F28M35H52C1RFPQ
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Texas Instruments F28M35H52C1RFPQ

Manufacturer No:
F28M35H52C1RFPQ
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC MCU 32BIT 512KB FLASH 144TQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The F28M35H52C1RFPQ is a dual-core microcontroller from Texas Instruments, part of the Concerto family of multicore system-on-chip (SoC) microcontrollers. This device integrates independent communication and real-time control subsystems, making it highly versatile for various industrial and automotive applications. The communications subsystem is based on the 32-bit Arm Cortex-M3 CPU, while the real-time control subsystem uses TI’s proprietary 32-bit C28x floating-point CPU. This combination enables advanced closed-loop control and high-speed communication capabilities.

Key Specifications

Parameter Specification
Processor Cores Dual-core: Arm Cortex-M3 and TMS320C28x 32-bit CPU
Core Speeds Cortex-M3: Up to 100 MHz, C28x: Up to 150 MHz
Memory Up to 512KB of flash (ECC), Up to 36KB of RAM (ECC or parity), 64KB of shared RAM, 2KB of IPC Message RAM
Communication Peripherals Ethernet 1588, USB OTG with PHY, CAN, UART, SSI, I2C
Control Peripherals 9 Enhanced Pulse Width Modulator (ePWM) modules, 6 Enhanced Capture (eCAP) modules, 3 Enhanced Quadrature Encoder Pulse (eQEP) modules
GPIO Up to 74 individually programmable, multiplexed General-Purpose Input/Output (GPIO) pins
Package 144-Pin RFP PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP)
Temperature Range T: –40°C to 105°C Junction, S: –40°C to 125°C Junction, Q: –40°C to 125°C Free-Air (AEC Q100 qualification for automotive applications)

Key Features

  • Dual-Core Architecture: Combines the industry-standard 32-bit Arm Cortex-M3 CPU for communication with TI’s proprietary 32-bit C28x floating-point CPU for real-time control.
  • Advanced Control Peripherals: Includes ePWMs with fault protection, encoders, and captures, along with a VCU instruction accelerator for efficient Viterbi, Complex Arithmetic, 16-bit FFTs, and CRC algorithms.
  • High-Speed Communication: Features Ethernet 1588, USB OTG with PHY, CAN, UART, SSI, and I2C.
  • Memory and Security: Up to 512KB of flash (ECC), up to 36KB of RAM (ECC or parity), and dual security zones with 128-bit passwords.
  • Interprocessor Communications (IPC): 32 handshaking channels and four channels generating IPC interrupts.
  • Analog and Clocking: High-speed analog subsystem, on-chip crystal oscillator, external clock input, and dynamic PLL ratio changes supported.

Applications

  • Industrial Control Systems: Suitable for advanced closed-loop control applications, including motor control, power conversion, and industrial automation.
  • Automotive Systems: Qualified for automotive applications with AEC Q100 certification, ideal for engine control, transmission control, and other automotive control systems.
  • Medical Devices: Can be used in medical devices requiring high precision and reliability, such as medical imaging and diagnostic equipment.
  • Renewable Energy Systems: Applicable in solar and wind power systems for control and monitoring.

Q & A

  1. What is the core architecture of the F28M35H52C1RFPQ?

    The F28M35H52C1RFPQ features a dual-core architecture with a 32-bit Arm Cortex-M3 CPU for communication and a 32-bit TMS320C28x floating-point CPU for real-time control.

  2. What are the key communication peripherals available on this device?

    The device includes Ethernet 1588, USB OTG with PHY, CAN, UART, SSI, and I2C.

  3. How much memory does the F28M35H52C1RFPQ have?

    It has up to 512KB of flash (ECC), up to 36KB of RAM (ECC or parity), 64KB of shared RAM, and 2KB of IPC Message RAM.

  4. What is the temperature range for the F28M35H52C1RFPQ?

    The temperature range varies by option: T: –40°C to 105°C Junction, S: –40°C to 125°C Junction, Q: –40°C to 125°C Free-Air (AEC Q100 qualification for automotive applications).

  5. What kind of security features does the device offer?

    The device features dual security zones with 128-bit passwords and includes ECC, parity, and code secure memory.

  6. What is the purpose of the Interprocessor Communications (IPC) in this device?

    The IPC provides 32 handshaking channels and four channels generating IPC interrupts to coordinate data transfer through IPC Message RAMs.

  7. What are the key control peripherals available on this device?

    The device includes 9 Enhanced Pulse Width Modulator (ePWM) modules, 6 Enhanced Capture (eCAP) modules, and 3 Enhanced Quadrature Encoder Pulse (eQEP) modules.

  8. Is the F28M35H52C1RFPQ suitable for automotive applications?

    Yes, it is qualified for automotive applications with AEC Q100 certification.

  9. What is the package type of the F28M35H52C1RFPQ?

    The device is packaged in a 144-Pin RFP PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP).

  10. Does the device support dynamic PLL ratio changes?

    Yes, the device supports dynamic Phase-Locked Loop (PLL) ratio changes.

Product Attributes

Core Processor:C28x/ARM® Cortex®-M3
Core Size:32-Bit Dual-Core
Speed:100MHz/150MHz
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, SCI, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:74
Program Memory Size:512KB/512KB
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:136KB
Voltage - Supply (Vcc/Vdd):1.2V, 1.8V, 3.3V
Data Converters:A/D 20x12b
Oscillator Type:- 
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:144-TQFP Exposed Pad
Supplier Device Package:144-HTQFP (20x20)
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Similar Products

Part Number F28M35H52C1RFPQ F28M35H52C1RFPT F28M35H52C1RFPS
Manufacturer Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active
Core Processor C28x/ARM® Cortex®-M3 C28x/ARM® Cortex®-M3 C28x/ARM® Cortex®-M3
Core Size 32-Bit Dual-Core 32-Bit Dual-Core 32-Bit Dual-Core
Speed 100MHz/150MHz 100MHz/150MHz 100MHz/150MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, SCI, SPI, SSI, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, SCI, SPI, SSI, UART/USART, USB, USB OTG CANbus, EBI/EMI, Ethernet, I²C, SCI, SPI, SSI, UART/USART, USB, USB OTG
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 74 74 74
Program Memory Size 512KB/512KB 512KB/512KB 512KB/512KB
Program Memory Type Flash Flash Flash
EEPROM Size - - -
RAM Size 136KB 136KB 136KB
Voltage - Supply (Vcc/Vdd) 1.2V, 1.8V, 3.3V 1.2V, 1.8V, 3.3V 1.2V, 1.8V, 3.3V
Data Converters A/D 20x12b A/D 20x12b A/D 20x12b
Oscillator Type - - -
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TJ) -40°C ~ 125°C (TJ)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 144-TQFP Exposed Pad 144-TQFP Exposed Pad 144-TQFP Exposed Pad
Supplier Device Package 144-HTQFP (20x20) 144-HTQFP (20x20) 144-HTQFP (20x20)

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