ALUs (fixed-point), 4 ALUs (floating-point and fixed-point), 2 multipliers (floating-point and fixed-point)
Memory and Registers Load store architecture with 32 32-bit general-purpose registers
Peripheral Set Rich peripheral set including McASP, SPI, I2C ports, GPIO module, and high-speed TDM interface
Package Options 272-BGA packages (GDP and ZDP), 208-Pin PowerPAD PQFP (PYP)
Voltage and Technology 3.3-V I/Os, 1.2-V internal (GDP/ZDP/PYP), CMOS technology, 0.13-µm/6-Level Copper Metal Process

Key Features

  • Advanced VLIW Architecture: The C6713B is based on the high-performance, advanced VLIW architecture developed by Texas Instruments, which includes features like instruction packing, conditional branching, and pre-fetched branching.
  • High-Performance Processing: Delivers up to 2400 MIPS and 1800 MFLOPS, making it suitable for demanding signal processing tasks.
  • Rich Peripheral Set: Includes multichannel buffered serial ports (McBSP), serial-peripheral-interface (SPI), I2C ports, high-speed TDM interface, and a dedicated GPIO module.
  • Audio Optimization: Optimized for audio applications with features like the McASP, which supports multiple audio formats and error-checking capabilities.
  • Highly Optimized Compiler: Features a highly optimized C/C++ compiler to enhance code efficiency and reduce development time.
  • Flexible Clocking and Power Management: Includes a flexible phase-locked-loop (PLL) based clock generator module and supports various voltage levels.

Applications

  • Audio Processing: Ideal for multichannel audio applications, including professional audio equipment, audio interfaces, and digital audio workstations.
  • Real-Time Signal Processing: Suitable for real-time signal processing in various fields such as telecommunications, medical devices, and industrial control systems.
  • Embedded Systems: Used in embedded systems that require high-performance processing, such as in automotive, aerospace, and defense applications.
  • Medical Imaging and Diagnostics: Can be applied in medical imaging and diagnostic equipment due to its high processing capabilities and precision.

Q & A

  1. What is the maximum clock rate of the TMS320C6713B?

    The maximum clock rate of the TMS320C6713B is 300 MHz.

  2. How many instructions can the TMS320C6713B execute per cycle?

    The TMS320C6713B can execute eight 32-bit instructions per cycle.

  3. What type of architecture does the TMS320C6713B use?

    The TMS320C6713B uses the advanced very-long-instruction-word (VLIW) architecture.

  4. What are the key peripherals of the TMS320C6713B?

    The key peripherals include multichannel buffered serial ports (McBSP), SPI, I2C ports, high-speed TDM interface, and a dedicated GPIO module.

  5. What is the purpose of the McASP in the TMS320C6713B?

    The McASP is used for audio interfaces and supports multiple audio formats, including S/PDIF, AES-3, and IEC-60958.

  6. How many I2C ports does the TMS320C6713B have?

    The TMS320C6713B has two I2C ports capable of master and slave interfaces.

  7. What is the role of the EDMA controller in the TMS320C6713B?

    The EDMA controller allows designers to optimize data organization and transfers data in the background of DSP core operation, handling multiple transfers simultaneously.

  8. What are the package options for the TMS320C6713B?

    The package options include 272-BGA packages (GDP and ZDP) and 208-Pin PowerPAD PQFP (PYP).

  9. What is the voltage requirement for the TMS320C6713B?

    The TMS320C6713B requires 3.3-V I/Os and 1.2-V internal voltage for GDP/ZDP/PYP packages.

  10. What technology is used in the manufacturing of the TMS320C6713B?

    The TMS320C6713B is manufactured using CMOS technology with a 0.13-µm/6-Level Copper Metal Process.

Product Attributes

Type:Floating Point
Interface:Host Interface, I²C, McASP, McBSP
Clock Rate:300MHz
Non-Volatile Memory:External
On-Chip RAM:264kB
Voltage - I/O:3.30V
Voltage - Core:1.40V
Operating Temperature:0°C ~ 90°C (TC)
Mounting Type:Surface Mount
Package / Case:272-BBGA
Supplier Device Package:272-BGA (27x27)
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Similar Products

Part Number TMS320C6713BGDP300 TMS320C6713BZDP300
Manufacturer Texas Instruments Texas Instruments
Product Status Active Active
Type Floating Point Floating Point
Interface Host Interface, I²C, McASP, McBSP Host Interface, I²C, McASP, McBSP
Clock Rate 300MHz 300MHz
Non-Volatile Memory External External
On-Chip RAM 264kB 264kB
Voltage - I/O 3.30V 3.30V
Voltage - Core 1.40V 1.40V
Operating Temperature 0°C ~ 90°C (TC) 0°C ~ 90°C (TC)
Mounting Type Surface Mount Surface Mount
Package / Case 272-BBGA 272-BBGA
Supplier Device Package 272-BGA (27x27) 272-BGA (27x27)

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