MIMXRT555SFFOCR
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NXP USA Inc. MIMXRT555SFFOCR

Manufacturer No:
MIMXRT555SFFOCR
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
I.MX RT500 CROSSOVER MCU
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MIMXRT555SFFOC is a dual-core microcontroller from NXP USA Inc., part of the i.MX RT500 family. This microcontroller is designed for low-power wearable and consumer IoT applications, combining the efficiency of an Arm Cortex-M33 CPU with the processing capabilities of a Cadence Xtensa Fusion F1 DSP. This crossover MCU is optimized for applications requiring both high-performance processing and low power consumption, making it suitable for a variety of embedded systems.

Key Specifications

SpecificationDetails
ProcessorArm Cortex-M33 CPU and Cadence Xtensa Fusion F1 DSP
Core CountDual-core
FrequencyUp to 200 MHz
ROM192 KB (192K x 8)
Package Type249-FOWLP (7x7 mm)
Power ConsumptionLow power, suitable for wearable and IoT applications

Key Features

  • Dual-Core Architecture: Combines an Arm Cortex-M33 CPU with a Cadence Xtensa Fusion F1 DSP for balanced performance and efficiency.
  • Low Power Consumption: Optimized for wearable and consumer IoT applications where power efficiency is crucial.
  • High-Performance Processing: Capable of operating at frequencies up to 200 MHz.
  • Integrated DSP: The Cadence Xtensa Fusion F1 DSP enhances signal processing capabilities.
  • Compact Packaging: 249-FOWLP (7x7 mm) package for space-constrained designs.

Applications

  • Wearable Devices: Smartwatches, fitness trackers, and other wearable electronics.
  • Consumer IoT: Smart home devices, wireless sensors, and other IoT applications.
  • Industrial Automation: Control systems, monitoring devices, and automation equipment.
  • Medical Devices: Portable medical devices, health monitors, and diagnostic equipment.

Q & A

  1. What is the MIMXRT555SFFOC microcontroller used for? The MIMXRT555SFFOC is used for low-power wearable and consumer IoT applications, offering a balance of high-performance processing and low power consumption.
  2. What type of CPU does the MIMXRT555SFFOC feature? It features an Arm Cortex-M33 CPU combined with a Cadence Xtensa Fusion F1 DSP.
  3. What is the maximum operating frequency of the MIMXRT555SFFOC? The maximum operating frequency is up to 200 MHz.
  4. How much ROM does the MIMXRT555SFFOC have? It has 192 KB (192K x 8) of ROM.
  5. What is the package type of the MIMXRT555SFFOC? The package type is 249-FOWLP (7x7 mm).
  6. Is the MIMXRT555SFFOC suitable for high-performance applications? Yes, it is designed for high-performance processing while maintaining low power consumption.
  7. Can the MIMXRT555SFFOC be used in industrial automation? Yes, it can be used in industrial automation for control systems, monitoring devices, and automation equipment.
  8. Is the MIMXRT555SFFOC compatible with medical devices? Yes, it can be used in portable medical devices, health monitors, and diagnostic equipment.
  9. Where can I find detailed specifications for the MIMXRT555SFFOC? Detailed specifications can be found on the NXP official website, Digi-Key, and other electronic component distributors.
  10. What are the key features of the MIMXRT555SFFOC? Key features include dual-core architecture, low power consumption, high-performance processing, integrated DSP, and compact packaging.

Product Attributes

Core Processor:ARM® Cortex®-M33
Core Size:32-Bit Dual-Core
Speed:200MHz
Connectivity:eMMC/SD/SDIO, I²C, LINbus, SPI, UART/USART, USB
Peripherals:DMA, I²S, LCD, POR, PWM, WDT
Number of I/O:136
Program Memory Size:192KB (192K x 8)
Program Memory Type:ROM
EEPROM Size:- 
RAM Size:5M x 8
Voltage - Supply (Vcc/Vdd):1.71V ~ 3.6V
Data Converters:A/D 10x12b
Oscillator Type:External, Internal
Operating Temperature:-20°C ~ 70°C (TA)
Mounting Type:Surface Mount
Package / Case:249-WFBGA
Supplier Device Package:249-FOWLP (7x7)
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