UJA1169ATK/3Z
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NXP USA Inc. UJA1169ATK/3Z

Manufacturer No:
UJA1169ATK/3Z
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MINI-CAN SYSTEM BASIS CHIP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The UJA1169ATK/3Z is a mini high-speed CAN System Basis Chip (SBC) developed by NXP USA Inc. This chip is part of the UJA1169ATK family, designed to provide reliable and efficient communication in harsh environments, particularly in automotive and industrial applications. It integrates an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver, supporting CAN FD up to 5 Mbit/s. The chip also includes a watchdog, a serial peripheral interface (SPI), and LIMP output, making it a comprehensive solution for system basis applications.

Key Specifications

Parameter Description
Compliance ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5
CAN FD Speed Up to 5 Mbit/s
Integrated Supply 5 V or 3.3 V, 250 mA
Watchdog Present
SPI Present
LIMP Output Present
Standby/Sleep Mode Available with bus and local wake-up capability
Package HVSON-20
Mounting Style SMD/SMT

Key Features

  • Mini High-Speed CAN SBC: Compact and efficient solution for integrating the transceiver into electronic circuits.
  • Optional Partial Networking: Enables reliable and efficient communication in harsh environments.
  • Low-Drop Voltage Regulation: Provides stable power supply to microcontrollers and sensors.
  • Watchdog and SPI: Includes a watchdog and a serial peripheral interface (SPI) for enhanced system control.
  • LIMP Output: Local Interconnect Network (LIN) Physical Interface (LIMP) output for additional functionality.
  • Standby/Sleep Mode: Low quiescent current during standby mode with bus and local wake-up capability.

Applications

  • Automotive Communication Systems: Ideal for systems requiring reliable and efficient communication in automotive environments.
  • Industrial Automation Systems: Suitable for industrial applications where robust communication is essential.
  • Battery-Powered Devices: Efficient power management makes it suitable for battery-powered devices.
  • Sensor-Based Applications: Provides stable power supply for on-board and off-board sensors.

Q & A

  1. What is the UJA1169ATK/3Z used for? The UJA1169ATK/3Z is used for high-speed CAN communication in automotive and industrial applications.
  2. What are the key features of the UJA1169ATK/3Z? Key features include a mini high-speed CAN SBC, optional partial networking, low-drop voltage regulation, watchdog, SPI, and LIMP output.
  3. What is the compliance standard for the UJA1169ATK/3Z? It is compliant with ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5.
  4. What is the maximum CAN FD speed supported by the UJA1169ATK/3Z? It supports CAN FD up to 5 Mbit/s.
  5. What type of package does the UJA1169ATK/3Z come in? It comes in an HVSON-20 package.
  6. Does the UJA1169ATK/3Z have standby and sleep modes? Yes, it has standby and sleep modes with bus and local wake-up capability.
  7. What is the purpose of the watchdog in the UJA1169ATK/3Z? The watchdog is used for system monitoring and reset in case of system failure.
  8. Can the UJA1169ATK/3Z be used in industrial automation systems? Yes, it is suitable for industrial automation systems requiring robust communication.
  9. Is the UJA1169ATK/3Z suitable for battery-powered devices? Yes, it is efficient for battery-powered devices due to its low quiescent current in standby mode.
  10. What is the role of LIMP output in the UJA1169ATK/3Z? The LIMP output is used for Local Interconnect Network (LIN) Physical Interface functionality.

Product Attributes

Applications:System Basis Chip
Interface:CAN, SPI
Voltage - Supply:3V ~ 28V
Package / Case:20-VFDFN Exposed Pad
Supplier Device Package:20-HVSON (3.5x5.5)
Mounting Type:Surface Mount
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$3.65
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Similar Products

Part Number UJA1169ATK/3Z UJA1169ATK/XZ UJA1169ATK/FZ UJA1169TK/3Z
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Obsolete
Applications System Basis Chip System Basis Chip System Basis Chip System Basis Chip
Interface CAN, SPI CAN, SPI CAN, SPI CAN
Voltage - Supply 3V ~ 28V 3V ~ 28V 3V ~ 28V 5V
Package / Case 20-VFDFN Exposed Pad 20-VFDFN Exposed Pad 20-VFDFN Exposed Pad 20-VFDFN Exposed Pad
Supplier Device Package 20-HVSON (3.5x5.5) 20-HVSON (3.5x5.5) 20-HVSON (3.5x5.5) 20-HVSON (3.5x5.5)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount

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