MK22FN256VDC12
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NXP USA Inc. MK22FN256VDC12

Manufacturer No:
MK22FN256VDC12
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 256KB FLASH 121BGA
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The MK22FN256VDC12 is a 32-bit microcontroller (MCU) from NXP USA Inc., part of the Kinetis K22 family. These MCUs are optimized for cost-sensitive applications that require low power consumption, flexibility, and high processing efficiency. Based on the Arm® Cortex®-M4 core, this MCU offers a balance of performance and power efficiency, making it suitable for a wide range of applications.

Key Specifications

SpecificationDescriptionValue
CoreArm® Cortex®-M4
Flash Memory256 KB
SRAM256 KB
Clock SpeedUp to 120 MHz
Package121-pin XFBGA
Power Supply Voltage1.71 V to 3.6 V
Input Leakage Current0.002 μA to 0.5 μA (per pin)
Internal Pullup/Pulldown Resistors20 kΩ to 50 kΩ
Communication InterfacesUSB, DSPI, I2C, UART, I2S/SAI
TimersMultiple timers including PIT, FTM, and TPM

Key Features

  • Low Power Consumption: Optimized for low power applications with various power-saving modes.
  • High Performance: 120 MHz Arm® Cortex®-M4 core for efficient processing.
  • Flexible Communication: Includes USB, DSPI, I2C, UART, and I2S/SAI interfaces.
  • Memory and Storage: 256 KB of flash memory and 256 KB of SRAM.
  • Analog Capabilities: 12-bit DAC and voltage reference electrical specifications.
  • Package Options: Available in 121-pin XFBGA package.

Applications

The MK22FN256VDC12 MCU is versatile and can be used in a variety of applications, including:

  • Industrial Automation: For control and monitoring systems.
  • Consumer Electronics: In devices requiring low power and high performance.
  • Medical Devices: For portable and battery-powered medical equipment.
  • Automotive Systems: For various automotive control and monitoring applications.
  • IoT Devices: For connected devices that require efficient processing and low power consumption.

Q & A

  1. What is the core architecture of the MK22FN256VDC12 MCU?
    The MK22FN256VDC12 MCU is based on the Arm® Cortex®-M4 core.
  2. What is the maximum clock speed of the MK22FN256VDC12?
    The maximum clock speed is up to 120 MHz.
  3. How much flash and SRAM memory does the MK22FN256VDC12 have?
    The MCU has 256 KB of flash memory and 256 KB of SRAM.
  4. What are the communication interfaces available on the MK22FN256VDC12?
    The MCU includes USB, DSPI, I2C, UART, and I2S/SAI interfaces.
  5. What is the power supply voltage range for the MK22FN256VDC12?
    The power supply voltage range is from 1.71 V to 3.6 V.
  6. Does the MK22FN256VDC12 support low power modes?
    Yes, it is optimized for low power applications with various power-saving modes.
  7. What is the package type of the MK22FN256VDC12?
    The MCU is available in a 121-pin XFBGA package.
  8. What are some typical applications for the MK22FN256VDC12?
    It can be used in industrial automation, consumer electronics, medical devices, automotive systems, and IoT devices.
  9. How much input leakage current does the MK22FN256VDC12 have?
    The input leakage current is from 0.002 μA to 0.5 μA per pin.
  10. Does the MK22FN256VDC12 have internal pullup/pulldown resistors?
    Yes, it has internal pullup and pulldown resistors ranging from 20 kΩ to 50 kΩ.

Product Attributes

Core Processor:ARM® Cortex®-M4
Core Size:32-Bit Single-Core
Speed:120MHz
Connectivity:I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals:DMA, I²S, LVD, POR, PWM, WDT
Number of I/O:70
Program Memory Size:256KB (256K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:48K x 8
Voltage - Supply (Vcc/Vdd):1.71V ~ 3.6V
Data Converters:A/D 36x16b; D/A 1x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:121-XFBGA
Supplier Device Package:121-BGA (10x10)
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Similar Products

Part Number MK22FN256VDC12 MK24FN256VDC12
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Active Active
Core Processor ARM® Cortex®-M4 ARM® Cortex®-M4
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 120MHz 120MHz
Connectivity I²C, IrDA, SPI, UART/USART, USB, USB OTG I²C, SPI, UART/USART, USB OTG
Peripherals DMA, I²S, LVD, POR, PWM, WDT DMA, I²S, LVD, POR, PWM, WDT
Number of I/O 70 83
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type Flash Flash
EEPROM Size - -
RAM Size 48K x 8 256K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V 1.71V ~ 3.6V
Data Converters A/D 36x16b; D/A 1x12b A/D 37x16b; D/A 2x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 121-XFBGA 121-XFBGA
Supplier Device Package 121-BGA (10x10) 121-XFBGA (8x8)

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