MPC555LFMZP40R2
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NXP USA Inc. MPC555LFMZP40R2

Manufacturer No:
MPC555LFMZP40R2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC MCU 32BIT 448KB FLASH 272PBGA
Delivery:
Payment:
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Product Introduction

Overview

The MPC555LFMZP40R2 is a 32-bit microcontroller (MCU) produced by NXP USA Inc. This high-speed MCU is designed primarily for automotive applications, including engine and transmission control, as well as for use in robotics and avionics. It is part of the PowerPC family, known for its robust performance and reliability in demanding environments.

Key Specifications

Parameter Value
Core PowerPC
Operating Frequency 40 MHz
Program Memory 448 KB (448K x 8)
Package Type LQFP (Low Profile Quad Flat Package)
Pins 208
Temperature Range -40°C to 125°C

Key Features

  • High-Speed Processing: The MPC555LFMZP40R2 features a 40 MHz PowerPC core, providing high-performance processing for complex applications.
  • Robust Memory: It includes 448 KB of program memory, ensuring ample storage for application code and data.
  • Advanced Peripherals: The MCU is equipped with various peripherals such as timers, UARTs, and CAN interfaces, making it suitable for a wide range of automotive and industrial applications.
  • Reliability and Durability: Designed to operate in harsh environments, the MCU is capable of withstanding a wide temperature range from -40°C to 125°C.

Applications

  • Automotive Control Systems: Engine control, transmission control, and other automotive systems benefit from the high performance and reliability of the MPC555LFMZP40R2.
  • Robotics and Avionics: The MCU's robust features make it suitable for use in robotics and avionics, where precision and reliability are critical.
  • Industrial Control Systems: It can be used in various industrial control applications requiring high-speed processing and advanced peripherals.

Q & A

  1. What is the core architecture of the MPC555LFMZP40R2?

    The MPC555LFMZP40R2 is based on the PowerPC core architecture.

  2. What is the operating frequency of the MPC555LFMZP40R2?

    The operating frequency of the MPC555LFMZP40R2 is 40 MHz.

  3. How much program memory does the MPC555LFMZP40R2 have?

    The MPC555LFMZP40R2 has 448 KB (448K x 8) of program memory.

  4. What is the package type of the MPC555LFMZP40R2?

    The package type of the MPC555LFMZP40R2 is LQFP (Low Profile Quad Flat Package).

  5. How many pins does the MPC555LFMZP40R2 have?

    The MPC555LFMZP40R2 has 208 pins.

  6. What is the temperature range of the MPC555LFMZP40R2?

    The temperature range of the MPC555LFMZP40R2 is -40°C to 125°C.

  7. What are some common applications of the MPC555LFMZP40R2?

    Common applications include automotive control systems, robotics, avionics, and industrial control systems.

  8. Where can I find detailed specifications and datasheets for the MPC555LFMZP40R2?

    Detailed specifications and datasheets can be found on the NXP Semiconductors website, as well as on other electronic component databases like Alldatasheet and Octopart.

  9. Is the MPC555LFMZP40R2 suitable for high-reliability applications?

    Yes, the MPC555LFMZP40R2 is designed for high-reliability applications and can operate in harsh environments.

  10. What peripherals does the MPC555LFMZP40R2 support?

    The MPC555LFMZP40R2 supports various peripherals such as timers, UARTs, and CAN interfaces.

Product Attributes

Core Processor:PowerPC
Core Size:32-Bit Single-Core
Speed:40MHz
Connectivity:CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:POR, PWM, WDT
Number of I/O:101
Program Memory Size:448KB (448K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:26K x 8
Voltage - Supply (Vcc/Vdd):2.7V ~ 5.5V
Data Converters:A/D 32x10b
Oscillator Type:External
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:272-BBGA
Supplier Device Package:272-PBGA (27x27)
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