S9S12GN32BMLCR
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NXP USA Inc. S9S12GN32BMLCR

Manufacturer No:
S9S12GN32BMLCR
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MCU 16BIT 32KB FLASH 32LQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The S9S12GN32BMLCR is a 16-bit microcontroller from NXP USA Inc., part of the HCS12 microcontroller family. This device is optimized for low-cost, high-performance applications, particularly in the automotive sector. It features a 12V1 core processor and is known for its robust and reliable operation in various environments.

Key Specifications

Parameter Value
Core Size 16-Bit
Core Processor 12V1
Program Memory Type FLASH
Program Memory Size 32KB (32K x 8)
RAM Size 2K x 8
EEPROM Size 1K x 8
Operating Frequency 25MHz
Voltage - Supply (Vcc/Vdd) 3.13 V ~ 5.5 V
Operating Temperature -40°C ~ 125°C (TA)
Package / Case 32-LQFP (7x7)
Number of I/O 26
Peripherals LVD, POR, PWM, WDT
Connectivity IrDA, LINbus, SCI, SPI
Data Converters A/D 8x10b

Key Features

  • High Performance: The S9S12GN32BMLCR operates at a frequency of up to 25MHz, ensuring high performance in various applications.
  • Low Power Consumption: With a supply voltage range of 3.13 V to 5.5 V, this microcontroller is energy-efficient and suitable for battery-powered devices.
  • Robust Peripherals: It includes peripherals such as Low Voltage Detector (LVD), Power-On Reset (POR), Pulse Width Modulator (PWM), and Watchdog Timer (WDT), enhancing its functionality.
  • Advanced Connectivity: The microcontroller supports various communication protocols including IrDA, LINbus, SCI, and SPI, facilitating seamless communication in complex systems.
  • Reliable Operation: It operates over a wide temperature range of -40°C to 125°C, making it reliable in harsh environments.

Applications

  • Automotive Systems: The S9S12GN32BMLCR is particularly suited for automotive applications due to its robustness and compliance with automotive standards.
  • Industrial Control Systems: Its high performance and reliability make it a good fit for industrial control systems, including motor control and automation.
  • Consumer Electronics: It can be used in various consumer electronics devices that require low power consumption and high performance.
  • Medical Devices: The microcontroller's precision and reliability also make it suitable for use in medical devices.

Q & A

  1. What is the core processor of the S9S12GN32BMLCR?

    The core processor is the 12V1.

  2. What is the maximum operating frequency of the S9S12GN32BMLCR?

    The maximum operating frequency is 25MHz.

  3. What is the program memory size of the S9S12GN32BMLCR?

    The program memory size is 32KB (32K x 8).

  4. What is the RAM size of the S9S12GN32BMLCR?

    The RAM size is 2K x 8.

  5. What are the supported communication protocols?

    The microcontroller supports IrDA, LINbus, SCI, and SPI.

  6. What is the operating temperature range of the S9S12GN32BMLCR?

    The operating temperature range is -40°C to 125°C.

  7. What type of package does the S9S12GN32BMLCR come in?

    The microcontroller comes in a 32-LQFP (7x7) package.

  8. How many I/O pins does the S9S12GN32BMLCR have?

    The microcontroller has 26 I/O pins.

  9. What are some of the peripherals included in the S9S12GN32BMLCR?

    The peripherals include LVD, POR, PWM, and WDT.

  10. What is the supply voltage range for the S9S12GN32BMLCR?

    The supply voltage range is 3.13 V to 5.5 V.

Product Attributes

Core Processor:12V1
Core Size:16-Bit
Speed:25MHz
Connectivity:IrDA, LINbus, SCI, SPI
Peripherals:LVD, POR, PWM, WDT
Number of I/O:26
Program Memory Size:32KB (32K x 8)
Program Memory Type:Flash
EEPROM Size:1K x 8
RAM Size:2K x 8
Voltage - Supply (Vcc/Vdd):3.13V ~ 5.5V
Data Converters:A/D 8x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:32-LQFP
Supplier Device Package:32-LQFP (7x7)
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Similar Products

Part Number S9S12GN32BMLCR S9S12GN32BVLCR S9S12GN32BCLCR S9S12GN32BMLC
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active
Core Processor 12V1 12V1 12V1 12V1
Core Size 16-Bit 16-Bit 16-Bit 16-Bit
Speed 25MHz 25MHz 25MHz 25MHz
Connectivity IrDA, LINbus, SCI, SPI IrDA, LINbus, SCI, SPI IrDA, LINbus, SCI, SPI IrDA, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 26 26 26 26
Program Memory Size 32KB (32K x 8) 32KB (32K x 8) 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type Flash Flash Flash Flash
EEPROM Size 1K x 8 1K x 8 1K x 8 1K x 8
RAM Size 2K x 8 2K x 8 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 3.13V ~ 5.5V 3.13V ~ 5.5V 3.13V ~ 5.5V 3.13V ~ 5.5V
Data Converters A/D 8x10b A/D 8x10b A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 32-LQFP 32-LQFP 32-LQFP 32-LQFP
Supplier Device Package 32-LQFP (7x7) 32-LQFP (7x7) 32-LQFP (7x7) 32-LQFP (7x7)

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