OMAPL138EZCED4E
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Texas Instruments OMAPL138EZCED4E

Manufacturer No:
OMAPL138EZCED4E
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC MPU OMAP-L1X 456MHZ 361NFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The OMAP-L138 C6000 DSP+ARM processor, produced by Texas Instruments, is a low-power applications processor that integrates an ARM926EJ-S core and a C674x DSP core. This dual-core architecture combines the benefits of both DSP and RISC technologies, offering high-performance processing with significantly lower power consumption compared to other members of the TMS320C6000 platform of DSPs. The processor is designed to enable original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly develop devices with robust operating systems, rich user interfaces, and high processor performance.

Key Specifications

Characteristic Description
CPU Cores ARM926EJ-S and C674x DSP core
CPU Frequency 375 MHz (1.2V) or 456 MHz (1.3V) for both ARM and DSP cores
Memory 128KB of RAM shared memory, 16KB of instruction cache, 16KB of data cache, 8KB of RAM (Vector Table), 256KB of L2 RAM, and 32KB of L1 RAM
External Memory Interfaces Asynchronous and SDRAM external memory interface (EMIFA), DDR2/Mobile DDR controller
Peripheral Interfaces USB 2.0 OTG, USB 1.1 OHCI, 10/100 Mbps Ethernet MAC (EMAC), Serial ATA (SATA) controller, Multichannel Audio Serial Port (McASP), Multichannel Buffered Serial Ports (McBSPs), SPI, I2C, UART
Timers and PWM Three 64-Bit General-Purpose Timers, One 64-Bit General-Purpose or Watchdog Timer, Two Enhanced High-Resolution Pulse Width Modulators (eHRPWM)
Capture Modules Three 32-Bit Enhanced Capture (eCAP) Modules
Package 361-Ball Pb-Free Plastic Ball Grid Array (PBGA) with 0.65-mm or 0.80-mm ball pitch
Temperature Range Commercial, Extended, or Industrial Temperature

Key Features

  • Dual-Core SoC with ARM926EJ-S and C674x DSP cores
  • High-performance processing with low power consumption
  • Integrated peripherals: USB, Ethernet, SATA, McASP, McBSPs, SPI, I2C, UART
  • Enhanced High-Resolution Pulse Width Modulators (eHRPWM) and Enhanced Capture (eCAP) Modules
  • Support for multiple memory interfaces: EMIFA, DDR2/Mobile DDR
  • Real-Time Clock (RTC) with 32-kHz oscillator and separate power rail
  • Up to 9 banks of general-purpose input/output (GPIO) pins
  • Video Port Interface (VPIF) for video capture and display
  • Universal Parallel Port (uPP) for high-speed parallel interface

Applications

  • Professional or Private Mobile Radio (PMR)
  • Remote Radio Unit (RRU) and Remote Radio Head (RRH)
  • Industrial Automation
  • Currency Inspection and Biometric Identification
  • Machine Vision (Low-End)
  • Smart Grid Substation Protection
  • Industrial Portable Navigation Devices

Q & A

  1. What are the core components of the OMAP-L138 processor?

    The OMAP-L138 processor includes an ARM926EJ-S core and a C674x DSP core.

  2. What are the CPU frequencies of the OMAP-L138?

    The CPU frequencies are 375 MHz (1.2V) or 456 MHz (1.3V) for both ARM and DSP cores.

  3. What types of memory interfaces does the OMAP-L138 support?

    The OMAP-L138 supports asynchronous and SDRAM external memory interface (EMIFA) and DDR2/Mobile DDR controller.

  4. What peripheral interfaces are available on the OMAP-L138?

    The available interfaces include USB 2.0 OTG, USB 1.1 OHCI, 10/100 Mbps Ethernet MAC (EMAC), Serial ATA (SATA) controller, McASP, McBSPs, SPI, I2C, and UART.

  5. What is the package type and temperature range of the OMAP-L138?

    The package is a 361-Ball Pb-Free Plastic Ball Grid Array (PBGA) with 0.65-mm or 0.80-mm ball pitch, and it supports Commercial, Extended, or Industrial Temperature ranges.

  6. What are some of the key applications of the OMAP-L138?

    Key applications include Professional or Private Mobile Radio (PMR), Remote Radio Unit (RRU), Industrial Automation, Currency Inspection, Biometric Identification, Machine Vision (Low-End), Smart Grid Substation Protection, and Industrial Portable Navigation Devices.

  7. Does the OMAP-L138 support real-time clock functionality?

    Yes, it includes a Real-Time Clock (RTC) with a 32-kHz oscillator and a separate power rail.

  8. What is the purpose of the Enhanced Capture (eCAP) Modules?

    The eCAP Modules can be configured as 3 capture inputs or 3 auxiliary PWM outputs and support single-shot capture of up to four event timestamps.

  9. What is the Universal Parallel Port (uPP) used for?

    The uPP provides a high-speed parallel interface to FPGAs and data converters, supporting single-data rate or dual-data rate transfers.

  10. Does the OMAP-L138 support SATA interfaces?

    Yes, it includes a Serial ATA (SATA) controller that supports SATA I (1.5 Gbps) and SATA II (3.0 Gbps) with all SATA power-management features.

Product Attributes

Core Processor:ARM926EJ-S
Number of Cores/Bus Width:1 Core, 32-Bit
Speed:456MHz
Co-Processors/DSP:Signal Processing; C674x, System Control; CP15
RAM Controllers:SDRAM
Graphics Acceleration:No
Display & Interface Controllers:LCD
Ethernet:10/100Mbps (1)
SATA:SATA 3Gbps (1)
USB:USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O:1.8V, 3.3V
Operating Temperature:-40°C ~ 90°C (TJ)
Security Features:Boot Security, Cryptography
Package / Case:361-LFBGA
Supplier Device Package:361-NFBGA (13x13)
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Similar Products

Part Number OMAPL138EZCED4E OMAPL138BZCED4E OMAPL138EZCED4
Manufacturer Texas Instruments Texas Instruments Texas Instruments
Product Status Active Obsolete Active
Core Processor ARM926EJ-S ARM926EJ-S ARM926EJ-S
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit
Speed 456MHz 456MHz 456MHz
Co-Processors/DSP Signal Processing; C674x, System Control; CP15 Signal Processing; C674x, System Control; CP15 Signal Processing; C674x, System Control; CP15
RAM Controllers SDRAM SDRAM SDRAM
Graphics Acceleration No No No
Display & Interface Controllers LCD LCD LCD
Ethernet 10/100Mbps (1) 10/100Mbps (1) 10/100Mbps (1)
SATA SATA 3Gbps (1) SATA 3Gbps (1) SATA 3Gbps (1)
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1) USB 1.1 + PHY (1), USB 2.0 + PHY (1) USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V 1.8V, 3.3V
Operating Temperature -40°C ~ 90°C (TJ) -40°C ~ 90°C (TJ) -40°C ~ 90°C (TJ)
Security Features Boot Security, Cryptography Boot Security, Cryptography Boot Security, Cryptography
Package / Case 361-LFBGA 361-LFBGA 361-LFBGA
Supplier Device Package 361-NFBGA (13x13) 361-NFBGA (13x13) 361-NFBGA (13x13)

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