TEF6638HW/V103557
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NXP USA Inc. TEF6638HW/V103557

Manufacturer No:
TEF6638HW/V103557
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC DGTL CHIP AUTO RADIO 100HTQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The TEF6638HW/V103557 is a digital car radio IC manufactured by NXP USA Inc. This component is designed for use in automotive radio systems, providing advanced tuning and reception capabilities. It is packaged in a 100-lead plastic thermal enhanced thin quad flat package (HTQFP100) with a body size of 14 x 14 x 1 mm and an exposed die pad for enhanced thermal performance.

Key Specifications

Specification Details
Manufacturer NXP USA Inc.
Package Type 100-lead HTQFP (Heat Transfer Quad Flat Package)
Package Dimensions 14 x 14 x 1 mm
Exposed Die Pad Yes
RoHS Compliance Yes, compliant with EU RoHS 2011/65/EU, 2015/863
Category RF/IF and RFID - RF Receivers

Key Features

  • Advanced digital tuning capabilities for automotive radio systems.
  • High-performance RF receiver with robust signal processing.
  • Compact 100-lead HTQFP package for efficient board design.
  • Exposed die pad for improved thermal management.
  • Compliant with EU RoHS regulations, ensuring environmental sustainability.

Applications

  • Automotive radio systems: The TEF6638HW/V103557 is specifically designed for use in car radios, providing reliable and high-quality signal reception.
  • Infotainment systems: It can be integrated into various infotainment systems in vehicles to enhance the overall user experience.
  • Other RF applications: Due to its robust RF capabilities, it can also be used in other applications requiring high-performance RF reception.

Q & A

  1. What is the TEF6638HW/V103557 used for?

    The TEF6638HW/V103557 is used in automotive radio systems for advanced digital tuning and reception.

  2. What is the package type of the TEF6638HW/V103557?

    The component is packaged in a 100-lead HTQFP (Heat Transfer Quad Flat Package).

  3. Is the TEF6638HW/V103557 RoHS compliant?

    Yes, it is compliant with EU RoHS 2011/65/EU, 2015/863.

  4. What are the dimensions of the TEF6638HW/V103557 package?

    The package dimensions are 14 x 14 x 1 mm.

  5. Does the TEF6638HW/V103557 have an exposed die pad?

    Yes, it does have an exposed die pad for improved thermal performance.

  6. Where can I find detailed specifications for the TEF6638HW/V103557?

    Detailed specifications can be found in the datasheet available on NXP's official website or through authorized distributors.

  7. What are the typical applications of the TEF6638HW/V103557?

    It is typically used in automotive radio systems and infotainment systems.

  8. How do I ensure the quality of the TEF6638HW/V103557?

    Ensure you purchase from authorized distributors who adhere to stringent quality control measures.

  9. Can the TEF6638HW/V103557 be used in other RF applications?

    Yes, due to its robust RF capabilities, it can be used in other applications requiring high-performance RF reception.

  10. What is the lead time for ordering the TEF6638HW/V103557?

    The lead time can vary depending on the distributor; it is best to check with the supplier for the most current information.

Product Attributes

Frequency:- 
Sensitivity:- 
Data Rate (Max):- 
Modulation or Protocol:- 
Applications:- 
Current - Receiving:- 
Data Interface:- 
Memory Size:- 
Antenna Connector:- 
Features:- 
Voltage - Supply:- 
Operating Temperature:- 
Mounting Type:- 
Package / Case:- 
Supplier Device Package:- 
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Similar Products

Part Number TEF6638HW/V103557 TEF6638HW/V105557
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Active Active
Frequency - -
Sensitivity - -
Data Rate (Max) - -
Modulation or Protocol - -
Applications - -
Current - Receiving - -
Data Interface - -
Memory Size - -
Antenna Connector - -
Features - -
Voltage - Supply - -
Operating Temperature - -
Mounting Type - -
Package / Case - -
Supplier Device Package - -

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