TMS320C6713BGDP225
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Texas Instruments TMS320C6713BGDP225

Manufacturer No:
TMS320C6713BGDP225
Manufacturer:
Texas Instruments
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Bulk
Description:
IC FLOATING POINT DSP 272-BGA
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Product Introduction

Overview

The TMS320C6713BGDP225 is a high-performance floating-point digital signal processor (DSP) from Texas Instruments, designed for demanding applications that require advanced processing capabilities and low power consumption. This DSP is part of the TMS320C6000 DSP platform and is based on the advanced very-long-instruction-word (VLIW) architecture. It operates at a clock rate of 225 MHz, making it an excellent choice for multichannel and multifunction applications such as audio processing, image processing, and data compression.

Key Specifications

Parameter Specification
Manufacturer Texas Instruments
Part Number TMS320C6713BGDP225
Clock Rate 225 MHz
Instruction Execution Eight 32-bit instructions per cycle
Data Word 32/64-bit
MIPS/MFLOPS Up to 1800 MIPS, 1350 MFLOPS
Functional Units Eight independent functional units: 2 ALUs (fixed-point), 4 ALUs (floating-/fixed-point), 2 multipliers (floating-/fixed-point)
Memory Architecture 4K-byte L1P program cache, 4K-byte L1D data cache, 256K-byte L2 memory
External Memory Interface 32-bit EMIF, supports SRAM, EPROM, Flash, SBSRAM, and SDRAM
Package Type 272-pin BGA (Ball Grid Array)
Power Consumption Low power consumption, 3.3-V I/Os, 1.2-V internal

Key Features

  • High-Performance Processing: Capable of executing complex algorithms and processing large amounts of data with up to 1800 MIPS and 1350 MFLOPS.
  • Advanced VLIW Architecture: Features eight independent functional units, including ALUs and multipliers, and a load-store architecture with 32 32-bit general-purpose registers.
  • Rich Peripheral Set: Includes two multichannel audio serial ports (McASPs), two multichannel buffered serial ports (McBSPs), two I2C interfaces, SPI, UART, and GPIO interfaces.
  • Audio Interfaces: Supports S/PDIF, I2S, AES-3, and CP-430 formats.
  • Low Power Consumption: Designed to operate at low power levels, making it suitable for battery-powered devices.
  • Instruction Packing: Reduces code size, and all instructions are conditional.

Applications

  • Audio Processing Systems: Ideal for applications requiring advanced audio processing capabilities.
  • Image Processing Systems: Suitable for image processing tasks that demand high-performance processing.
  • Data Compression Systems: Effective for data compression applications due to its high processing capabilities.
  • Battery-Powered Devices: Low power consumption makes it suitable for battery-powered devices.
  • Embedded Systems: Ideal for embedded systems requiring advanced processing and low power consumption.

Q & A

  1. What is the clock rate of the TMS320C6713BGDP225?

    The TMS320C6713BGDP225 operates at a clock rate of 225 MHz.

  2. What is the MIPS and MFLOPS performance of this DSP?

    It delivers up to 1800 MIPS and 1350 MFLOPS.

  3. What type of memory architecture does it have?

    The DSP features a 4K-byte L1P program cache, 4K-byte L1D data cache, and 256K-byte L2 memory.

  4. What are the key peripherals included in this DSP?

    It includes two McASPs, two McBSPs, two I2C interfaces, SPI, UART, and GPIO interfaces.

  5. Is this DSP suitable for battery-powered devices?

    Yes, it is designed to operate at low power consumption levels, making it suitable for battery-powered devices.

  6. What is the package type of the TMS320C6713BGDP225?

    The package type is a 272-pin BGA (Ball Grid Array).

  7. What are the supported audio formats?

    It supports S/PDIF, I2S, AES-3, and CP-430 formats.

  8. Does this DSP support external memory?

    Yes, it has a 32-bit EMIF that supports SRAM, EPROM, Flash, SBSRAM, and SDRAM.

  9. What is the VLIW architecture of this DSP?

    The DSP features an advanced VLIW architecture with eight independent functional units.

  10. Is the TMS320C6713BGDP225 still active for new designs?

    Yes, it is active and recommended for new designs.

Product Attributes

Type:Floating Point
Interface:Host Interface, I²C, McASP, McBSP
Clock Rate:225MHz
Non-Volatile Memory:External
On-Chip RAM:264kB
Voltage - I/O:3.30V
Voltage - Core:1.26V
Operating Temperature:0°C ~ 90°C (TC)
Mounting Type:Surface Mount
Package / Case:272-BBGA
Supplier Device Package:272-BGA (27x27)
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Similar Products

Part Number TMS320C6713BGDP225 TMS320C6713BZDP225
Manufacturer Texas Instruments Texas Instruments
Product Status Active Active
Type Floating Point Floating Point
Interface Host Interface, I²C, McASP, McBSP Host Interface, I²C, McASP, McBSP
Clock Rate 225MHz 225MHz
Non-Volatile Memory External External
On-Chip RAM 264kB 264kB
Voltage - I/O 3.30V 3.30V
Voltage - Core 1.26V 1.26V
Operating Temperature 0°C ~ 90°C (TC) 0°C ~ 90°C (TC)
Mounting Type Surface Mount Surface Mount
Package / Case 272-BBGA 272-BBGA
Supplier Device Package 272-BGA (27x27) 272-BGA (27x27)

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