SM32C6713BGDPM30EP
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Texas Instruments SM32C6713BGDPM30EP

Manufacturer No:
SM32C6713BGDPM30EP
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC FLOATING-POINT DSP 272-BGA
Delivery:
Payment:
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Product Introduction

Overview

The SM32C6713BGDPM30EP is a high-performance floating-point digital signal processor (DSP) manufactured by Texas Instruments. It belongs to the TMS320C67x series and is part of the TMS320C6000 DSP platform. This DSP is renowned for its advanced very-long-instruction-word (VLIW) architecture, making it an excellent choice for multichannel and multifunction applications.

Key Specifications

ParameterSpecification
Clock Rate200 MHz and 300 MHz
Instructions per CycleEight 32-bit instructions/cycle
Data Word32/64-bit data word
MIPS/MFLOPS2400/1800 and 1600/1200 MIPS/MFLOPS
External Memory Interface32-bit external memory interface (EMIF), glueless interface to SRAM, EPROM, Flash, SBSRAM, and SDRAM
Total Addressable External Memory512M byte total addressable external memory space
Instruction Cycle Times5 instruction cycle times
Functional UnitsEight independent functional units: Two ALUs (fixed point), four ALUs (floating point and fixed point), two multipliers (floating point and fixed point)
General Purpose Registers32 32-bit general purpose registers
Cache Memory4K byte L1P program cache, 4K byte L1D data cache, 256K byte L2 memory
Operating Temperature–55°C to 125°C
Package272 ball, ball grid array package (GDP)

Key Features

  • Advanced VLIW architecture with eight independent functional units, including two fixed-point ALUs, four floating-point and fixed-point ALUs, and two multipliers.
  • Rich peripheral set optimized for audio applications, including two multichannel audio serial ports (McASPs) and two multichannel buffered serial ports (McBSPs).
  • Enhanced Direct Memory Access (EDMA) controller with 16 independent channels.
  • 16-bit host port interface (HPI) and two I2C ports for communication with peripheral devices and host processors.
  • Highly optimized C/C++ compiler and instruction packing to reduce code size.
  • All instructions are conditional, and the architecture includes load-store architecture with 32 32-bit general purpose registers.
  • Integrated digital audio interface transmitter and extensive error-checking and recovery features.
  • Dedicated GPIO module with 16 pins and two 32-bit general purpose timers.

Applications

The SM32C6713BGDPM30EP is suitable for a wide range of applications that require high-performance digital signal processing, such as:

  • Audio processing and multichannel audio systems.
  • Image and video processing.
  • Telecommunications and wireless communication systems.
  • Industrial control and automation systems.
  • Medical imaging and diagnostic equipment.

Q & A

  1. What is the clock rate of the SM32C6713BGDPM30EP?
    The clock rate of the SM32C6713BGDPM30EP is 200 MHz and 300 MHz.
  2. How many instructions can the SM32C6713BGDPM30EP execute per cycle?
    The SM32C6713BGDPM30EP can execute eight 32-bit instructions per cycle.
  3. What is the total addressable external memory space of the SM32C6713BGDPM30EP?
    The total addressable external memory space is 512M bytes.
  4. What type of memory interfaces does the SM32C6713BGDPM30EP support?
    The SM32C6713BGDPM30EP supports glueless interface to SRAM, EPROM, Flash, SBSRAM, and SDRAM.
  5. What are the key features of the McASP in the SM32C6713BGDPM30EP?
    The McASP features include extensive error-checking and recovery, support for multiple S/PDIF, IEC60958, AES-3, and CP-430 encoded data channels, and eight serial data pins per port.
  6. Does the SM32C6713BGDPM30EP support I2C communication?
    Yes, the SM32C6713BGDPM30EP supports two I2C ports for communication with peripheral devices and host processors.
  7. What is the operating temperature range of the SM32C6713BGDPM30EP?
    The operating temperature range is –55°C to 125°C.
  8. What type of package does the SM32C6713BGDPM30EP come in?
    The SM32C6713BGDPM30EP comes in a 272 ball, ball grid array package (GDP).
  9. What are some common applications of the SM32C6713BGDPM30EP?
    Common applications include audio processing, image and video processing, telecommunications, industrial control, and medical imaging.
  10. Does the SM32C6713BGDPM30EP have a dedicated GPIO module?
    Yes, the SM32C6713BGDPM30EP has a dedicated GPIO module with 16 pins.

Product Attributes

Type:Floating Point
Interface:Host Interface, I²C, McASP, McBSP
Clock Rate:300MHz
Non-Volatile Memory:External
On-Chip RAM:264kB
Voltage - I/O:3.30V
Voltage - Core:1.26V
Operating Temperature:-55°C ~ 125°C (TC)
Mounting Type:Surface Mount
Package / Case:272-BBGA
Supplier Device Package:272-BGA (27x27)
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