P1012NXN2HFB
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NXP USA Inc. P1012NXN2HFB

Manufacturer No:
P1012NXN2HFB
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MPU Q OR IQ 800MHZ 689TEBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The P1012NXN2HFB is a high-performance microprocessor from NXP USA Inc., part of the QorIQ P1 family. This integrated circuit is designed to offer smart integration and efficient power intelligence, making it suitable for a variety of applications that require advanced processing capabilities and power management.

Key Specifications

ParameterValue
Core Typee500
Operating Frequency [Max]800 MHz
PCIe2
External Memory SupportedDDR2 SDRAM, DDR3 SDRAM
Ambient Operating Temperature-40°C to 105°C
Package TypePBGA689

Key Features

  • High-performance e500 core
  • Advanced power management and efficiency
  • Support for DDR2 and DDR3 SDRAM
  • PCIe 2 interface
  • Wide ambient operating temperature range (-40°C to 105°C)
  • Advanced protection features for robust operation

Applications

The P1012NXN2HFB is versatile and can be used in various applications, including:

  • Power management systems
  • Communication infrastructure
  • Industrial control systems
  • Networking equipment
  • Embedded systems requiring high processing power and efficient power management

Q & A

  1. What is the core type of the P1012NXN2HFB?
    The core type is e500.
  2. What is the maximum operating frequency of the P1012NXN2HFB?
    The maximum operating frequency is 800 MHz.
  3. What types of external memory does the P1012NXN2HFB support?
    The P1012NXN2HFB supports DDR2 SDRAM and DDR3 SDRAM.
  4. What is the PCIe version supported by the P1012NXN2HFB?
    The P1012NXN2HFB supports PCIe 2.
  5. What is the ambient operating temperature range of the P1012NXN2HFB?
    The ambient operating temperature range is -40°C to 105°C.
  6. What package type is the P1012NXN2HFB available in?
    The P1012NXN2HFB is available in a PBGA689 package.
  7. What are some key features of the P1012NXN2HFB?
    Key features include high-performance e500 core, advanced power management, support for DDR2 and DDR3 SDRAM, PCIe 2 interface, and a wide ambient operating temperature range.
  8. In what types of applications is the P1012NXN2HFB commonly used?
    The P1012NXN2HFB is commonly used in power management applications, communication infrastructure, industrial control systems, networking equipment, and other embedded systems requiring high processing power and efficient power management.
  9. Who is the manufacturer of the P1012NXN2HFB?
    The manufacturer is NXP USA Inc.
  10. Where can I find detailed specifications for the P1012NXN2HFB?
    Detailed specifications can be found on the official NXP website, as well as on distributor websites such as Digi-Key and Mouser.

Product Attributes

Core Processor:PowerPC e500v2
Number of Cores/Bus Width:1 Core, 32-Bit
Speed:800MHz
Co-Processors/DSP:Communications; QUICC Engine
RAM Controllers:DDR2, DDR3
Graphics Acceleration:No
Display & Interface Controllers:- 
Ethernet:10/100/1000Mbps (3)
SATA:- 
USB:USB 2.0 + PHY (2)
Voltage - I/O:- 
Operating Temperature:-40°C ~ 105°C (TA)
Security Features:- 
Package / Case:689-BBGA Exposed Pad
Supplier Device Package:689-TEPBGA II (31x31)
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Similar Products

Part Number P1012NXN2HFB P1013NXN2HFB P1011NXN2HFB P1012NXE2HFB P1012NXN2DFB P1012NXN2FFB
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
Core Processor PowerPC e500v2 PowerPC e500v2 PowerPC e500v2 PowerPC e500v2 PowerPC e500v2 PowerPC e500v2
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit 1 Core, 32-Bit
Speed 800MHz 1.055GHz 800MHz 800MHz 800MHz 800MHz
Co-Processors/DSP Communications; QUICC Engine - - Communications; QUICC Engine, Security; SEC 3.3 Communications; QUICC Engine Communications; QUICC Engine
RAM Controllers DDR2, DDR3 DDR2, DDR3 DDR2, DDR3 DDR2, DDR3 DDR2, DDR3 DDR2, DDR3
Graphics Acceleration No No No No No No
Display & Interface Controllers - LCD - - - -
Ethernet 10/100/1000Mbps (3) 10/100/1000Mbps (2) 10/100/1000Mbps (3) 10/100/1000Mbps (3) 10/100/1000Mbps (3) 10/100/1000Mbps (3)
SATA - SATA 3Gbps (2) - - - -
USB USB 2.0 + PHY (2) USB 2.0 + PHY (2) USB 2.0 + PHY (2) USB 2.0 + PHY (2) USB 2.0 + PHY (2) USB 2.0 + PHY (2)
Voltage - I/O - - - - - -
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Security Features - - - Cryptography, Random Number Generator - -
Package / Case 689-BBGA Exposed Pad 689-BBGA Exposed Pad 689-BBGA Exposed Pad 689-BBGA Exposed Pad 689-BBGA Exposed Pad 689-BBGA Exposed Pad
Supplier Device Package 689-TEPBGA II (31x31) 689-TEPBGA II (31x31) 689-TEPBGA II (31x31) 689-TEPBGA II (31x31) 689-TEPBGA II (31x31) 689-TEPBGA II (31x31)

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