TMS320C6211BGFN150
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Texas Instruments TMS320C6211BGFN150

Manufacturer No:
TMS320C6211BGFN150
Manufacturer:
Texas Instruments
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Tube
Description:
IC FIXED-POINT DSP 256-BGA
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Product Introduction

Overview

The TMS320C6211BGFN150 is a high-performance fixed-point digital signal processor (DSP) developed by Texas Instruments. It is part of the TMS320C62x DSP family, which is based on the advanced VelociTI very-long-instruction-word (VLIW) architecture. This architecture makes the C6211B an excellent choice for multichannel and multifunction applications, offering a balance of operational flexibility and numerical capability.

The device operates at clock rates of 150 MHz and 167 MHz, achieving performance levels of up to 1333 million instructions per second (MIPS). It features 32 general-purpose registers and eight highly independent functional units, including six arithmetic logic units (ALUs) and two 16-bit multipliers. This configuration enables the processor to perform two multiply-accumulates (MACs) per cycle, resulting in a total of 333 million MACs per second (MMACS).

Key Specifications

Specification Details
Clock Rates 150 MHz, 167 MHz
Instruction Cycle Time 6.7 ns (150 MHz), 6 ns (167 MHz)
MIPS Performance Up to 1333 MIPS
Functional Units Eight highly independent units: six ALUs (32-/40-Bit), two 16-Bit multipliers (32-Bit results)
General-Purpose Registers 32 registers of 32-bit word length
Cache Architecture 32K-Bit (4K-Byte) L1P Program Cache, 32K-Bit (4K-Byte) L1D Data Cache, 512K-Bit (64K-Byte) L2 Unified Mapped RAM/Cache
External Memory Interface 32-Bit EMIF, glueless interface to SRAM, EPROM, SDRAM, and SBSRAM
Total Addressable External Memory 512M-Byte
Package 256-Pin Ball Grid Array (BGA) Package (GFN and ZFN Suffixes)
Process Technology 0.18-µm/5-Level Metal Process, CMOS Technology
Voltage 3.3-V I/Os, 1.8-V Internal

Key Features

  • Excellent price/performance ratio with up to 1333 MIPS at 167 MHz clock rate
  • Eight highly independent functional units including six ALUs and two 16-bit multipliers
  • Load-store architecture with 32 32-bit general-purpose registers
  • Instruction packing reduces code size, and all instructions are conditional
  • Byte-addressable (8-, 16-, 32-Bit data) with features like 8-bit overflow protection, saturation, bit-field extract, set, clear, bit-counting, and normalization
  • L1/L2 memory architecture with flexible data/program allocation
  • Boot mode: HPI, 8-, 16-, and 32-Bit ROM Boot; Endianness: Little Endian, Big Endian
  • Enhanced Direct-Memory-Access (EDMA) controller with 16 independent channels
  • 16-Bit Host-Port Interface (HPI) with access to entire memory map
  • Two multichannel buffered serial ports (McBSPs) with direct interface to T1/E1, MVIP, SCSA framers
  • Serial-Peripheral-Interface (SPI) compatible and AC97-compatible
  • Two 32-bit general-purpose timers and a flexible Phase-Locked-Loop (PLL) clock generator
  • IEEE-1149.1 (JTAG) boundary-scan-compatible

Applications

The TMS320C6211BGFN150 is suitable for a wide range of applications that require high-performance digital signal processing, including:

  • Telecommunications: Supports interfaces for T1/E1, MVIP, SCSA framers, and other telecommunication standards.
  • Audio and Video Processing: AC97-compatible and supports various audio and video codecs.
  • Industrial Control: High-speed controllers with numerical capabilities similar to array processors.
  • Medical Imaging: High-performance processing for medical imaging applications.
  • Embedded Systems: Ideal for systems requiring multichannel and multifunction capabilities.

Q & A

  1. What is the clock rate of the TMS320C6211BGFN150?

    The clock rates are 150 MHz and 167 MHz.

  2. What is the MIPS performance of the TMS320C6211BGFN150?

    Up to 1333 MIPS.

  3. How many functional units does the TMS320C6211BGFN150 have?

    Eight highly independent functional units, including six ALUs and two 16-bit multipliers.

  4. What is the cache architecture of the TMS320C6211BGFN150?

    32K-Bit (4K-Byte) L1P Program Cache, 32K-Bit (4K-Byte) L1D Data Cache, and 512K-Bit (64K-Byte) L2 Unified Mapped RAM/Cache.

  5. What type of external memory interface does the TMS320C6211BGFN150 support?

    32-Bit EMIF with glueless interface to SRAM, EPROM, SDRAM, and SBSRAM.

  6. What is the total addressable external memory space of the TMS320C6211BGFN150?

    512M-Byte.

  7. What is the package type of the TMS320C6211BGFN150?

    256-Pin Ball Grid Array (BGA) Package (GFN and ZFN Suffixes).

  8. What is the process technology used in the TMS320C6211BGFN150?

    0.18-µm/5-Level Metal Process, CMOS Technology.

  9. What are the voltage specifications for the TMS320C6211BGFN150?

    3.3-V I/Os, 1.8-V Internal.

  10. Is the TMS320C6211BGFN150 compatible with JTAG?

    Yes, it is IEEE-1149.1 (JTAG) boundary-scan-compatible.

  11. What development tools are available for the TMS320C6211BGFN150?

    A new C compiler, an assembly optimizer, and a Windows debugger interface are available.

Product Attributes

Type:Fixed Point
Interface:Host Interface, McBSP
Clock Rate:150MHz
Non-Volatile Memory:External
On-Chip RAM:72kB
Voltage - I/O:3.30V
Voltage - Core:1.80V
Operating Temperature:0°C ~ 90°C (TC)
Mounting Type:Surface Mount
Package / Case:256-BGA
Supplier Device Package:256-BGA (27x27)
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Similar Products

Part Number TMS320C6211BGFN150 TMS320C6211BGFN180 TMS320C6211BZFN150 TMS320C6211GFN150
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active Obsolete
Type Fixed Point Fixed Point Fixed Point Fixed Point
Interface Host Interface, McBSP Host Interface, McBSP Host Interface, McBSP Host Interface, McBSP
Clock Rate 150MHz 180MHz 150MHz 150MHz
Non-Volatile Memory External External External External
On-Chip RAM 72kB 72kB 72kB 72kB
Voltage - I/O 3.30V 3.30V 3.30V 3.30V
Voltage - Core 1.80V 1.80V 1.80V 1.80V
Operating Temperature 0°C ~ 90°C (TC) 0°C ~ 90°C (TC) 0°C ~ 90°C (TC) 0°C ~ 90°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 256-BGA 256-BGA 256-BGA 256-BGA
Supplier Device Package 256-BGA (27x27) 256-BGA (27x27) 256-BGA (27x27) 256-BGA (27x27)

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