PC817X3J000F
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Sharp Microelectronics PC817X3J000F

Manufacturer No:
PC817X3J000F
Manufacturer:
Sharp Microelectronics
Package:
Tube
Description:
OPTOISOLATOR 5KV TRANS 4DIP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The PC817X3J000F is a transistor output optocoupler produced by Sharp Microelectronics. This component is designed to provide electrical isolation between input and output circuits, making it suitable for a variety of applications where signal transmission between different potential and impedance levels is required. The PC817X3J000F features a 4-pin DIP package and is ideal for use in general-purpose photocoupling applications.

Key Specifications

Parameter Symbol Unit Rating
Input Forward Current IF mA 50
Peak Forward Current IFM A 1
Input Forward Voltage VF V 1.2
Collector-Emitter Voltage VCEO V 80
Emitter-Collector Voltage VEC V 6
Collector Current IC mA 50
Current Transfer Ratio (CTR) CTR % 50% to 600% (at IF=5mA, VCE=5V)
Isolation Voltage (rms) Viso(rms) kV 5.0
Operating Temperature Topr °C -30 to +100
Storage Temperature Tstg °C -55 to +125
Soldering Temperature Tsol °C 260 (for 10s)

Key Features

  • 4-pin DIP package with wide-lead spacing and SMT gullwing lead-form options.
  • High collector-emitter voltage (VCEO: 80V).
  • Current transfer ratio (CTR) ranges from 50% to 600% at an input current of 5mA.
  • High isolation voltage between input and output (Viso(rms): 5.0 kV).
  • Lead-free and RoHS directive compliant.
  • Ideal for flow soldering due to double transfer mold package.
  • Noise suppression in switching circuits and signal transmission between circuits of different potentials and impedances.

Applications

  • I/O isolation for Micro Controller Units (MCUs).
  • Noise suppression in switching circuits.
  • Signal transmission between circuits of different potentials and impedances.
  • General-purpose photocoupling applications).

Q & A

  1. What is the package type of the PC817X3J000F?

    The PC817X3J000F is packaged in a 4-pin DIP with wide-lead spacing and SMT gullwing lead-form options).

  2. What is the collector-emitter voltage (VCEO) of the PC817X3J000F?

    The collector-emitter voltage (VCEO) is 80V).

  3. What is the current transfer ratio (CTR) of the PC817X3J000F?

    The current transfer ratio (CTR) ranges from 50% to 600% at an input current of 5mA).

  4. What is the isolation voltage between input and output?

    The isolation voltage between input and output is 5.0 kV (rms)).

  5. Is the PC817X3J000F lead-free and RoHS compliant?

    Yes, the PC817X3J000F is lead-free and RoHS directive compliant).

  6. What are the operating and storage temperature ranges for the PC817X3J000F?

    The operating temperature range is -30°C to +100°C, and the storage temperature range is -55°C to +125°C).

  7. What is the soldering temperature for the PC817X3J000F?

    The soldering temperature is 260°C for 10 seconds).

  8. What are some common applications of the PC817X3J000F?

    Common applications include I/O isolation for MCUs, noise suppression in switching circuits, and signal transmission between circuits of different potentials and impedances).

  9. Is the PC817X3J000F suitable for flow soldering?

    Yes, it is ideal for flow soldering due to its double transfer mold package).

  10. What is the response time of the PC817X3J000F?

    The response time is approximately 18 microseconds).

Product Attributes

Number of Channels:1
Voltage - Isolation:5000Vrms
Current Transfer Ratio (Min):200% @ 5mA
Current Transfer Ratio (Max):400% @ 5mA
Turn On / Turn Off Time (Typ):- 
Rise / Fall Time (Typ):4µs, 3µs
Input Type:DC
Output Type:Transistor
Voltage - Output (Max):80V
Current - Output / Channel:50mA
Voltage - Forward (Vf) (Typ):1.2V
Current - DC Forward (If) (Max):50 mA
Vce Saturation (Max):200mV
Operating Temperature:-30°C ~ 100°C
Mounting Type:Through Hole
Package / Case:4-DIP (0.300", 7.62mm)
Supplier Device Package:4-DIP
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