UJA1169TK/XZ
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NXP USA Inc. UJA1169TK/XZ

Manufacturer No:
UJA1169TK/XZ
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC INTFACE SPECIALIZED 20HVSON
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The UJA1169TK/XZ is a mini high-speed CAN System Basis Chip (SBC) developed by NXP USA Inc. This component is designed to integrate an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver, supporting CAN FD up to 5 Mbit/s. It also includes various features such as a watchdog, a serial peripheral interface (SPI), and a LIMP output, making it a versatile solution for automotive and industrial applications.

Key Specifications

SpecificationDetails
PackageHVSON20 plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals
HS-CAN Transceiver ComplianceISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5
CAN FD SpeedUp to 5 Mbit/s
Integrated Supply3.3 V or 5 V, 250 mA
Standby/Sleep ModeAvailable
WatchdogPresent
Serial Peripheral Interface (SPI)Available
LIMP OutputAvailable

Key Features

  • Mini high-speed CAN system basis chip with integrated HS-CAN transceiver and CAN FD support up to 5 Mbit/s
  • Integrated 3.3 V or 5 V, 250 mA supply
  • Standby and sleep modes for power efficiency
  • Watchdog and SPI interface for enhanced functionality
  • LIMP output for fault indication
  • Compact HVSON20 package for space-saving designs

Applications

The UJA1169TK/XZ is primarily designed for use in automotive and industrial applications where high-speed CAN communication is required. It is suitable for various systems, including vehicle networks, industrial control systems, and other applications that demand reliable and high-speed data transmission.

Q & A

  1. What is the UJA1169TK/XZ? The UJA1169TK/XZ is a mini high-speed CAN System Basis Chip (SBC) developed by NXP USA Inc.
  2. What standards does the HS-CAN transceiver comply with? The HS-CAN transceiver complies with ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 standards.
  3. What is the maximum CAN FD speed supported by the UJA1169TK/XZ? The UJA1169TK/XZ supports CAN FD speeds up to 5 Mbit/s.
  4. What type of integrated supply does the UJA1169TK/XZ have? The UJA1169TK/XZ has an integrated 3.3 V or 5 V, 250 mA supply.
  5. Does the UJA1169TK/XZ have standby and sleep modes? Yes, the UJA1169TK/XZ has standby and sleep modes for power efficiency.
  6. What additional interfaces does the UJA1169TK/XZ support? The UJA1169TK/XZ supports a watchdog and a serial peripheral interface (SPI).
  7. What is the package type of the UJA1169TK/XZ? The UJA1169TK/XZ comes in an HVSON20 plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals.
  8. What is the purpose of the LIMP output in the UJA1169TK/XZ? The LIMP output is used for fault indication.
  9. In which applications is the UJA1169TK/XZ typically used? The UJA1169TK/XZ is typically used in automotive and industrial applications requiring high-speed CAN communication.
  10. Where can I find more detailed documentation for the UJA1169TK/XZ? Detailed documentation, including datasheets and design files, can be found on the NXP Semiconductors website.

Product Attributes

Applications:System Basis Chip
Interface:CAN
Voltage - Supply:5V
Package / Case:20-VFDFN Exposed Pad
Supplier Device Package:20-HVSON (3.5x5.5)
Mounting Type:Surface Mount
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Part Number UJA1169TK/XZ UJA1169ATK/XZ UJA1169LTK/XZ UJA1169TK/3Z UJA1169TK/FZ
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Obsolete Active Active Obsolete Obsolete
Applications System Basis Chip System Basis Chip System Basis Chip System Basis Chip System Basis Chip
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Package / Case 20-VFDFN Exposed Pad 20-VFDFN Exposed Pad 20-VFDFN Exposed Pad 20-VFDFN Exposed Pad 20-VFDFN Exposed Pad
Supplier Device Package 20-HVSON (3.5x5.5) 20-HVSON (3.5x5.5) 20-HVSON (3.5x5.5) 20-HVSON (3.5x5.5) 20-HVSON (3.5x5.5)
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